Fuhan Liu

1.7k total citations
124 papers, 1.3k citations indexed

About

Fuhan Liu is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Fuhan Liu has authored 124 papers receiving a total of 1.3k indexed citations (citations by other indexed papers that have themselves been cited), including 111 papers in Electrical and Electronic Engineering, 32 papers in Biomedical Engineering and 18 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Fuhan Liu's work include 3D IC and TSV technologies (64 papers), Electronic Packaging and Soldering Technologies (44 papers) and Semiconductor Lasers and Optical Devices (31 papers). Fuhan Liu is often cited by papers focused on 3D IC and TSV technologies (64 papers), Electronic Packaging and Soldering Technologies (44 papers) and Semiconductor Lasers and Optical Devices (31 papers). Fuhan Liu collaborates with scholars based in United States, Japan and China. Fuhan Liu's co-authors include Rao Tummala, Venky Sundaram, Madhavan Swaminathan, Qiao Chen, P. Markondeya Raj, Nitesh Kumbhat, Vijay Sukumaran, Atom O. Watanabe, Sung-Hwan Min and Tapobrata Bandyopadhyay and has published in prestigious journals such as Chemical Engineering Journal, Optics Express and Journal of Applied Polymer Science.

In The Last Decade

Fuhan Liu

116 papers receiving 1.2k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Fuhan Liu United States 19 1.1k 289 142 134 102 124 1.3k
P. Markondeya Raj United States 20 1.4k 1.2× 343 1.2× 247 1.7× 332 2.5× 76 0.7× 193 1.7k
Jong Heon Kim South Korea 18 568 0.5× 99 0.3× 89 0.6× 53 0.4× 93 0.9× 67 829
Yong-Hae Kim South Korea 16 716 0.6× 230 0.8× 125 0.9× 39 0.3× 118 1.2× 69 996
Jun Mo China 13 324 0.3× 173 0.6× 145 1.0× 53 0.4× 39 0.4× 28 649
Sung-Hyeon Park South Korea 13 430 0.4× 275 1.0× 58 0.4× 33 0.2× 47 0.5× 33 624
Kwang‐Seong Choi South Korea 18 790 0.7× 256 0.9× 33 0.2× 28 0.2× 143 1.4× 102 1.1k
Xifeng Wang China 11 193 0.2× 196 0.7× 160 1.1× 97 0.7× 75 0.7× 29 578
Zhiyi Zhang China 13 400 0.4× 163 0.6× 41 0.3× 100 0.7× 74 0.7× 50 693
Serguei Stoukatch Belgium 13 645 0.6× 234 0.8× 54 0.4× 23 0.2× 26 0.3× 54 787
Steve Greedy United Kingdom 12 373 0.3× 132 0.5× 261 1.8× 225 1.7× 109 1.1× 85 760

Countries citing papers authored by Fuhan Liu

Since Specialization
Citations

This map shows the geographic impact of Fuhan Liu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fuhan Liu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fuhan Liu more than expected).

Fields of papers citing papers by Fuhan Liu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Fuhan Liu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fuhan Liu. The network helps show where Fuhan Liu may publish in the future.

Co-authorship network of co-authors of Fuhan Liu

This figure shows the co-authorship network connecting the top 25 collaborators of Fuhan Liu. A scholar is included among the top collaborators of Fuhan Liu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Fuhan Liu. Fuhan Liu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
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Liu, Fuhan, et al.. (2024). The Electrochemical and Combustion Properties of HAN‐ECSP Using Cu2O/Cu Electrode. Propellants Explosives Pyrotechnics. 50(1).
3.
Liu, Fuhan, et al.. (2023). A Critical Review of Lithography Methodologies and Impacts of Topography on 2.5-D/3-D Interposers. IEEE Transactions on Components Packaging and Manufacturing Technology. 13(3). 291–299. 11 indexed citations
4.
Liu, Fuhan, et al.. (2023). Ultralow-Loss Substrate-Integrated Waveguides in Alumina Ribbon Ceramic Substrates for 75–170 GHz Wireless Applications. IEEE Microwave and Wireless Technology Letters. 33(10). 1415–1418. 2 indexed citations
5.
Chen, Rui, et al.. (2022). Mechanical Characterization of Ultra-Thin, Flexible Glass Substrates for RF Applications. IEEE Transactions on Components Packaging and Manufacturing Technology. 12(9). 1465–1473. 3 indexed citations
6.
Liu, Fuhan, et al.. (2022). Under COVID-19 the Transformation of Enterprise Strategy — A Case Study of Disney. International Journal of Innovation Management and Technology. 13(3). 64–70.
7.
Liu, Fuhan, et al.. (2020). Cointegration of Single-Mode Waveguides and Embedded Electrical Interconnects for High-Bandwidth Communications. IEEE Transactions on Components Packaging and Manufacturing Technology. 10(3). 393–399. 8 indexed citations
8.
9.
10.
Liu, Fuhan, Yaxin Zhang, Guang Yu, Yanjun Hou, & Haijun Niu. (2018). Electrochromism of novel triphenylamine‐containing polyamide polymers. Journal of Applied Polymer Science. 136(15). 11 indexed citations
11.
Kumbhat, Nitesh, et al.. (2011). Low cost, chip-last embedded ICs in thin organic cores. 43–47. 9 indexed citations
12.
Min, Sung-Hwan, et al.. (2010). Design and fabrication of bandpass filters in glass interposer with through-package-vias (TPV). 530–535. 34 indexed citations
13.
Sukumaran, Vijay, Qiao Chen, Fuhan Liu, et al.. (2010). Through-package-via formation and metallization of glass interposers. 557–563. 101 indexed citations
14.
Liu, Fuhan, et al.. (2009). 45 Degree Polymer Micromirror Integration for Board-Level Three-Dimensional Optical Interconnects. Optics Express. 17(13). 10514–10514. 32 indexed citations
15.
Hegde, S., Fuhan Liu, Gee‐Kung Chang, & Suresh K. Sitaraman. (2007). Optical loss changes in siloxane polymer waveguides during thermal curing. Journal of Applied Polymer Science. 106(4). 2320–2327. 6 indexed citations
16.
Guidotti, Daniel, Lixi Wan, Yin-Jung Chang, et al.. (2007). Hybrid Integration of End-to-End Optical Interconnects on Printed Circuit Boards. IEEE Transactions on Components and Packaging Technologies. 30(4). 708–715. 11 indexed citations
17.
Liu, Fuhan, et al.. (2006). Advances in high density interconnect substrate and printed wiring board technology. 2. 307–313. 9 indexed citations
18.
Dong, Hai, et al.. (2004). Magnetic nanocomposite for high Q embedded inductor. 171–174. 11 indexed citations
19.
Liu, Fuhan, Venky Sundaram, G. Edward White, & Rao Tummala. (2000). Ultra-fine photoresist image formation for next generation high-density PWB substrate. 23(3). 467–472. 5 indexed citations
20.
Liu, Fuhan, et al.. (1990). Nitrogen temperature superconducting ring experiment. American Journal of Physics. 58(3). 211–218. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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