I. Dutta

3.5k total citations · 1 hit paper
132 papers, 2.9k citations indexed

About

I. Dutta is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, I. Dutta has authored 132 papers receiving a total of 2.9k indexed citations (citations by other indexed papers that have themselves been cited), including 84 papers in Electrical and Electronic Engineering, 76 papers in Mechanical Engineering and 43 papers in Materials Chemistry. Recurrent topics in I. Dutta's work include Electronic Packaging and Soldering Technologies (75 papers), Aluminum Alloys Composites Properties (41 papers) and 3D IC and TSV technologies (26 papers). I. Dutta is often cited by papers focused on Electronic Packaging and Soldering Technologies (75 papers), Aluminum Alloys Composites Properties (41 papers) and 3D IC and TSV technologies (26 papers). I. Dutta collaborates with scholars based in United States, India and Singapore. I. Dutta's co-authors include Samuel M. Allen, Praveen Kumar, David L. Bourell, S. G. Jadhav, Dongdong Pan, Bhaskar Majumdar, Ganesh Subbarayan, Muhannad S. Bakir, Mingwei Chen and Robert A. Marks and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Physical Review B.

In The Last Decade

I. Dutta

130 papers receiving 2.8k citations

Hit Papers

align trajectories

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

A calorimetric study of precipitation in commercial aluminium alloy 6061

1991 318 citations I. Dutta et al. profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
I. Dutta United States	27	2.0k	1.4k	1.1k	924	444	132	2.9k
David E. Alman United States	30	1.9k 1.0×	698 0.5×	893 0.8×	1.3k 1.4×	378 0.9×	96	3.0k
Tung‐Han Chuang Taiwan	30	2.0k 1.0×	1.9k 1.3×	607 0.6×	902 1.0×	203 0.5×	211	3.1k
Guofu Xu China	31	1.7k 0.9×	893 0.6×	1.4k 1.3×	1.4k 1.5×	109 0.2×	118	3.1k
Jongun Moon South Korea	45	4.0k 2.0×	1.1k 0.8×	2.8k 2.6×	1.8k 2.0×	132 0.3×	147	5.5k
Songbai Xue China	31	2.6k 1.3×	2.5k 1.8×	740 0.7×	347 0.4×	107 0.2×	181	3.4k
Shi–Li Shu China	33	2.8k 1.5×	323 0.2×	1.0k 0.9×	1.7k 1.8×	632 1.4×	147	3.6k
V. Shemet Germany	28	1.2k 0.6×	496 0.3×	1.3k 1.2×	2.0k 2.1×	421 0.9×	71	2.6k
Chuantong Chen Japan	34	2.1k 1.0×	2.3k 1.6×	166 0.2×	533 0.6×	314 0.7×	199	3.5k
Lei Zheng China	31	1.2k 0.6×	1.2k 0.9×	753 0.7×	2.3k 2.5×	136 0.3×	102	3.3k
G.J. Zhang China	25	1.6k 0.8×	249 0.2×	415 0.4×	1.5k 1.7×	683 1.5×	105	2.3k

Countries citing papers authored by I. Dutta

Since Specialization

Citations

This map shows the geographic impact of I. Dutta's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by I. Dutta with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites I. Dutta more than expected).

Fields of papers citing papers by I. Dutta

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by I. Dutta. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by I. Dutta. The network helps show where I. Dutta may publish in the future.

Co-authorship network of co-authors of I. Dutta

This figure shows the co-authorship network connecting the top 25 collaborators of I. Dutta. A scholar is included among the top collaborators of I. Dutta based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with I. Dutta. I. Dutta is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Subbarayan, Ganesh, et al.. (2025). Microstructurally Adaptive Model for Evolution of Creep Due to Aging in SnAgCu Solder Alloys. Journal of Electronic Materials. 54(3). 2404–2422.

