L.C. Tsao

2.8k total citations
80 papers, 2.4k citations indexed

About

L.C. Tsao is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Materials Chemistry. According to data from OpenAlex, L.C. Tsao has authored 80 papers receiving a total of 2.4k indexed citations (citations by other indexed papers that have themselves been cited), including 63 papers in Mechanical Engineering, 45 papers in Electrical and Electronic Engineering and 16 papers in Materials Chemistry. Recurrent topics in L.C. Tsao's work include Electronic Packaging and Soldering Technologies (41 papers), 3D IC and TSV technologies (26 papers) and Aluminum Alloys Composites Properties (25 papers). L.C. Tsao is often cited by papers focused on Electronic Packaging and Soldering Technologies (41 papers), 3D IC and TSV technologies (26 papers) and Aluminum Alloys Composites Properties (25 papers). L.C. Tsao collaborates with scholars based in Taiwan, China and Netherlands. L.C. Tsao's co-authors include Shih‐Ying Chang, Tung‐Han Chuang, Cong‐Hui Huang, Mingjie Wu, Long Feng, Wenyu Sun, C.W. Chen, Chia-Wei Huang, Jik Chang Leong and Chaojun Fang and has published in prestigious journals such as Materials Science and Engineering A, Corrosion Science and Journal of Alloys and Compounds.

In The Last Decade

L.C. Tsao

79 papers receiving 2.4k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
L.C. Tsao Taiwan 28 1.9k 1.5k 470 379 199 80 2.4k
Zhiwu Xu China 23 1.4k 0.7× 468 0.3× 628 1.3× 337 0.9× 334 1.7× 92 1.9k
Zhidong Xia China 23 1.2k 0.6× 1.3k 0.9× 196 0.4× 131 0.3× 264 1.3× 83 1.7k
Daquan Yu China 24 1.3k 0.7× 2.5k 1.6× 313 0.7× 232 0.6× 287 1.4× 205 2.7k
Shuaihang Pan United States 26 1.7k 0.9× 228 0.1× 581 1.2× 697 1.8× 516 2.6× 84 2.3k
Jusheng Ma China 16 883 0.5× 587 0.4× 236 0.5× 418 1.1× 1.3k 6.3× 28 2.0k
Hang Li Seet Singapore 22 1.2k 0.6× 251 0.2× 263 0.6× 316 0.8× 190 1.0× 74 1.6k
Jiuchun Yan China 34 2.5k 1.3× 1.0k 0.7× 952 2.0× 683 1.8× 176 0.9× 128 3.1k
Xuesong Leng China 19 574 0.3× 329 0.2× 196 0.4× 269 0.7× 120 0.6× 72 948
Yo-Lun Yang Taiwan 14 873 0.5× 720 0.5× 735 1.6× 676 1.8× 113 0.6× 61 1.8k
Jianling Yue China 24 347 0.2× 292 0.2× 433 0.9× 551 1.5× 319 1.6× 77 1.5k

Countries citing papers authored by L.C. Tsao

Since Specialization
Citations

This map shows the geographic impact of L.C. Tsao's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by L.C. Tsao with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites L.C. Tsao more than expected).

Fields of papers citing papers by L.C. Tsao

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by L.C. Tsao. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by L.C. Tsao. The network helps show where L.C. Tsao may publish in the future.

