M.O. Alam
Impact in
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Mechanical Engineering top 2%
- Advanced Welding Techniques Analysis
- Intermetallics and Advanced Alloy Properties
- Aluminum Alloys Composites Properties
Papers in
-
- Electronic Packaging and Soldering Technologies 47
- 3D IC and TSV technologies 30
- Integrated Circuits and Semiconductor Failure Analysis 5
- Journals
- Microelectronics Reliability (9 papers)Journal of Electronic Materials (6 papers)Chemistry of Materials (3 papers)Journal of materials research/Pratt's guide to venture capital sources (3 papers)Journal of Applied Physics (3 papers)
- Partner nations
- Hong KongUnited KingdomUnited States
In The Last Decade
M.O. Alam
52 papers receiving 1.4k citations
Peers
Comparison fields: 5 of 52
- Electrical and Electronic Engineering 1.4k
- Mechanical Engineering 784
- General Materials Science 56
- Mechanics of Materials 170
- Electronic, Optical and Magnetic Materials 116
Countries citing papers authored by M.O. Alam
This map shows the geographic impact of M.O. Alam's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M.O. Alam with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M.O. Alam more than expected).
Fields of papers citing papers by M.O. Alam
This network shows the impact of papers produced by M.O. Alam. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M.O. Alam. The network helps show where M.O. Alam may publish in the future.
Co-authorship network
The 25 scholars most cited alongside M.O. Alam, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2013 | 13 | |
| 2 | 2012 | 3 | |
| 3 | 2012 | 56 | |
| 4 | 2011 | 123 | |
| 5 | 2009 | 9 | |
| 6 | 2008 | 13 | |
| 7 | 2007 | 16 | |
| 8 | 2007 | 11 | |
| 9 | 2006 | 47 | |
| 10 | 2006 | 13 | |
| 11 | 2006 | 41 | |
| 12 | 2005 | 2 | |
| 13 | 2005 | 44 | |
| 14 | 2005 | 9 | |
| 15 | 2004 | 16 | |
| 16 | 2004 | 3 | |
| 17 | 2003 | 60 | |
| 18 | 2003 | 23 | |
| 19 | 2003 | 17 | |
| 20 | 2003 | 50 |
About M.O. Alam
M.O. Alam is a scholar working on General Materials Science, Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials and Industrial and Manufacturing Engineering, having authored 52 papers that have together received 1.5k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (47 papers), 3D IC and TSV technologies (30 papers), Advanced Welding Techniques Analysis (14 papers), Intermetallics and Advanced Alloy Properties (12 papers), Integrated Circuits and Semiconductor Failure Analysis (5 papers), Thermal properties of materials (4 papers), Adhesion, Friction, and Surface Interactions (4 papers) and Copper Interconnects and Reliability (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.4k citations), Mechanical Engineering (784 citations), General Materials Science (56 citations), Mechanics of Materials (170 citations) and Electronic, Optical and Magnetic Materials (116 citations). M.O. Alam has collaborated with scholars based in Hong Kong, United Kingdom and United States. Frequent co-authors include Y.C. Chan, Y.C. Chan, Bin Wu, K. N. Tu, Y. C. Chan, K. N. Tu, K.C. Hung, C. Bailey, W. Jillek and Hau Ping Chan. Their work appears in journals such as Microelectronics Reliability, Journal of Electronic Materials, Chemistry of Materials, Journal of materials research/Pratt's guide to venture capital sources and Journal of Applied Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.