Cheng‐Hsien Wu

1.3k total citations
47 papers, 964 citations indexed

About

Cheng‐Hsien Wu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Biomedical Engineering. According to data from OpenAlex, Cheng‐Hsien Wu has authored 47 papers receiving a total of 964 indexed citations (citations by other indexed papers that have themselves been cited), including 27 papers in Electrical and Electronic Engineering, 23 papers in Mechanical Engineering and 13 papers in Biomedical Engineering. Recurrent topics in Cheng‐Hsien Wu's work include Injection Molding Process and Properties (16 papers), Semiconductor materials and devices (10 papers) and Advanced Memory and Neural Computing (9 papers). Cheng‐Hsien Wu is often cited by papers focused on Injection Molding Process and Properties (16 papers), Semiconductor materials and devices (10 papers) and Advanced Memory and Neural Computing (9 papers). Cheng‐Hsien Wu collaborates with scholars based in Taiwan, United States and Singapore. Cheng‐Hsien Wu's co-authors include L. James Lee, S. Y. Hou, K. C. Ting, Douglas Yu, W.C. Chiou, C. T. Wang, Yu-Jen Huang, Christine Chiu, Hsiu‐Wen Chien and Chien‐Hsin Yang and has published in prestigious journals such as SHILAP Revista de lepidopterología, Journal of Alloys and Compounds and IEEE Transactions on Electron Devices.

In The Last Decade

Cheng‐Hsien Wu

46 papers receiving 925 citations

Peers

Cheng‐Hsien Wu
Timo Bernthaler Germany
K.S. Lee Singapore
Fakhrozi Che Ani Malaysia
Kiran S. Bhole India
Muhammad A. Ali United Arab Emirates
Barney E. Klamecki United States
Jingjing Ji China
Kuanmin Mao China
Timo Bernthaler Germany
Cheng‐Hsien Wu
Citations per year, relative to Cheng‐Hsien Wu Cheng‐Hsien Wu (= 1×) peers Timo Bernthaler

Countries citing papers authored by Cheng‐Hsien Wu

Since Specialization
Citations

This map shows the geographic impact of Cheng‐Hsien Wu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Cheng‐Hsien Wu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Cheng‐Hsien Wu more than expected).

Fields of papers citing papers by Cheng‐Hsien Wu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Cheng‐Hsien Wu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Cheng‐Hsien Wu. The network helps show where Cheng‐Hsien Wu may publish in the future.

