V. Blaschke
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- Radio Frequency Integrated Circuit Design
- Microwave Engineering and Waveguides
- 3D IC and TSV technologies
- Microwave and Dielectric Measurement Techniques
Papers in
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- Semiconductor materials and devices 16
- Electronic Packaging and Soldering Technologies 14
- Radio Frequency Integrated Circuit Design 9
- 3D IC and TSV technologies 5
- Electromagnetic Compatibility and Noise Suppression 4
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- Copper Interconnects and Reliability 16
- Co-authors
- Paul S. Ho (11 shared papers)E.T. Ogawa (6 shared papers)Ki‐Don Lee (3 shared papers)Friedrich K. Jondral (8 shared papers)Patrick Justison (4 shared papers)Ennis T. Ogawa (5 shared papers)Dylan F. Williams (1 shared paper)Michael D. Janezic (1 shared paper)
- Journals
- Applied Physics Letters (2 papers)IEEE Transactions on Reliability (1 paper)Journal of Electronic Materials (1 paper)IEEE Transactions on Microwave Theory and Techniques (1 paper)Journal of materials research/Pratt's guide to venture capital sources (1 paper)
- Partner nations
- United StatesGermanyTaiwan
In The Last Decade
V. Blaschke
36 papers receiving 613 citations
Peers
Comparison fields: 5 of 38
- Electronic, Optical and Magnetic Materials 352
- Electrical and Electronic Engineering 617
- Computer Networks and Communications 80
- Mechanics of Materials 51
- Hardware and Architecture 12
Countries citing papers authored by V. Blaschke
This map shows the geographic impact of V. Blaschke's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by V. Blaschke with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites V. Blaschke more than expected).
Fields of papers citing papers by V. Blaschke
This network shows the impact of papers produced by V. Blaschke. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by V. Blaschke. The network helps show where V. Blaschke may publish in the future.
Co-authors
The 25 scholars most cited alongside V. Blaschke, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 37 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2002 | 191 | |
| 2 | 2003 | 70 | |
| 3 | 2001 | 68 | |
| 4 | 2001 | 50 | |
| 5 | 2007 | 40 | |
| 6 | 2002 | 33 | |
| 7 | 2003 | 26 | |
| 8 | 2005 | 25 | |
| 9 | 2008 | 24 | |
| 10 | 2003 | 17 | |
| 11 | 2006 | 13 | |
| 12 | 2000 | 13 | |
| 13 | 2013 | 8 | |
| 14 | 2001 | 8 | |
| 15 | 2013 | 8 | |
| 16 | 2002 | 7 | |
| 17 | 2008 | 7 | |
| 18 | 2011 | 7 | |
| 19 | 2010 | 7 | |
| 20 | 2006 | 5 |
About V. Blaschke
V. Blaschke is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Computer Networks and Communications, Atomic and Molecular Physics, and Optics and Computational Mechanics, having authored 37 papers that have together received 670 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (16 papers), Semiconductor materials and devices (16 papers), Electronic Packaging and Soldering Technologies (14 papers), Radio Frequency Integrated Circuit Design (9 papers), Cognitive Radio Networks and Spectrum Sensing (7 papers), 3D IC and TSV technologies (5 papers), Wireless Communication Networks Research (4 papers) and Electromagnetic Compatibility and Noise Suppression (4 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (352 citations), Electrical and Electronic Engineering (617 citations), Computer Networks and Communications (80 citations), Mechanics of Materials (51 citations) and Hardware and Architecture (12 citations). V. Blaschke has collaborated with scholars based in United States, Germany and Taiwan. Frequent co-authors include Paul S. Ho, E.T. Ogawa, Ki‐Don Lee, Friedrich K. Jondral, Patrick Justison, Ennis T. Ogawa, Dylan F. Williams, Michael D. Janezic, David Howard and Robert Havemann. Their work appears in journals such as Applied Physics Letters, IEEE Transactions on Reliability, Journal of Electronic Materials, IEEE Transactions on Microwave Theory and Techniques and Journal of materials research/Pratt's guide to venture capital sources.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.