J. Y. Wu

524 total citations
51 papers, 354 citations indexed

About

J. Y. Wu is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, J. Y. Wu has authored 51 papers receiving a total of 354 indexed citations (citations by other indexed papers that have themselves been cited), including 46 papers in Electrical and Electronic Engineering, 17 papers in Biomedical Engineering and 12 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in J. Y. Wu's work include Semiconductor materials and devices (28 papers), Integrated Circuits and Semiconductor Failure Analysis (17 papers) and Advanced Surface Polishing Techniques (16 papers). J. Y. Wu is often cited by papers focused on Semiconductor materials and devices (28 papers), Integrated Circuits and Semiconductor Failure Analysis (17 papers) and Advanced Surface Polishing Techniques (16 papers). J. Y. Wu collaborates with scholars based in Taiwan, United States and Japan. J. Y. Wu's co-authors include Chien‐Chung Huang, Shunpei Yamazaki, Rao Huang, Kiyoshi Katō, Cheng‐Liang Hsu, Cheng‐Li Lin, Daisuke Matsubayashi, Wen‐Chin Lin, Xiang Li and Tri‐Rung Yew and has published in prestigious journals such as Journal of The Electrochemical Society, IEEE Transactions on Electron Devices and Japanese Journal of Applied Physics.

In The Last Decade

J. Y. Wu

44 papers receiving 339 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
J. Y. Wu Taiwan 11 311 120 92 44 44 51 354
Wanling Deng China 13 459 1.5× 91 0.8× 97 1.1× 32 0.7× 31 0.7× 79 545
Yohei Otani Japan 11 235 0.8× 106 0.9× 204 2.2× 61 1.4× 39 0.9× 38 315
Michael Belyansky United States 12 191 0.6× 52 0.4× 101 1.1× 30 0.7× 16 0.4× 29 262
Matthias Wietstruck Germany 11 419 1.3× 147 1.2× 89 1.0× 46 1.0× 16 0.4× 95 478
King Jien Chui Singapore 8 296 1.0× 66 0.6× 32 0.3× 35 0.8× 19 0.4× 28 321
Xuefei Qin China 10 210 0.7× 102 0.8× 50 0.5× 17 0.4× 78 1.8× 38 302
P.J. George India 11 280 0.9× 59 0.5× 202 2.2× 70 1.6× 29 0.7× 30 343
T. Sato Japan 9 305 1.0× 111 0.9× 41 0.4× 74 1.7× 37 0.8× 18 367
King-Jien Chui Singapore 9 318 1.0× 86 0.7× 59 0.6× 88 2.0× 28 0.6× 40 354
Ryan Davies United States 13 362 1.2× 51 0.4× 170 1.8× 45 1.0× 112 2.5× 17 508

Countries citing papers authored by J. Y. Wu

Since Specialization
Citations

This map shows the geographic impact of J. Y. Wu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Y. Wu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Y. Wu more than expected).

Fields of papers citing papers by J. Y. Wu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. Y. Wu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Y. Wu. The network helps show where J. Y. Wu may publish in the future.

Co-authorship network of co-authors of J. Y. Wu

This figure shows the co-authorship network connecting the top 25 collaborators of J. Y. Wu. A scholar is included among the top collaborators of J. Y. Wu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J. Y. Wu. J. Y. Wu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
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Liao, Yingjie, Yizhou Wu, J. Y. Wu, et al.. (2025). Transfer-printed flexible near-infrared organic photodetectors for monitoring muscle contraction. Surfaces and Interfaces. 71. 106874–106874. 1 indexed citations
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Hsieh, Ping-Hsuan, S. H. Lin, Yang Ni, et al.. (2018). FinFET IO Device Performance Gain with Heated Implantation. 106–109.
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Onuki, Tatsuya, Hikaru Tamura, Satoru Okamoto, et al.. (2016). Embedded memory and ARM Cortex-M0 core using 60-nm C-axis aligned crystalline indium-gallium-zinc oxide FET integrated with 65-nm Si CMOS. 1–2. 24 indexed citations
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Lin, Yu‐Min, et al.. (2014). Optimized copper chemical mechanical polishing with CVD Co barrier at 14nm technology node. 63–65. 8 indexed citations
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Huang, Rao, et al.. (2013). Investigation of aluminum film properties and microstructure for replacement metal gate application. Microelectronic Engineering. 106. 56–62. 8 indexed citations
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Hsu, Chia Wei, et al.. (2013). Defect reduction of replacement metal gate aluminum chemical mechanical planarization at 28nm technology node. Microelectronic Engineering. 112. 121–125. 14 indexed citations
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Chan, Mansun, J. Y. Wu, E. R. Hsieh, et al.. (2012). Suppressing Device Variability by Cryogenic Implant for 28-nm Low-Power SoC Applications. IEEE Electron Device Letters. 33(10). 1444–1446. 7 indexed citations
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Hsu, Cheng‐Liang, et al.. (2011). CMP process development for the via-middle 3D TSV applications at 28nm technology node. Microelectronic Engineering. 92. 29–33. 43 indexed citations
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Chan, Mansun, et al.. (2011). Alleviating eSiGe Strain Relaxation Using Cryo-Implantation. Electrochemical and Solid-State Letters. 14(11). H467–H467. 5 indexed citations
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Wu, Chien‐Hung, et al.. (2011). Effects of La2O3 Capping Layers Prepared by Different ALD Lanthanum Precursors on Flatband Voltage Tuning and EOT Scaling in TiN/HfO2/SiO2/Si MOS Structures. Journal of The Electrochemical Society. 158(4). H447–H447. 8 indexed citations
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Wu, J. Y., et al.. (2005). An Asymmetric Two-Side Program With One-Side Read (ATPOR) Device for MultiBit Per Cell MLC Nitride-Trapping Flash Memories. IEEE Transactions on Electron Devices. 52(12). 2648–2653. 3 indexed citations
20.
Yang, Mingsheng, et al.. (2003). The investigation of electroplating deposited copper films for advanced VLSI interconnection. 65–67. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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