W. Jillek

805 total citations
14 papers, 664 citations indexed

About

W. Jillek is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, W. Jillek has authored 14 papers receiving a total of 664 indexed citations (citations by other indexed papers that have themselves been cited), including 11 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 4 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in W. Jillek's work include Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (5 papers) and Advanced Welding Techniques Analysis (4 papers). W. Jillek is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (5 papers) and Advanced Welding Techniques Analysis (4 papers). W. Jillek collaborates with scholars based in Germany, Hong Kong and China. W. Jillek's co-authors include Y.C. Chan, H. Hübner, Rashed Adnan Islam, Daquan Yu, M.O. Alam, M.J. Rizvi, Mobinul Islam, Bin Wu, A. Hubert and Yaroslav Bobitski and has published in prestigious journals such as Journal of Materials Science, Journal of Alloys and Compounds and Journal of Magnetism and Magnetic Materials.

In The Last Decade

W. Jillek

13 papers receiving 639 citations

Peers

W. Jillek
Ren Jialie China
Ziqiang Dong China
Joanna Wojewoda-Budka Poland
B. Formanek Poland
Ajay K. Misra United States
F.M. Hosking United States
I. N. A. Oguocha Canada
Karl J. Puttlitz United States
Guoqing Chen China
B. K. Kardashev Russia
Ren Jialie China
W. Jillek
Citations per year, relative to W. Jillek W. Jillek (= 1×) peers Ren Jialie

Countries citing papers authored by W. Jillek

Since Specialization
Citations

This map shows the geographic impact of W. Jillek's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by W. Jillek with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites W. Jillek more than expected).

Fields of papers citing papers by W. Jillek

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by W. Jillek. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by W. Jillek. The network helps show where W. Jillek may publish in the future.

Co-authorship network of co-authors of W. Jillek

This figure shows the co-authorship network connecting the top 25 collaborators of W. Jillek. A scholar is included among the top collaborators of W. Jillek based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with W. Jillek. W. Jillek is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

14 of 14 papers shown
1.
Jillek, W., et al.. (2010). Print the Printed Circuit Board – Inkjet Printing of Electronic Devices. Technical programs and proceedings. 26(1). 715–719. 1 indexed citations
2.
Lesyuk, Rostyslav, et al.. (2010). Low-energy pulsed laser treatment of silver nanoparticles for interconnects fabrication by ink-jet method. Microelectronic Engineering. 88(3). 318–321. 18 indexed citations
3.
4.
Wu, Bin, Y.C. Chan, M.O. Alam, & W. Jillek. (2006). Electrochemical corrosion study of Pb-free solders. Journal of materials research/Pratt's guide to venture capital sources. 21(1). 62–70. 41 indexed citations
5.
Yu, Daquan, et al.. (2006). Electrochemical migration of lead free solder joints. Journal of Materials Science Materials in Electronics. 17(3). 229–241. 46 indexed citations
6.
Islam, Rashed Adnan, et al.. (2006). Comparative study of wetting behavior and mechanical properties (microhardness) of Sn–Zn and Sn–Pb solders. Microelectronics Journal. 37(8). 705–713. 85 indexed citations
7.
Yu, Daquan, et al.. (2006). Electrochemical migration of Sn-Pb and lead free solder alloys under distilled water. Journal of Materials Science Materials in Electronics. 17(3). 219–227. 71 indexed citations
8.
Islam, Mobinul, Y.C. Chan, M.J. Rizvi, & W. Jillek. (2005). Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder. Journal of Alloys and Compounds. 400(1-2). 136–144. 128 indexed citations
9.
Islam, Rashed Adnan, Bin Wu, M.O. Alam, Y.C. Chan, & W. Jillek. (2005). Investigations on microhardness of Sn–Zn based lead-free solder alloys as replacement of Sn–Pb solder. Journal of Alloys and Compounds. 392(1-2). 149–158. 107 indexed citations
10.
11.
Jillek, W. & A. Hubert. (1980). The influence of mechanical stresses on losses and domains of oriented transformer steel. Journal of Magnetism and Magnetic Materials. 19(1-3). 365–368. 6 indexed citations
12.
Jillek, W., et al.. (1978). Messung und auswirkungen der von den isolierschichten auf orientiertes transformatorenblech übertragenen spannungen. Journal of Magnetism and Magnetic Materials. 9(1-3). 225–228. 2 indexed citations
13.
Hübner, H. & W. Jillek. (1977). Sub-critical crack extension and crack resistance in polycrystalline alumina. Journal of Materials Science. 12(1). 117–125. 141 indexed citations
14.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026