Y.C. Chan
Impact in
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- General Materials Science top 0.5%
Papers in
-
- Electronic Packaging and Soldering Technologies 73
- 3D IC and TSV technologies 50
- Semiconductor materials and devices 10
- Integrated Circuits and Semiconductor Failure Analysis 9
- Journals
- Journal of Electronic Materials (11 papers)Microelectronics Reliability (11 papers)Journal of Materials Science Materials in Electronics (9 papers)IEEE Transactions on Advanced Packaging (6 papers)Journal of Alloys and Compounds (5 papers)
- Partner nations
- Hong KongUnited KingdomChina
In The Last Decade
Y.C. Chan
108 papers receiving 2.4k citations
Peers
Comparison fields: 5 of 76
- Electrical and Electronic Engineering 2.2k
- General Materials Science 103
- Mechanical Engineering 1.2k
- Mechanics of Materials 301
- Ceramics and Composites 60
Countries citing papers authored by Y.C. Chan
This map shows the geographic impact of Y.C. Chan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Y.C. Chan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Y.C. Chan more than expected).
Fields of papers citing papers by Y.C. Chan
This network shows the impact of papers produced by Y.C. Chan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Y.C. Chan. The network helps show where Y.C. Chan may publish in the future.
Co-authors
The 25 scholars most cited alongside Y.C. Chan, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2016 | 66 | |
| 2 | 2016 | 1 | |
| 3 | 2012 | 24 | |
| 4 | 2010 | 10 | |
| 5 | 2008 | 48 | |
| 6 | 2006 | 10 | |
| 7 | 2004 | 16 | |
| 8 | 2004 | 3 | |
| 9 | 2002 | 5 | |
| 10 | 2002 | 3 | |
| 11 | 2002 | 23 | |
| 12 | 2002 | 104 | |
| 13 | 2001 | 5 | |
| 14 | 2000 | 10 | |
| 15 | 1999 | 6 | |
| 16 | 1998 | 5 | |
| 17 | 1997 | 2 | |
| 18 | 1996 | 10 | |
| 19 | 1996 | 23 | |
| 20 | 1994 | 6 |
About Y.C. Chan
Y.C. Chan is a scholar working on Electrical and Electronic Engineering, General Materials Science, Mechanical Engineering, Ceramics and Composites and Mechanics of Materials, having authored 113 papers that have together received 2.5k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (73 papers), 3D IC and TSV technologies (50 papers), Advanced Welding Techniques Analysis (12 papers), Intermetallics and Advanced Alloy Properties (11 papers), Semiconductor materials and devices (10 papers), Integrated Circuits and Semiconductor Failure Analysis (9 papers), Copper Interconnects and Reliability (9 papers) and Aluminum Alloys Composites Properties (8 papers). The work is most often cited by research in Electrical and Electronic Engineering (2.2k citations), General Materials Science (103 citations), Mechanical Engineering (1.2k citations), Mechanics of Materials (301 citations) and Ceramics and Composites (60 citations). Y.C. Chan has collaborated with scholars based in Hong Kong, United Kingdom and China. Frequent co-authors include J.K.L. Lai, M.O. Alam, A.C.K. So, P.L. Tu, K.C. Yung, Yi Li, Asit Kumar Gain, K.C. Hung, Ahmed Sharif and C. Bailey. Their work appears in journals such as Journal of Electronic Materials, Microelectronics Reliability, Journal of Materials Science Materials in Electronics, IEEE Transactions on Advanced Packaging and Journal of Alloys and Compounds.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.