Yanwei Dai

1.2k total citations
102 papers, 854 citations indexed

About

Yanwei Dai is a scholar working on Mechanical Engineering, Mechanics of Materials and Electrical and Electronic Engineering. According to data from OpenAlex, Yanwei Dai has authored 102 papers receiving a total of 854 indexed citations (citations by other indexed papers that have themselves been cited), including 57 papers in Mechanical Engineering, 54 papers in Mechanics of Materials and 47 papers in Electrical and Electronic Engineering. Recurrent topics in Yanwei Dai's work include Fatigue and fracture mechanics (37 papers), Numerical methods in engineering (27 papers) and Electronic Packaging and Soldering Technologies (25 papers). Yanwei Dai is often cited by papers focused on Fatigue and fracture mechanics (37 papers), Numerical methods in engineering (27 papers) and Electronic Packaging and Soldering Technologies (25 papers). Yanwei Dai collaborates with scholars based in China, United States and United Kingdom. Yanwei Dai's co-authors include Fei Qin, Tong An, Yinghua Liu, Pei Chen, Zhiying Chen, Yanpeng Gong, Yuh J. Chao, Shuai Zhao, Lixiang Zhang and Yanning Li and has published in prestigious journals such as Environmental Pollution, IEEE Transactions on Power Electronics and Materials Science and Engineering A.

In The Last Decade

Yanwei Dai

93 papers receiving 840 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Yanwei Dai China 18 396 395 334 137 100 102 854
Fusheng Wang China 14 185 0.5× 267 0.7× 72 0.2× 62 0.5× 140 1.4× 55 672
S. Dixon United Kingdom 20 746 1.9× 944 2.4× 122 0.4× 204 1.5× 165 1.6× 53 1.2k
Sang‐Woo Kim South Korea 17 186 0.5× 322 0.8× 212 0.6× 74 0.5× 267 2.7× 92 884
Lijian Yang China 14 411 1.0× 145 0.4× 164 0.5× 57 0.4× 115 1.1× 88 688
I. Bajsić Slovenia 17 150 0.4× 356 0.9× 130 0.4× 334 2.4× 140 1.4× 52 695
Prashant Kumar India 13 315 0.8× 282 0.7× 212 0.6× 239 1.7× 123 1.2× 54 741
Santhakumar Sampath South Korea 13 199 0.5× 299 0.8× 102 0.3× 62 0.5× 116 1.2× 27 507
Yue Huang China 17 230 0.6× 102 0.3× 152 0.5× 147 1.1× 35 0.3× 63 1.1k
Fabio Botta Italy 13 86 0.2× 71 0.2× 97 0.3× 95 0.7× 156 1.6× 58 533
A. Abbassi Iran 17 540 1.4× 108 0.3× 109 0.3× 344 2.5× 64 0.6× 42 909

Countries citing papers authored by Yanwei Dai

Since Specialization
Citations

This map shows the geographic impact of Yanwei Dai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yanwei Dai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yanwei Dai more than expected).

Fields of papers citing papers by Yanwei Dai

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yanwei Dai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yanwei Dai. The network helps show where Yanwei Dai may publish in the future.

