Fuhan Liu

1.7k total citations
124 papers, 1.3k citations indexed

About

Fuhan Liu is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Fuhan Liu has authored 124 papers receiving a total of 1.3k indexed citations (citations by other indexed papers that have themselves been cited), including 111 papers in Electrical and Electronic Engineering, 32 papers in Biomedical Engineering and 18 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Fuhan Liu's work include 3D IC and TSV technologies (64 papers), Electronic Packaging and Soldering Technologies (44 papers) and Semiconductor Lasers and Optical Devices (31 papers). Fuhan Liu is often cited by papers focused on 3D IC and TSV technologies (64 papers), Electronic Packaging and Soldering Technologies (44 papers) and Semiconductor Lasers and Optical Devices (31 papers). Fuhan Liu collaborates with scholars based in United States, Japan and China. Fuhan Liu's co-authors include Rao Tummala, Venky Sundaram, Madhavan Swaminathan, Qiao Chen, P. Markondeya Raj, Nitesh Kumbhat, Vijay Sukumaran, Atom O. Watanabe, Sung-Hwan Min and Tapobrata Bandyopadhyay and has published in prestigious journals such as Chemical Engineering Journal, Optics Express and Journal of Applied Polymer Science.

In The Last Decade

Fuhan Liu

116 papers receiving 1.2k citations

Peers

Countries citing papers authored by Fuhan Liu

Since Specialization

Citations

This map shows the geographic impact of Fuhan Liu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fuhan Liu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fuhan Liu more than expected).

Fields of papers citing papers by Fuhan Liu

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Fuhan Liu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fuhan Liu. The network helps show where Fuhan Liu may publish in the future.

Co-authorship network of co-authors of Fuhan Liu

This figure shows the co-authorship network connecting the top 25 collaborators of Fuhan Liu. A scholar is included among the top collaborators of Fuhan Liu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Fuhan Liu. Fuhan Liu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Title	Journal	Authors	Indexed citations
1	Electrocatalytic oxidation for hydroxyl radicals generation: Exploring the role of an electrode-induced interphase on electronically controlled solid propellants	Chemical Engineering Journal	Bin Wang, Fuhan Liu et al.	0
2	The Electrochemical and Combustion Properties of HAN‐ECSP Using Cu₂O/Cu Electrode	Propellants Explosives Pyrotechnics	Fuhan Liu, Jian Zhang et al.	0
3	A Critical Review of Lithography Methodologies and Impacts of Topography on 2.5-D/3-D Interposers	IEEE Transactions on Components Packaging and Manufacturing Technology	Fuhan Liu, Mohanalingam Kathaperumal et al.	11
4	Ultralow-Loss Substrate-Integrated Waveguides in Alumina Ribbon Ceramic Substrates for 75–170 GHz Wireless Applications	IEEE Microwave and Wireless Technology Letters	Fuhan Liu, Madhavan Swaminathan et al.	2
5	Mechanical Characterization of Ultra-Thin, Flexible Glass Substrates for RF Applications	IEEE Transactions on Components Packaging and Manufacturing Technology	Rui Chen, Martin Letz et al.	3
6	Under COVID-19 the Transformation of Enterprise Strategy — A Case Study of Disney	International Journal of Innovation Management and Technology	Fuhan Liu et al.	0
7	Cointegration of Single-Mode Waveguides and Embedded Electrical Interconnects for High-Bandwidth Communications	IEEE Transactions on Components Packaging and Manufacturing Technology	Fuhan Liu, Mohanalingam Kathaperumal et al.	8
8	Advances in High Performance RDL Technologies for Enabling IO Density of 500 IOs/mm/layer and 8-μm IO Pitch Using Low-k Dielectrics		Fuhan Liu, Siddharth Ravichandran et al.	16
9	Evaluation of Fine-Pitch Routing Capabilities of Advanced Dielectric Materials for High Speed Panel-RDL in 2.5D Interposer and Fan-Out Packages		P. Markondeya Raj, Atsushi Kubo et al.	16
10	Electrochromism of novel triphenylamine‐containing polyamide polymers	Journal of Applied Polymer Science	Fuhan Liu, Yaxin Zhang et al.	11
11	Low cost, chip-last embedded ICs in thin organic cores		Nitesh Kumbhat, Fuhan Liu et al.	9
12	Design and fabrication of bandpass filters in glass interposer with through-package-vias (TPV)		Sung-Hwan Min, Venky Sundaram et al.	34
13	Through-package-via formation and metallization of glass interposers		Vijay Sukumaran, Qiao Chen et al.	101
14	45 Degree Polymer Micromirror Integration for Board-Level Three-Dimensional Optical Interconnects	Optics Express	Fuhan Liu, Ali Adibi et al.	32
15	Optical loss changes in siloxane polymer waveguides during thermal curing	Journal of Applied Polymer Science	S. Hegde, Fuhan Liu et al.	6
16	Hybrid Integration of End-to-End Optical Interconnects on Printed Circuit Boards	IEEE Transactions on Components and Packaging Technologies	Daniel Guidotti, Lixi Wan et al.	11
17	Advances in high density interconnect substrate and printed wiring board technology		Fuhan Liu, V. Sundaram et al.	9
18	Magnetic nanocomposite for high Q embedded inductor		Hai Dong, Fuhan Liu et al.	11
19	Ultra-fine photoresist image formation for next generation high-density PWB substrate		Fuhan Liu, Venky Sundaram et al.	5
20	Nitrogen temperature superconducting ring experiment	American Journal of Physics	Fuhan Liu, Peter Heller et al.	4

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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