V. Blaschke

921 total citations
37 papers, 670 citations indexed

About

V. Blaschke is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Computer Networks and Communications. According to data from OpenAlex, V. Blaschke has authored 37 papers receiving a total of 670 indexed citations (citations by other indexed papers that have themselves been cited), including 32 papers in Electrical and Electronic Engineering, 16 papers in Electronic, Optical and Magnetic Materials and 8 papers in Computer Networks and Communications. Recurrent topics in V. Blaschke's work include Copper Interconnects and Reliability (16 papers), Semiconductor materials and devices (16 papers) and Electronic Packaging and Soldering Technologies (14 papers). V. Blaschke is often cited by papers focused on Copper Interconnects and Reliability (16 papers), Semiconductor materials and devices (16 papers) and Electronic Packaging and Soldering Technologies (14 papers). V. Blaschke collaborates with scholars based in United States, Germany and Netherlands. V. Blaschke's co-authors include Paul S. Ho, E.T. Ogawa, Ki‐Don Lee, Friedrich K. Jondral, Patrick Justison, Ennis T. Ogawa, Dylan F. Williams, Michael D. Janezic, David Howard and Robert Havemann and has published in prestigious journals such as Applied Physics Letters, IEEE Transactions on Microwave Theory and Techniques and IEEE Transactions on Electron Devices.

In The Last Decade

V. Blaschke

36 papers receiving 613 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
V. Blaschke United States	12	617	352	80	52	51	37	670
V. Zieren Netherlands	15	381 0.6×	73 0.2×	77 1.0×	55 1.1×	39 0.8×	36	498
Injun Hwang South Korea	13	515 0.8×	294 0.8×	40 0.5×	34 0.7×	19 0.4×	36	715
K. F. Dombrowski Germany	10	213 0.3×	38 0.1×	44 0.6×	58 1.1×	22 0.4×	23	310
Ih-Chin Chen United States	10	957 1.6×	121 0.3×	16 0.2×	47 0.9×	13 0.3×	23	987
Jinhui Chen China	9	168 0.3×	196 0.6×	75 0.9×	19 0.4×	11 0.2×	16	415
J. Sievert Germany	16	543 0.9×	784 2.2×	17 0.2×	32 0.6×	15 0.3×	60	879
M. Miller United States	13	528 0.9×	126 0.4×	14 0.2×	97 1.9×	7 0.1×	42	656
Ali Soltani Tehrani Sweden	11	513 0.8×	69 0.2×	19 0.2×	37 0.7×	27 0.5×	28	636
M.S.P. Lucas United States	7	301 0.5×	265 0.8×	23 0.3×	28 0.5×	81 1.6×	19	390
Chang-Jin Kang South Korea	12	248 0.4×	39 0.1×	25 0.3×	65 1.3×	58 1.1×	42	326

Countries citing papers authored by V. Blaschke

Since Specialization

Citations

This map shows the geographic impact of V. Blaschke's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by V. Blaschke with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites V. Blaschke more than expected).

Fields of papers citing papers by V. Blaschke

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by V. Blaschke. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by V. Blaschke. The network helps show where V. Blaschke may publish in the future.

Co-authorship network of co-authors of V. Blaschke

This figure shows the co-authorship network connecting the top 25 collaborators of V. Blaschke. A scholar is included among the top collaborators of V. Blaschke based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with V. Blaschke. V. Blaschke is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Blaschke, V., et al.. (2013). A SP9T cellular antenna switch in 2.5 V CMOS thin-film SOI. 144–146. 8 indexed citations

Blaschke, V., et al.. (2013). Test structure and analysis for accurate RF-characterization of tungsten through silicon via (TSV) grounding devices. 33–36. 3 indexed citations

Kar-Roy, A., David Howard, Edward Preisler, et al.. (2010). SiGe BiCMOS manufacturing platform for mmWave applications. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 7837. 783707–783707. 2 indexed citations

Blaschke, V., et al.. (2009). A Cognitive Radio Receiver Supporting Wide-Band Sensing. Wireless Sensor Network. 1(3). 123–134. 3 indexed citations

Blaschke, V., et al.. (2008). A Cognitive Radio Receiver Supporting Wide-Band Sensing. 499–503. 24 indexed citations

Blaschke, V., et al.. (2008). Opportunistic WiMAX–GSM coexistence. IET Communications. 2(6). 837–845. 7 indexed citations

Blaschke, V., et al.. (2007). Wireless Interoperability for Security - WINTSEC. Repository KITopen (Karlsruhe Institute of Technology). 1 indexed citations

Blaschke, V. & James Victory. (2007). Accurate Inductance De-embedding Technique for Scalable Inductor Models. 51. 248–252. 5 indexed citations

Blaschke, V. & Friedrich K. Jondral. (2006). A Concept for a standard-independent Cognitive Radio Terminal. European Wireless Conference. 1–5. 1 indexed citations

10.

Blaschke, V., Stefan Nagel, & Friedrich K. Jondral. (2006). Mechanisms for the Adaptation of the Physical Layer in a Cognitive Radio. 43–46. 5 indexed citations

11.

Blaschke, V. & James Victory. (2006). A Scalable Model Methodology for Octagonal Differential and Single-Ended Inductors. 717–720. 13 indexed citations

12.

Blaschke, V., M. Matloubian, Cheng Yao, et al.. (2005). A Broad-Band Lumped Element Analytic Model Incorporating Skin Effect and Substrate Loss for Inductors and Inductor Like Components for Silicon Technology Performance Assessment and RFIC Design. IEEE Transactions on Electron Devices. 52(7). 1429–1441. 25 indexed citations

13.

Lu, Xiaoyu, et al.. (2003). Electromigration study of Cu/low k dual-damascene interconnects. 322–326. 17 indexed citations

14.

Ho, Paul S., et al.. (2003). Electromigration reliability of Cu interconnects and effects of low K dielectrics. 47. 741–744. 2 indexed citations

15.

Janezic, Michael D., et al.. (2003). Permittivity characterization of low-k thin films from transmission-line measurements. IEEE Transactions on Microwave Theory and Techniques. 51(1). 132–136. 70 indexed citations

16.

Lu, Xia, et al.. (2002). Electromigration in Submicron Dual-damascene Cu/low-k Interconnects. MRS Proceedings. 716.

17.

Ogawa, E.T., et al.. (2002). Statistics of electromigration early failures in Cu/oxide dual-damascene interconnects. 341–349. 33 indexed citations

18.

Ogawa, E.T., Ki‐Don Lee, V. Blaschke, & Paul S. Ho. (2002). Electromigration reliability issues in dual-damascene Cu interconnections. IEEE Transactions on Reliability. 51(4). 403–419. 191 indexed citations

19.

Tsai, Ming-Hsien, R. Augur, V. Blaschke, et al.. (2001). Electromigration reliability of dual damascene Cu/CVD SiOC interconnects. 266–268. 8 indexed citations

20.

Ortega, Roméo, et al.. (1999). Influence of Cu Seed Deposition Temperature on Electroplated Cu Texture Formation in Damascene Structures. MRS Proceedings. 564. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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