S.L. Shue

415 total citations
21 papers, 143 citations indexed

About

S.L. Shue is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, S.L. Shue has authored 21 papers receiving a total of 143 indexed citations (citations by other indexed papers that have themselves been cited), including 19 papers in Electrical and Electronic Engineering, 16 papers in Electronic, Optical and Magnetic Materials and 7 papers in Materials Chemistry. Recurrent topics in S.L. Shue's work include Copper Interconnects and Reliability (16 papers), Semiconductor materials and devices (12 papers) and Metal and Thin Film Mechanics (6 papers). S.L. Shue is often cited by papers focused on Copper Interconnects and Reliability (16 papers), Semiconductor materials and devices (12 papers) and Metal and Thin Film Mechanics (6 papers). S.L. Shue collaborates with scholars based in Taiwan, United States and Netherlands. S.L. Shue's co-authors include Chun-Hsing Shih, Yu‐Lin Kuo, Mong-Song Liang, Ming-Hsien Tsai, Chiapyng Lee, Jing‐Cheng Lin, Jia‐Min Shieh, Bau‐Tong Dai, Mei‐Hui Tsai and Ying-Lang Wang and has published in prestigious journals such as Journal of The Electrochemical Society, Thin Solid Films and Japanese Journal of Applied Physics.

In The Last Decade

S.L. Shue

20 papers receiving 136 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
S.L. Shue Taiwan	7	116	79	48	31	26	21	143
Stewart Leith Switzerland	5	108 0.9×	101 1.3×	37 0.8×	20 0.6×	13 0.5×	12	161
Spyridon Skordas United States	7	93 0.8×	30 0.4×	58 1.2×	10 0.3×	27 1.0×	25	148
S. Siddiqui United States	7	137 1.2×	32 0.4×	31 0.6×	12 0.4×	22 0.8×	18	151
V. Terzieva Belgium	10	248 2.1×	67 0.8×	103 2.1×	19 0.6×	69 2.7×	21	275
L. Prabhu United States	10	242 2.1×	27 0.3×	72 1.5×	21 0.7×	28 1.1×	17	256
You-Seok Suh United States	12	264 2.3×	49 0.6×	63 1.3×	36 1.2×	57 2.2×	20	283
Shibesh Dutta Belgium	10	278 2.4×	171 2.2×	99 2.1×	27 0.9×	100 3.8×	18	324
Wu Xue-Wei China	8	36 0.3×	47 0.6×	50 1.0×	11 0.4×	59 2.3×	17	143
Anyan Du China	8	179 1.5×	34 0.4×	70 1.5×	8 0.3×	59 2.3×	36	213
Judy Cha United States	3	75 0.6×	45 0.6×	35 0.7×	6 0.2×	11 0.4×	7	119

Countries citing papers authored by S.L. Shue

Since Specialization

Citations

This map shows the geographic impact of S.L. Shue's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S.L. Shue with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S.L. Shue more than expected).

Fields of papers citing papers by S.L. Shue

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by S.L. Shue. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S.L. Shue. The network helps show where S.L. Shue may publish in the future.

Co-authorship network of co-authors of S.L. Shue

This figure shows the co-authorship network connecting the top 25 collaborators of S.L. Shue. A scholar is included among the top collaborators of S.L. Shue based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with S.L. Shue. S.L. Shue is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Ni, I‐Chih, Shuwei Li, Yu‐Chen Chan, et al.. (2023). Intercalated Multilayer Graphene with Ultra Low Resistance for Next-Generation Interconnects. ACS Applied Nano Materials. 6(12). 10680–10686. 3 indexed citations

Ni, I‐Chih, Shuwei Li, Yu‐Chen Chan, et al.. (2023). Improving the Electromigration Life of Advanced Interconnects through Graphene Capping. ACS Applied Nano Materials. 6(13). 12479–12485. 6 indexed citations

Ni, I‐Chih, Shuwei Li, Yu‐Chen Chan, et al.. (2021). Low-temperature synthesis of high-quality graphene by controlling the carbon-hydrogen ratio of the precursor. Nano Express. 3(1). 15003–15003. 4 indexed citations

Yang, Shin‐Yi, et al.. (2017). Ultra-thin ALD-MnN barrier for low resistance advanced interconnect technology. 1–3. 2 indexed citations

Tsai, Ching‐Hui, et al.. (2017). Advanced patterning approaches for Cu/Low-k interconnects. 1–3. 2 indexed citations

Chan, Yu‐Chen, et al.. (2016). Low-via-resistance and low-cost PVD-TiZrN barrier for Cu/low-K interconnects. 174–176.

Singh, Sunil Kumar, et al.. (2011). Low damage etch approach for next generation Cu interconnect. 3. 1–3. 2 indexed citations

Chen, Hsien‐Wei, et al.. (2009). Challenges of Low Effective-K approaches for future Cu interconnect. va1. 17–20. 2 indexed citations

Shue, S.L., et al.. (2009). Low capacitance approaches for 22nm generation Cu interconnect. 240. 51–56. 3 indexed citations

10.

Wan, C.C., et al.. (2007). Electrochemical Investigation of Pd-Free Electroless Co-Based Capping Layers on Cu Surfaces. Journal of The Electrochemical Society. 155(1). D62–D62. 3 indexed citations

11.

Wan, C.C., Y.Y. Wang, Chun-Hsing Shih, et al.. (2006). Characterization of Pd-free electroless Co-based cap selectively deposited on Cu surface via borane-based reducing agent. Thin Solid Films. 515(3). 1107–1111. 17 indexed citations

12.

Kuo, Yu‐Lin, et al.. (2004). Diffusion of Copper in Titanium Zirconium Nitride Thin Films. Electrochemical and Solid-State Letters. 7(3). C35–C35. 26 indexed citations

13.

Kuo, Yu‐Lin, Chiapyng Lee, S.L. Shue, et al.. (2004). Growth of (Ti,Zr)N Films on Si by DC Reactive Sputtering of TiZr in N[sub 2]/Ar Gas Mixtures. Journal of The Electrochemical Society. 151(3). C176–C176. 10 indexed citations

14.

Kuo, Yu‐Lin, Chiapyng Lee, Jing‐Cheng Lin, et al.. (2003). Characteristics of DC Reactively Sputtered (Ti,Zr)N Thin Films as Diffusion Barriers for Cu Metallization. Electrochemical and Solid-State Letters. 6(9). C123–C123. 8 indexed citations

15.

Satyanarayana, S.V., et al.. (2003). Via first dual damascene integration of nanoporous ultra low-k material. 48–50. 1 indexed citations

16.

Lin, Jason, R. Augur, S.L. Shue, et al.. (2003). CVD barriers for Cu with nanoporous ultra low-k: integration and reliability. 21–23. 3 indexed citations

17.

Lin, J.-C., et al.. (2002). The evaluation of the diffusion barrier performance of reactively sputtered TaN/sub x/ layers for copper metallization. 191–193. 2 indexed citations

18.

Tsai, Ming-Hsien, et al.. (2002). Reliability of dual damascene Cu metallization. 214–216. 9 indexed citations

19.

Tsai, Ming-Hsien, R. Augur, V. Blaschke, et al.. (2001). Electromigration reliability of dual damascene Cu/CVD SiOC interconnects. 266–268. 8 indexed citations

20.

Song, Liwei, et al.. (1991). C-Axis Oriented YBa₂Cu₃O_6.8 Films on Amorphous Silicate Glasses Using Laser Deposition. Japanese Journal of Applied Physics. 30(4A). L585–L585. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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