Lei Jin

968 total citations
91 papers, 725 citations indexed

About

Lei Jin is a scholar working on Electrical and Electronic Engineering, Materials Chemistry and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Lei Jin has authored 91 papers receiving a total of 725 indexed citations (citations by other indexed papers that have themselves been cited), including 54 papers in Electrical and Electronic Engineering, 23 papers in Materials Chemistry and 18 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Lei Jin's work include Electrodeposition and Electroless Coatings (27 papers), Copper Interconnects and Reliability (13 papers) and Electrochemical Analysis and Applications (11 papers). Lei Jin is often cited by papers focused on Electrodeposition and Electroless Coatings (27 papers), Copper Interconnects and Reliability (13 papers) and Electrochemical Analysis and Applications (11 papers). Lei Jin collaborates with scholars based in China, United States and United Kingdom. Lei Jin's co-authors include Fang‐Zu Yang, Jiaqiang Yang, Dongping Zhan, Martin Abraham, Jun Yang, De‐Yin Wu, Huihuang Chen, Zhong‐Qun Tian, Yuanyuan Xue and Weiqing Li and has published in prestigious journals such as Advanced Materials, SHILAP Revista de lepidopterología and The Science of The Total Environment.

In The Last Decade

Lei Jin

82 papers receiving 695 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Lei Jin China 16 276 194 147 69 66 91 725
Ruirui Yang China 18 386 1.4× 311 1.6× 299 2.0× 74 1.1× 88 1.3× 63 1.2k
Ke Xiao China 19 380 1.4× 292 1.5× 293 2.0× 85 1.2× 77 1.2× 44 1.1k
Jihoon Yang South Korea 13 344 1.2× 359 1.9× 90 0.6× 48 0.7× 93 1.4× 51 832
Xiaohui Zhang China 19 534 1.9× 205 1.1× 177 1.2× 31 0.4× 150 2.3× 53 1.1k
Jenn‐Shing Chen Taiwan 19 598 2.2× 113 0.6× 79 0.5× 20 0.3× 159 2.4× 71 1.2k
Kaidi Li China 23 625 2.3× 497 2.6× 119 0.8× 27 0.4× 196 3.0× 89 1.4k
Pankaj Ramnani United States 14 318 1.2× 400 2.1× 254 1.7× 130 1.9× 55 0.8× 16 840
Yixue Xu China 18 680 2.5× 1.1k 5.6× 110 0.7× 36 0.5× 148 2.2× 46 1.8k
Maryam Kiani China 15 428 1.6× 438 2.3× 101 0.7× 27 0.4× 143 2.2× 26 1.1k
Lijuan Qi China 17 331 1.2× 80 0.4× 217 1.5× 47 0.7× 233 3.5× 45 750

Countries citing papers authored by Lei Jin

Since Specialization
Citations

This map shows the geographic impact of Lei Jin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Lei Jin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Lei Jin more than expected).

Fields of papers citing papers by Lei Jin

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Lei Jin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Lei Jin. The network helps show where Lei Jin may publish in the future.

Co-authorship network of co-authors of Lei Jin

This figure shows the co-authorship network connecting the top 25 collaborators of Lei Jin. A scholar is included among the top collaborators of Lei Jin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Lei Jin. Lei Jin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Yang, Jiaqiang, Tao Song, Lei Jin, et al.. (2025). In-operando visualization of the dynamic microvia copper filling process for metal interconnection of integrated circuit. Electrochimica Acta. 535. 146698–146698.
2.
Li, Shuzhen, Huihuang Chen, Erik Jeppesen, et al.. (2025). Cyanobacterial blooms specifically alter the dispersal-mediated taxonomic and functional vertical similarity of microbial communities in a subtropical reservoir. Water Research. 281. 123574–123574. 2 indexed citations
3.
Li, Yajing, et al.. (2025). Effect of Zr on microstructure and mechanical properties of novel Al0.5Mo0.5NbTi1.25V0.5Zrx lightweight refractory high-entropy alloys. Journal of Alloys and Compounds. 1024. 180085–180085. 8 indexed citations
4.
5.
Wang, Junxia, Hongxiang Li, Haonan Li, et al.. (2025). Waterbody type dependence of the spatial distribution of macroinvertebrate communities in temperate China. Frontiers in Ecology and Evolution. 13.
6.
Yu, Daquan, Lei Jin, Jiaqiang Yang, et al.. (2024). Studies of polixetonium chloride as a novel, hypotoxic and single additive of copper electronic plating for microvia void-free filling in printed circuit board application. Journal of Manufacturing Processes. 121. 475–484. 5 indexed citations
7.
Chen, Huihuang, Chenxi Mi, Yifan Lu, et al.. (2024). Climate-driven decline in water level causes earlier onset of hypoxia in a subtropical reservoir. Water Research. 267. 122445–122445. 5 indexed citations
8.
Zhao, Yi, Lei Jin, Jiaqiang Yang, et al.. (2024). 1-Dodecyl-2-methyl-3-benzylimidazolium chloride as a novel leveler: Towards simultaneously both the microvia void-free filling and through hole conformal thickening. Colloids and Surfaces A Physicochemical and Engineering Aspects. 695. 134239–134239. 5 indexed citations
9.
Sha, Zuoliang, Huihuang Chen, Lei Jin, et al.. (2024). Evidence of global dispersal of the harmful cyanobacterium, Raphidiopsis raciborskii, in lentic freshwaters through migratory waterbirds. Harmful Algae. 142. 102786–102786. 4 indexed citations
10.
Jin, Lei, et al.. (2024). Role of a novel imidazolium-based leveler on the Cu electroplating for ultra-high aspect ratio through-silicon-vias. Colloids and Surfaces A Physicochemical and Engineering Aspects. 708. 136007–136007. 2 indexed citations
11.
12.
Wang, Jiahui, et al.. (2023). Growth behavior and mechanism of atomic layer deposition of Ru for replacing Cu-interconnects. Vacuum. 221. 112927–112927. 1 indexed citations
13.
14.
Li, Weiqing, Lei Jin, Jiaqiang Yang, et al.. (2022). Toward Preeminent Throwing Power from a Novel Alkaline Copper Electronic Electroplating Bath with Composite Coordination Agents. ChemElectroChem. 9(11). 2 indexed citations
15.
Li, Weiqing, Lei Jin, Jiaqiang Yang, et al.. (2021). Effects of Additive on the Electrodeposition and Coating Structure in a Novel System of Electronic Copper Electroplating. Gaodeng xuexiao huaxue xuebao. 42(9). 2919. 1 indexed citations
16.
Jin, Lei, et al.. (2021). Studies and Progresses on Hole Metallization in High-Density Interconnected Printed Circuit Boards. Journal of Electrochemistry. 27(3). 316. 3 indexed citations
17.
Jin, Lei, et al.. (2020). Research Progresses of Copper Interconnection in Chips. Journal of Electrochemistry. 26(4). 521.
18.
Ji, Yunheng, et al.. (2020). Ultra-Barcoding Discovers a Cryptic Species in Paris yunnanensis (Melanthiaceae), a Medicinally Important Plant. Frontiers in Plant Science. 11. 411–411. 30 indexed citations
19.
Yang, Jiaqiang, Huan-Huan Yu, Lei Jin, et al.. (2020). Insights into the Effects of Chloride ions on Cyanide-Free Gold Electrodeposition. Journal of The Electrochemical Society. 167(10). 102514–102514. 6 indexed citations
20.
Yu, Fei, et al.. (2012). Design and Implementation of Active Millimeter Wave Imaging System. Journal of Microwaves. 28(5). 81–84.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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