Frank Wei
Impact in
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- Copper Interconnects and Reliability
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
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- 3D IC and TSV technologies 15
- Electronic Packaging and Soldering Technologies 9
- Integrated Circuits and Semiconductor Failure Analysis 5
- Electromagnetic Compatibility and Noise Suppression 2
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- Advanced Surface Polishing Techniques 7
- Nanofabrication and Lithography Techniques 2
- Co-authors
- Rao Tummala (9 shared papers)Carl V. Thompson (2 shared papers)Christine Hau-Riege (2 shared papers)Vanessa Smet (4 shared papers)Venky Sundaram (6 shared papers)Chee Lip Gan (1 shared paper)Venkatesh Sundaram (2 shared papers)Joost J. Vlassak (1 shared paper)
- Journals
- Journal of Applied Physics (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)Journal of Muscle Research and Cell Motility (1 paper)The McKinsey Quarterly (1 paper)IMAPSource Proceedings (2 papers)
- Partner nations
- United StatesJapanGermany
In The Last Decade
Frank Wei
20 papers receiving 131 citations
Peers
Comparison fields: 5 of 30
- Electronic, Optical and Magnetic Materials 48
- Electrical and Electronic Engineering 115
- Automotive Engineering 10
- Biomedical Engineering 35
- Ophthalmology 5
Countries citing papers authored by Frank Wei
This map shows the geographic impact of Frank Wei's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Frank Wei with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Frank Wei more than expected).
Fields of papers citing papers by Frank Wei
This network shows the impact of papers produced by Frank Wei. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Frank Wei. The network helps show where Frank Wei may publish in the future.
Co-authors
The 25 scholars most cited alongside Frank Wei, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 23 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2008 | 25 | |
| 2 | 2015 | 15 | |
| 3 | 2017 | 13 | |
| 4 | 2008 | 12 | |
| 5 | 2018 | 12 | |
| 6 | 2017 | 11 | |
| 7 | 2004 | 11 | |
| 8 | 1987 | 8 | |
| 9 | 2017 | 8 | |
| 10 | 2018 | 7 | |
| 11 | 2017 | 5 | |
| 12 | 2017 | 5 | |
| 13 | 2004 | 4 | |
| 14 | 2016 | 4 | |
| 15 | Winning China's Consumer Market in the 21st Century | 1996 | 2 |
| 16 | Thermal Solutions for Surface Mount Power Devices | 2020 | 2 |
| 17 | 2014 | 2 | |
| 18 | 2016 | 2 | |
| 19 | 2015 | 1 | |
| 20 | 2024 | 1 |
About Frank Wei
Frank Wei is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials and Computational Mechanics, having authored 23 papers that have together received 151 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (15 papers), Electronic Packaging and Soldering Technologies (9 papers), Advanced Surface Polishing Techniques (7 papers), Integrated Circuits and Semiconductor Failure Analysis (5 papers), Copper Interconnects and Reliability (5 papers), Laser Material Processing Techniques (2 papers), Nanofabrication and Lithography Techniques (2 papers) and Electromagnetic Compatibility and Noise Suppression (2 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (48 citations), Electrical and Electronic Engineering (115 citations), Automotive Engineering (10 citations), Biomedical Engineering (35 citations) and Ophthalmology (5 citations). Frank Wei has collaborated with scholars based in United States, Japan and Germany. Frequent co-authors include Rao Tummala, Carl V. Thompson, Christine Hau-Riege, Vanessa Smet, Venky Sundaram, Chee Lip Gan, Venkatesh Sundaram, Joost J. Vlassak, Fuhan Liu and Scott McCann. Their work appears in journals such as Journal of Applied Physics, IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of Muscle Research and Cell Motility, The McKinsey Quarterly and IMAPSource Proceedings.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.