Subbarayan, Ganesh, et al.. (2024). Stereological Analysis of Microstructural Evolution Due to Aging in SnAgCu Solder Alloys. Journal of Electronic Materials. 53(3). 1399–1413. 1 indexed citations

Lee, Tae-Kyu, Hanry Yang, & I. Dutta. (2023). Damage Mechanisms in Through-Silicon Vias Due to Thermal Exposure and Electromigration. Journal of Electronic Materials. 53(3). 1214–1222. 3 indexed citations

Dutta, I., et al.. (2020). A technique for machining thin metallic foils using electromagnetic-mechanical pulsed loading. Engineering Research Express. 2(1). 15031–15031.

Mahapatra, S. Das & I. Dutta. (2018). Co-electrodeposition of tin with 0.2–20% indium: Implications on tin whisker growth. Surface and Coatings Technology. 337. 478–483. 12 indexed citations

Sahaym, Uttara, et al.. (2016). Effect of Composition and Thermal–Mechanical History on the Creep Behavior of Sn–Ag–Cu Solders—Part I: Experiments. IEEE Transactions on Device and Materials Reliability. 16(3). 318–325. 5 indexed citations

Børgesen, Peter, E. J. Cotts, & I. Dutta. (2014). Microstructurally Adaptive Constitutive Relations and Reliability Assessment Protocols for Lead Free Solder. 16(1). 14 indexed citations

Kumar, Praveen, et al.. (2012). Microstructural evolution and some unusual effects during thermo-mechanical Cycling of Sn-Ag-Cu alloys. 32. 880–887. 14 indexed citations

Nie, Xu, et al.. (2012). Constitutive Models for Intermediate- and High-Strain Rate Flow Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Solder Alloys. IEEE Transactions on Components Packaging and Manufacturing Technology. 3(1). 133–146. 9 indexed citations

10.

Kumar, Praveen & I. Dutta. (2011). Influence of electric current on diffusionally accommodated sliding at hetero-interfaces. Acta Materialia. 59(5). 2096–2108. 17 indexed citations

11.

Kumar, Praveen, et al.. (2009). Next generation materials for thermal interface and high density energy storage applications via liquid phase sintering. 506–511. 13 indexed citations

12.

Dutta, I., et al.. (2007). Effect of Ag and Cu Concentrations on the Creep Behavior of Sn-Based Solders. Journal of Electronic Materials. 37(3). 347–354. 46 indexed citations

13.

Dutta, I., et al.. (2007). Effect of Ag and Cu Concentrations on Creep of Sn-Based Solders. 399–405. 3 indexed citations

14.

Dutta, I., et al.. (2004). Environmentally protected hot-stage atomic force microscope for studying thermo-mechanical deformation in microelectronic devices. Review of Scientific Instruments. 75(11). 4662–4670. 4 indexed citations

15.

Pan, Dongdong, Robert A. Marks, I. Dutta, Ravi Mahajan, & S. G. Jadhav. (2004). Miniaturized impression creep testing of ball grid array solder balls attached to microelectronic packaging substrates. Review of Scientific Instruments. 75(12). 5244–5252. 25 indexed citations

16.

Dutta, I., et al.. (2003). Processing and characterization of diffusion-bonded Al–Si interfaces. Journal of Materials Processing Technology. 145(1). 99–108. 29 indexed citations

17.

Dutta, I., et al.. (2002). Measurement of creep kinetics at Al–Si interfaces. Scripta Materialia. 47(10). 649–654. 10 indexed citations

18.

Barrera, Enrique V., I. Dutta, & Metals Minerals. (1993). Residual stresses in composites : measurement, modeling & effects on thermo-mechanical behavior : proceedings of a symposium sponsored by the Structural Materials Division of TMS, Denver, Colorado, February 21-25, 1993. 1 indexed citations

19.

Dutta, I., Saibal Mitra, & H. John Cooper. (1992). Process Dependence of Microstructure and Properties of Sintered Aluminum Nitride for Electronic Packaging. MRS Proceedings. 264. 2 indexed citations

20.

Dutta, I., et al.. (1991). Corrosion Behavior of a P130x Graphite Fiber Reinforced 6063 Aluminum Composite Laminate in Aqueous Environments. Journal of The Electrochemical Society. 138(11). 3199–3209. 9 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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