Co-authorship network of co-authors of Yanwei Dai

This figure shows the co-authorship network connecting the top 25 collaborators of Yanwei Dai. A scholar is included among the top collaborators of Yanwei Dai based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yanwei Dai. Yanwei Dai is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Dai, Yanwei, et al.. (2025). A dual-scale stochastic analysis framework for creep failure considering microstructural randomness. International Journal of Plasticity. 190. 104366–104366. 2 indexed citations
2.
Zhao, Libo, Yanwei Dai, & Fei Qin. (2024). Deep learning assisted prediction on main factors influencing shear strength of sintered nano Ag-Al joints under high temperature aging. Engineering Failure Analysis. 167. 109028–109028. 3 indexed citations
3.
Dai, Yanwei, et al.. (2024). Pre-notch and pre-crack size effects on T-peel fracture behaviors of SAC305 solder joints. Theoretical and Applied Fracture Mechanics. 131. 104397–104397. 1 indexed citations
4.
Dai, Yanwei, et al.. (2024). Mode I fracture of sintered nano-silver doped with nickel-coated multiwall carbon nanotube. Materials Science in Semiconductor Processing. 174. 108171–108171. 2 indexed citations
5.
Chen, Zhiying, Yanwei Dai, & Yinghua Liu. (2024). Structural fatigue crack propagation simulation and life prediction based on improved XFEM-VCCT. Engineering Fracture Mechanics. 310. 110519–110519. 7 indexed citations
6.
Chen, Zhiying, Yanwei Dai, & Yinghua Liu. (2024). Crack propagation simulation and overload fatigue life prediction via enhanced physics-informed neural networks. International Journal of Fatigue. 186. 108382–108382. 22 indexed citations
7.
Guan, Yanan, et al.. (2023). Summer O3 pollution cycle characteristics and VOCs sources in a central city of Beijing-Tianjin-Hebei area, China. Environmental Pollution. 323. 121293–121293. 39 indexed citations
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Wang, Song, Ge Shi, Libo Zhao, et al.. (2023). Modelling and Optimization of Continual Laser Joining Processes for Silicon Aluminum Alloy in Microwave Devices. Crystals. 13(4). 631–631. 3 indexed citations
11.
Dai, Yanwei, et al.. (2023). Bondline thickness effect on fracture and cohesive zone model of sintered nano silver adhesive joints under end notched flexure tests. Fatigue & Fracture of Engineering Materials & Structures. 46(6). 2062–2079. 8 indexed citations
12.
Dai, Yanwei, et al.. (2023). Nanoindentation Elastoplastic and Creep Behaviors of Sintered Nano-Silver Doped with Nickel-Modified Multiwall Carbon Nanotube Filler. Journal of Electronic Materials. 53(2). 1035–1057. 8 indexed citations
13.
Qin, Fei, et al.. (2022). Effect of Capped Cu Layer on Protrusion Behaviors of Through Silicon via Copper (TSV-Cu) Under Double Annealing Conditions: Comparative Study. IEEE Transactions on Device and Materials Reliability. 23(1). 89–98. 7 indexed citations
14.
Dai, Yanwei, et al.. (2022). Three-dimensional sharp V-notch stress intensity factor and strain energy rate density under creeping conditions. Engineering Fracture Mechanics. 272. 108700–108700. 2 indexed citations
15.
Chen, Zhiying, et al.. (2022). Numerical prediction based on XFEM for mixed-mode crack growth path and fatigue life under cyclic overload. International Journal of Fatigue. 162. 106943–106943. 29 indexed citations
16.
An, Tong, Fei Qin, Liang Wang, et al.. (2021). The Effect of the Surface Roughness Characteristics of the Contact Interface on the Thermal Contact Resistance of the PP-IGBT Module. IEEE Transactions on Power Electronics. 37(6). 7286–7298. 18 indexed citations
17.
Dai, Yanwei, et al.. (2021). Out-of-plane effect on the sharp V-notch tip fields in power-law creeping solids: A three-dimensional asymptotic analysis. International Journal of Solids and Structures. 236-237. 111352–111352. 3 indexed citations
18.
Qin, Fei, et al.. (2020). Crack Effect on the Equivalent Thermal Conductivity of Porously Sintered Silver. Journal of Electronic Materials. 49(10). 5994–6008. 15 indexed citations
19.
Qin, Fei, Shuai Zhao, Yanwei Dai, et al.. (2020). Study of Warpage Evolution and Control for Six-Side Molded WLCSP in Different Packaging Processes. IEEE Transactions on Components Packaging and Manufacturing Technology. 10(4). 730–738. 21 indexed citations
20.
Dai, Yanwei, Yinghua Liu, Fei Qin, Yuh J. Chao, & Filippo Berto. (2019). Estimation of stress field for sharp V-notch in power-law creeping solids: An asymptotic viewpoint. International Journal of Solids and Structures. 180-181. 189–204. 16 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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