Chih-Pin Hung
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- 3D IC and TSV technologies 26
- Electronic Packaging and Soldering Technologies 24
- Electromagnetic Compatibility and Noise Suppression 14
- Microwave Engineering and Waveguides 11
- Radio Frequency Integrated Circuit Design 6
- Semiconductor materials and devices 6
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- Copper Interconnects and Reliability 7
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- Heat Transfer and Optimization 3
- Co-authors
- Chen-Chao WangTzyy‐Sheng HorngDavid TarngJenn‐Ming SongHo‐Ming TongChien‐Hsiang HuangYing-Ta ChiuChin‐Li Kao
- Cited by
- Electrical and Electronic EngineeringElectronic, Optical and Magnetic MaterialsHardware and Architecture
- Journals
- IEEE Transactions on Microwave Theory and Techniques (1 paper)Applied Thermal Engineering (1 paper)Japanese Journal of Applied Physics (1 paper)
- Partner nations
- TaiwanJapanUnited States
In The Last Decade
Chih-Pin Hung
42 papers receiving 268 citations
Peers
Comparison fields: 5 of 24
- Electrical and Electronic Engineering 268
- Electronic, Optical and Magnetic Materials 32
- Hardware and Architecture 9
- Aerospace Engineering 33
- Mechanical Engineering 44
Countries citing papers authored by Chih-Pin Hung
This map shows the geographic impact of Chih-Pin Hung's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chih-Pin Hung with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chih-Pin Hung more than expected).
Fields of papers citing papers by Chih-Pin Hung
This network shows the impact of papers produced by Chih-Pin Hung. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chih-Pin Hung. The network helps show where Chih-Pin Hung may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Chih-Pin Hung, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 0 | |
| 2 | 2025 | 3 | |
| 3 | 2024 | 2 | |
| 4 | 2024 | 1 | |
| 5 | 2024 | 0 | |
| 6 | 2024 | 4 | |
| 7 | 2024 | 3 | |
| 8 | 2023 | 6 | |
| 9 | 2022 | 10 | |
| 10 | 2018 | 1 | |
| 11 | 2017 | 1 | |
| 12 | 2017 | 2 | |
| 13 | 2015 | 1 | |
| 14 | 2013 | 1 | |
| 15 | 2013 | 3 | |
| 16 | 2012 | 6 | |
| 17 | 2012 | 3 | |
| 18 | 2011 | 1 | |
| 19 | 2008 | 1 | |
| 20 | 2007 | 3 |
About Chih-Pin Hung
Chih-Pin Hung is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Aerospace Engineering, having authored 50 papers that have together received 291 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (26 papers), Electronic Packaging and Soldering Technologies (24 papers), Electromagnetic Compatibility and Noise Suppression (14 papers), Microwave Engineering and Waveguides (11 papers), Copper Interconnects and Reliability (7 papers), Radio Frequency Integrated Circuit Design (6 papers), Semiconductor materials and devices (6 papers) and Heat Transfer and Optimization (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (268 citations), Electronic, Optical and Magnetic Materials (32 citations) and Hardware and Architecture (9 citations). Chih-Pin Hung has collaborated with scholars based in Taiwan, Japan and United States. Frequent co-authors include Chen-Chao Wang, Tzyy‐Sheng Horng, David Tarng, Jenn‐Ming Song, Ho‐Ming Tong, Chien‐Hsiang Huang, Ying-Ta Chiu, Chin‐Li Kao, D. De Zutter and Ruey‐Beei Wu. Their work appears in journals such as IEEE Transactions on Microwave Theory and Techniques, Applied Thermal Engineering and Japanese Journal of Applied Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.