Chuantong Chen
About
In The Last Decade
Chuantong Chen
180 papers receiving 3.4k citations
Hit Papers
Peers
Comparison fields: 5 of 86
- Electrical and Electronic Engineering 2.3k
- Mechanical Engineering 2.1k
- Materials Chemistry 533
- Mechanics of Materials 486
- Electronic, Optical and Magnetic Materials 360
Countries citing papers authored by Chuantong Chen
This map shows the geographic impact of Chuantong Chen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chuantong Chen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chuantong Chen more than expected).
Fields of papers citing papers by Chuantong Chen
This network shows the impact of papers produced by Chuantong Chen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chuantong Chen. The network helps show where Chuantong Chen may publish in the future.
Co-authorship network of co-authors of Chuantong Chen
This figure shows the co-authorship network connecting the top 25 collaborators of Chuantong Chen. A scholar is included among the top collaborators of Chuantong Chen based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chuantong Chen. Chuantong Chen is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 0 | |
| 3 | 0 | |
| 4 | 1 | |
| 5 | 1 | |
| 6 | 3 | |
| 7 | 5 | |
| 8 | 7 | |
| 9 | 3 | |
| 10 | 1 | |
| 11 | 3 | |
| 12 | 7 | |
| 13 | 6 | |
| 14 | 13 | |
| 15 | 0 | |
| 16 | 2 | |
| 17 | 34 | |
| 18 | Highly Reliable Package using Cu Particles Sinter Paste for Next Generation Power Devices | 3 |
| 19 | 50 | |
| 20 | Thermal conductivity and interface thermal resistance evaluation of DBC/DBA in power die attach modules | 2 |
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.