L.J. Ernst

2.9k total citations
191 papers, 2.2k citations indexed

About

L.J. Ernst is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, L.J. Ernst has authored 191 papers receiving a total of 2.2k indexed citations (citations by other indexed papers that have themselves been cited), including 117 papers in Electrical and Electronic Engineering, 111 papers in Mechanics of Materials and 60 papers in Mechanical Engineering. Recurrent topics in L.J. Ernst's work include Electronic Packaging and Soldering Technologies (94 papers), Mechanical Behavior of Composites (69 papers) and Epoxy Resin Curing Processes (39 papers). L.J. Ernst is often cited by papers focused on Electronic Packaging and Soldering Technologies (94 papers), Mechanical Behavior of Composites (69 papers) and Epoxy Resin Curing Processes (39 papers). L.J. Ernst collaborates with scholars based in Netherlands, Germany and United States. L.J. Ernst's co-authors include K.M.B. Jansen, W.D. van Driel, G.Q. Zhang, G. Q. Zhang, J.H.J. Janssen, H.J.L. Bressers, Daoguo Yang, Xuejun Fan, H. Pape and Christoph Böhm and has published in prestigious journals such as SHILAP Revista de lepidopterología, Nature Chemistry and Electrochimica Acta.

In The Last Decade

L.J. Ernst

184 papers receiving 2.1k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
L.J. Ernst Netherlands 25 1.3k 1.0k 797 329 304 191 2.2k
Bernhard Wunderle Germany 23 1.8k 1.3× 780 0.8× 869 1.1× 124 0.4× 423 1.4× 310 2.6k
B. Michel Germany 25 2.1k 1.6× 855 0.8× 834 1.0× 93 0.3× 435 1.4× 211 2.7k
Luu Nguyen United States 24 2.1k 1.6× 565 0.6× 930 1.2× 87 0.3× 175 0.6× 170 2.6k
Gerard F. Fernando United Kingdom 29 1.3k 1.0× 630 0.6× 600 0.8× 442 1.3× 383 1.3× 155 2.6k
G.Q. Zhang Netherlands 21 789 0.6× 302 0.3× 297 0.4× 98 0.3× 162 0.5× 87 1.2k
Alexandros A. Skordos United Kingdom 28 205 0.2× 823 0.8× 1.0k 1.3× 636 1.9× 219 0.7× 92 2.0k
Yi‐Shao Lai Taiwan 29 2.5k 1.9× 646 0.6× 1.1k 1.4× 63 0.2× 208 0.7× 202 3.0k
Takashi Kuboki Japan 16 685 0.5× 529 0.5× 728 0.9× 72 0.2× 120 0.4× 103 1.6k
Hideo Miura Japan 25 926 0.7× 545 0.5× 693 0.9× 83 0.3× 310 1.0× 231 2.0k
Y.C. Chan Hong Kong 30 2.2k 1.7× 301 0.3× 1.2k 1.5× 81 0.2× 264 0.9× 113 2.5k

Countries citing papers authored by L.J. Ernst

Since Specialization
Citations

This map shows the geographic impact of L.J. Ernst's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by L.J. Ernst with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites L.J. Ernst more than expected).

Fields of papers citing papers by L.J. Ernst

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by L.J. Ernst. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by L.J. Ernst. The network helps show where L.J. Ernst may publish in the future.

Co-authorship network of co-authors of L.J. Ernst

This figure shows the co-authorship network connecting the top 25 collaborators of L.J. Ernst. A scholar is included among the top collaborators of L.J. Ernst based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with L.J. Ernst. L.J. Ernst is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Ernst, L.J., Hongwei Song, Dongho Kim, & Frank Würthner. (2025). Photoinduced stepwise charge hopping in π-stacked perylene bisimide donor–bridge–acceptor arrays. Nature Chemistry. 17(5). 767–776. 4 indexed citations
2.
3.
Jansen, K.M.B., et al.. (2011). Analytical estimate for cure-induced stresses and warpage in flat packages. 82. 1/4–4/4. 4 indexed citations
4.
Jansen, K.M.B., et al.. (2011). Effect of chain flexibility in the network structure on the viscoelasticity of epoxy thermosets. Journal of Polymer Research. 18(6). 1879–1888. 34 indexed citations
5.
6.
Soestbergen, M. van, et al.. (2008). Electrical characterization of plastic encapsulations using an alternative gate leakage test method. 462–467. 8 indexed citations
7.
Soestbergen, M. van, et al.. (2008). Modeling ion transport through molding compounds and its relation to product reliability. 1–8. 8 indexed citations
8.
Ernst, L.J., et al.. (2008). Interface Characterization and Failure Modeling for Semiconductor Packages. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 808–815. 18 indexed citations
9.
Jansen, K.M.B., et al.. (2008). Characterization and modeling of molding compound properties during cure. 1–4. 6 indexed citations
10.
Bartek, M., et al.. (2007). Deformable Silicon Electronics Using Segmentation and Flexible Interconnect. 1544–1549. 3 indexed citations
11.
Jansen, K.M.B., et al.. (2007). Characterization of moisture properties of polymers for IC packaging. Microelectronics Reliability. 47(9-11). 1685–1689. 6 indexed citations
12.
13.
Bressers, H.J.L., W.D. van Driel, K.M.B. Jansen, L.J. Ernst, & G. Q. Zhang. (2006). Correlation between chemistry of polymer building blocks and microelectronics reliability. Microelectronics Reliability. 47(2-3). 290–294. 6 indexed citations
14.
Driel, W.D. van, et al.. (2005). Virtual prototyping and qualification of board level assembly. 772–775. 10 indexed citations
15.
Yang, Daoguo, et al.. (2004). Micromechanical Modeling of Stress Evolution Induced During Cure in a Particle-Filled Electronic Packaging Polymer. IEEE Transactions on Components and Packaging Technologies. 27(4). 676–683. 20 indexed citations
16.
Driel, W.D. van, G. Q. Zhang, J.H.J. Janssen, & L.J. Ernst. (2003). Response Surface Modeling for Nonlinear Packaging Stresses. Journal of Electronic Packaging. 125(4). 490–497. 41 indexed citations
17.
Driel, W.D. van, J.H.J. Janssen, G. Q. Zhang, Daoguo Yang, & L.J. Ernst. (2003). Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound. Journal of Electronic Packaging. 125(4). 520–526. 44 indexed citations
18.
Zhang, G.Q., A.A.O. Tay, & L.J. Ernst. (2002). Virtual thermo-mechanical prototyping of electronic packaging-the bottlenecks and solutions for damage modeling. 26 2. 263–269. 8 indexed citations
19.
Ernst, L.J., et al.. (1990). Oxidation kinetics of a Fischer-Tropsch wax: part I: a simple method for measuring oxygen comsumption. South African Journal of Chemistry. 43. 83–86. 3 indexed citations
20.
Ernst, L.J.. (1981). A geometrically nonlinear finite element shell theory. Research Repository (Delft University of Technology). 12 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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