Fei Qin
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Advanced MIMO Systems Optimization
- Silicon Carbide Semiconductor Technologies
- Mechanical Engineering top 2%
- Advanced machining processes and optimization
- Aluminum Alloys Composites Properties
Papers in
-
- Electronic Packaging and Soldering Technologies 96
- 3D IC and TSV technologies 62
- Silicon Carbide Semiconductor Technologies 25
- Integrated Circuits and Semiconductor Failure Analysis 22
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- Fatigue and fracture mechanics 19
- Numerical methods in engineering 18
- Journals
- Microelectronics Reliability (8 papers)Journal of Electronic Packaging (7 papers)Engineering Fracture Mechanics (6 papers)Theoretical and Applied Fracture Mechanics (5 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (5 papers)
- Partner nations
- ChinaUnited StatesUnited Kingdom
In The Last Decade
Fei Qin
228 papers receiving 2.6k citations
Peers
Comparison fields: 5 of 120
- Electrical and Electronic Engineering 1.4k
- Mechanical Engineering 778
- Mechanics of Materials 487
- Automotive Engineering 197
- Building and Construction 204
Countries citing papers authored by Fei Qin
This map shows the geographic impact of Fei Qin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fei Qin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fei Qin more than expected).
Fields of papers citing papers by Fei Qin
This network shows the impact of papers produced by Fei Qin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fei Qin. The network helps show where Fei Qin may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Fei Qin, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2024 | 3 | |
| 2 | 2024 | 5 | |
| 3 | 2024 | 6 | |
| 4 | 2024 | 4 | |
| 5 | 2024 | 1 | |
| 6 | 2024 | 2 | |
| 7 | 2023 | 6 | |
| 8 | 2023 | 3 | |
| 9 | 2023 | 3 | |
| 10 | 2023 | 8 | |
| 11 | 2023 | 8 | |
| 12 | 2022 | 7 | |
| 13 | 2021 | 18 | |
| 14 | 2020 | 15 | |
| 15 | 2020 | 21 | |
| 16 | 2019 | 16 | |
| 17 | 2018 | 17 | |
| 18 | 2018 | 16 | |
| 19 | 2017 | 11 | |
| 20 | Test case generation for software based on orthogonal experiment design | 2008 | 2 |
About Fei Qin
Fei Qin is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Biomedical Engineering and Automotive Engineering, having authored 254 papers that have together received 2.7k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (96 papers), 3D IC and TSV technologies (62 papers), Advanced Surface Polishing Techniques (38 papers), Silicon Carbide Semiconductor Technologies (25 papers), Integrated Circuits and Semiconductor Failure Analysis (22 papers), Aluminum Alloys Composites Properties (20 papers), Fatigue and fracture mechanics (19 papers) and Numerical methods in engineering (18 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.4k citations), Mechanical Engineering (778 citations), Mechanics of Materials (487 citations), Automotive Engineering (197 citations) and Building and Construction (204 citations). Fei Qin has collaborated with scholars based in China, United States and United Kingdom. Frequent co-authors include Tong An, Pei Chen, Yanwei Dai, Shanzhi Chen, Xi Li, Bo Hu, Tao Ding, Zhenhua Duan, Jianzhuang Xiao and Yanpeng Gong. Their work appears in journals such as Microelectronics Reliability, Journal of Electronic Packaging, Engineering Fracture Mechanics, Theoretical and Applied Fracture Mechanics and IEEE Transactions on Components Packaging and Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.