Co-authorship network of co-authors of Cheng‐Hsien Wu

This figure shows the co-authorship network connecting the top 25 collaborators of Cheng‐Hsien Wu. A scholar is included among the top collaborators of Cheng‐Hsien Wu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Cheng‐Hsien Wu. Cheng‐Hsien Wu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Yeh, C.L. & Cheng‐Hsien Wu. (2024). Parameter analysis of multi-objective optimization for energy efficiency and multiple quality aspects in injection molding. The International Journal of Advanced Manufacturing Technology. 135(9-10). 4471–4490. 3 indexed citations
2.
Ambrosi, Elia, et al.. (2024). Chalcogenide Selectors for Low Voltage and High Density Memory Applications. 1–2. 1 indexed citations
3.
Ambrosi, Elia, et al.. (2024). Ultrafast ~7 Mbps True Random Number Generator Based on SNGCT Selector. IEEE Transactions on Electron Devices. 71(4). 2794–2800.
4.
Wu, Cheng‐Hsien & Chunyu Liu. (2023). Optimization of compression molding for double-concave lenses. The International Journal of Advanced Manufacturing Technology. 125(11-12). 5089–5099. 4 indexed citations
5.
6.
Wu, Mengting, et al.. (2022). Deep learning-based optimization using a limited number of experiments for roll-to-roll UV embossing. The International Journal of Advanced Manufacturing Technology. 120(9-10). 5955–5967. 2 indexed citations
7.
Liao, P. J., et al.. (2022). Investigation of First Fire Effect on VTH Stability and Endurance in GeCTe Selector. 4A.3–1. 6 indexed citations
8.
Ambrosi, Elia, Cheng‐Hsien Wu, Chen-Feng Hsu, et al.. (2022). Engineering defects in pristine amorphous chalcogenides for forming-free low voltage selectors. 2022 International Electron Devices Meeting (IEDM). 18.7.1–18.7.4. 5 indexed citations
9.
Wu, Cheng‐Hsien, et al.. (2021). The use of roll-to-plate UV-curing embossing to produce a composite light guide plate. Microsystem Technologies. 27(10). 3875–3891. 4 indexed citations
10.
Wu, Cheng‐Hsien, et al.. (2020). The use of 3D in‐mold decoration technology to form a film with printed circuits. Polymer Engineering and Science. 60(10). 2517–2528. 7 indexed citations
11.
Wu, Cheng‐Hsien, et al.. (2019). Design and application of a hybrid alignment platform for a double-sided hot embossing process. Microsystem Technologies. 26(3). 721–730. 2 indexed citations
12.
Chien, Hsiu‐Wen, Cheng‐Hsien Wu, Chien‐Hsin Yang, & Tzong-Liu Wang. (2019). Multiple doping effect of LiYF4:Yb3+/Er3+/Ho3+/Tm3+@LiYF4:Yb3+ core/shell nanoparticles and its application in Hg2+ sensing detection. Journal of Alloys and Compounds. 806. 272–282. 24 indexed citations
13.
Hou, S. Y., Chung-Hsien Tsai, K. C. Ting, et al.. (2019). Integrated Deep Trench Capacitor in Si Interposer for CoWoS Heterogeneous Integration. 19.5.1–19.5.4. 35 indexed citations
14.
Gong, Xiao, Qian Zhou, Man Hon Samuel Owen, et al.. (2014). InAlP-Capped (100) Ge nFETs with 1.06 nm EOT: Achieving record high peak mobility and first integration on 300 mm Si substrate. 9.4.1–9.4.4. 13 indexed citations
15.
Gong, Xiao, Ran Cheng, Pengfei Guo, et al.. (2013). High performance Ge CMOS with novel InAlP-passivated channels for future sub-10 nm technology node applications. National University of Singapore. 26.7.1–26.7.3. 9 indexed citations
16.
Wu, Cheng‐Hsien, et al.. (2007). FLOW ANALYSIS OF MICRO-CHANNEL IN INJECTION MOLDING. Journal of Polymer Engineering. 27(2). 3 indexed citations
17.
Chiang, Wen-Tai, et al.. (2007). Circuit Performance Optimization in Advanced PD-SOI CMOS Development. 73–74. 2 indexed citations
18.
Wu, Cheng‐Hsien, et al.. (2007). Influence of lubrication type and process conditions on milling performance. Proceedings of the Institution of Mechanical Engineers Part B Journal of Engineering Manufacture. 221(5). 835–843. 9 indexed citations
19.
Wu, Cheng‐Hsien, et al.. (2005). Effects of geometry and injection‐molding parameters on weld‐line strength. Polymer Engineering and Science. 45(7). 1021–1030. 99 indexed citations
20.
Wu, Cheng‐Hsien, et al.. (1994). In‐plane permeability measurement and analysis in liquid composite molding. Polymer Composites. 15(4). 278–288. 97 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Timo Bernthaler Breakdown of academic impact, for papers by K.S. Lee Breakdown of academic impact, for papers by Fakhrozi Che Ani Breakdown of academic impact, for papers by Kiran S. Bhole Breakdown of academic impact, for papers by Muhammad A. Ali Breakdown of academic impact, for papers by Barney E. Klamecki Breakdown of academic impact, for papers by Jingjing Ji Breakdown of academic impact, for papers by Kuanmin Mao
Rankless by CCL
2026