Co-authorship network of co-authors of L.C. Tsao

This figure shows the co-authorship network connecting the top 25 collaborators of L.C. Tsao. A scholar is included among the top collaborators of L.C. Tsao based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with L.C. Tsao. L.C. Tsao is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Tsao, L.C., et al.. (2024). Joining of SiO2 glass and substrate using In49Sn active solder in air. Journal of Materials Science Materials in Electronics. 35(1).
2.
Tsao, L.C., et al.. (2021). Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper. Advances in Materials Science and Engineering. 2021(1). 1 indexed citations
3.
Tsao, L.C.. (2020). Effect of Heat Treatment Conditions on the Mechanical Properties and Machinability of Ti15SnxCu Alloys. Materials Research. 23(3). 1 indexed citations
4.
Tsao, L.C., et al.. (2018). Effects of Sn additions on microstructure and corrosion resistance of heat-treated Ti–Cu–Sn titanium alloys. Corrosion Engineering Science and Technology The International Journal of Corrosion Processes and Corrosion Control. 53(4). 252–258. 7 indexed citations
5.
Tsao, L.C., et al.. (2017). Influences of argon plasma cleaning on the die-shear force of chip and copper/polyimide flexible substrate assembly using a non-conductive film. Journal of the Chinese Institute of Engineers. 40(8). 669–677. 2 indexed citations
6.
Tsao, L.C., et al.. (2016). Active soldering of aluminum–graphite composite to aluminum using Sn3.5Ag4Ti0.5Cu active filler. International Journal of Materials Research (formerly Zeitschrift fuer Metallkunde). 107(9). 860–866. 3 indexed citations
7.
Tsao, L.C., et al.. (2014). Effect of 0.5 wt% nano-TiO2 addition into low-Ag Sn0.3Ag0.7Cu solder on the intermetallic growth with Cu substrate during isothermal aging. Journal of Materials Science Materials in Electronics. 26(3). 1858–1865. 24 indexed citations
8.
Tsao, L.C., et al.. (2013). Formation of ultrafine structure in as cast Ti7CuXSn alloys. Materials Science and Technology. 29(12). 1529–1536. 9 indexed citations
9.
Tsao, L.C.. (2013). Interfacial structure and fracture behavior of 6061 Al and MAO-6061 Al direct active soldered with Sn–Ag–Ti active solder. Materials & Design (1980-2015). 56. 318–324. 24 indexed citations
10.
Tsao, L.C.. (2012). Basic Electrochemical Behavior of Ti-7Cu Alloys for Medical Applications. Acta Physica Polonica A. 122(3). 561–564. 13 indexed citations
11.
Chang, Shih‐Ying, L.C. Tsao, Mingjie Wu, & C. W. Chen. (2011). The morphology and kinetic evolution of intermetallic compounds at Sn–Ag–Cu solder/Cu and Sn–Ag–Cu-0.5Al2O3 composite solder/Cu interface during soldering reaction. Journal of Materials Science Materials in Electronics. 23(1). 100–107. 33 indexed citations
12.
Tsao, L.C., et al.. (2011). Age hardening reaction of the Al0.3CrFe1.5MnNi0.5 high entropy alloy. Materials & Design (1980-2015). 36. 854–858. 79 indexed citations
13.
Tsao, L.C., et al.. (2011). Study of interfacial reactions between Sn3.5Ag0.5Cu composite alloys and Cu substrate. Microelectronic Engineering. 88(9). 2964–2969. 39 indexed citations
14.
Tsao, L.C., Mingjie Wu, & Shih‐Ying Chang. (2011). Effect of TiO2 nanoparticles on the microstructure and bonding strengths of Sn0.7Cu composite solder BGA packages with immersion Sn surface finish. Journal of Materials Science Materials in Electronics. 23(3). 681–687. 36 indexed citations
15.
Tsao, L.C., et al.. (2010). Electrochemical behavior of a new Sn3.5Ag0.5Cu composite solder. 1013–1017. 6 indexed citations
16.
Tsao, L.C.. (2010). Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering. Journal of Alloys and Compounds. 509(5). 2326–2333. 90 indexed citations
17.
Tsao, L.C. & Shih‐Ying Chang. (2009). Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder. Materials & Design (1980-2015). 31(2). 990–993. 169 indexed citations
18.
Tsao, L.C., et al.. (2008). Fabrication and Characterization of Electro-Active Polymer for Flexible Tactile Sensing Array. Key engineering materials. 381-382. 391–394. 4 indexed citations
19.
Tsao, L.C., et al.. (2007). Intermetallic Reactions in Reflowed and Aged Sn-58Bi BGA Packages with Au/Ni/Cu Pads. Journal of Materials Engineering and Performance. 17(1). 134–140. 12 indexed citations
20.
Chang, Shih‐Ying, et al.. (2003). Morphology and kinetics of discontinuous precipitation and dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C alloy. Metallurgical and Materials Transactions A. 34(1). 25–31. 7 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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