Luu Nguyen

3.4k total citations
170 papers, 2.6k citations indexed

About

Luu Nguyen is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Luu Nguyen has authored 170 papers receiving a total of 2.6k indexed citations (citations by other indexed papers that have themselves been cited), including 138 papers in Electrical and Electronic Engineering, 38 papers in Mechanical Engineering and 33 papers in Mechanics of Materials. Recurrent topics in Luu Nguyen's work include Electronic Packaging and Soldering Technologies (118 papers), 3D IC and TSV technologies (67 papers) and Integrated Circuits and Semiconductor Failure Analysis (25 papers). Luu Nguyen is often cited by papers focused on Electronic Packaging and Soldering Technologies (118 papers), 3D IC and TSV technologies (67 papers) and Integrated Circuits and Semiconductor Failure Analysis (25 papers). Luu Nguyen collaborates with scholars based in United States, Italy and Finland. Luu Nguyen's co-authors include Guna S Selvaduray, Michael Pecht, Pradeep Lall, S.A. Gee, Woon‐Seop Choi, K. N. Tu, K. N. Tu, Ganesh Subbarayan, J.K. Kivilahti and Sami Bayyuk and has published in prestigious journals such as SHILAP Revista de lepidopterología, Applied Physics Letters and Journal of Applied Physics.

In The Last Decade

Luu Nguyen

162 papers receiving 2.5k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Luu Nguyen United States	24	2.1k	930	565	355	271	170	2.6k
Yi‐Shao Lai Taiwan	29	2.5k 1.2×	1.1k 1.2×	646 1.1×	484 1.4×	489 1.8×	202	3.0k
Kuo‐Ning Chiang Taiwan	27	2.1k 1.0×	775 0.8×	466 0.8×	215 0.6×	152 0.6×	264	2.7k
B. Michel Germany	25	2.1k 1.0×	834 0.9×	855 1.5×	286 0.8×	101 0.4×	211	2.7k
Y.C. Chan Hong Kong	30	2.2k 1.0×	1.2k 1.3×	301 0.5×	271 0.8×	187 0.7×	113	2.5k
Bernhard Wunderle Germany	23	1.8k 0.8×	869 0.9×	780 1.4×	414 1.2×	118 0.4×	310	2.6k
Seungbae Park United States	24	1.7k 0.8×	631 0.7×	1.1k 2.0×	236 0.7×	109 0.4×	164	2.8k
Suresh K. Sitaraman United States	24	1.9k 0.9×	651 0.7×	829 1.5×	586 1.7×	162 0.6×	259	2.9k
Balázs Illés Hungary	25	1.4k 0.7×	784 0.8×	251 0.4×	197 0.6×	113 0.4×	164	1.8k
Wen‐Hwa Chen Taiwan	22	676 0.3×	531 0.6×	750 1.3×	586 1.7×	143 0.5×	135	1.9k
Dan Ni China	25	697 0.3×	624 0.7×	733 1.3×	352 1.0×	474 1.7×	78	2.0k

Countries citing papers authored by Luu Nguyen

Since Specialization

Citations

This map shows the geographic impact of Luu Nguyen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Luu Nguyen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Luu Nguyen more than expected).

Fields of papers citing papers by Luu Nguyen

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Luu Nguyen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Luu Nguyen. The network helps show where Luu Nguyen may publish in the future.

Co-authorship network of co-authors of Luu Nguyen

This figure shows the co-authorship network connecting the top 25 collaborators of Luu Nguyen. A scholar is included among the top collaborators of Luu Nguyen based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Luu Nguyen. Luu Nguyen is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Ahn, Woojin, Dhanoop Varghese, Luu Nguyen, et al.. (2020). Effects of Filler Configuration and Moisture on Dissipation Factor and Critical Electric Field of Epoxy Composites for HV-ICs Encapsulation. Archivio istituzionale della ricerca (Alma Mater Studiorum Università di Bologna). 14 indexed citations

Lall, Pradeep, Yunli Zhang, Jeff Suhling, & Luu Nguyen. (2019). 3-D Numerical Multiphysics Model for Cu-Al Wire Bond Corrosion. 13 indexed citations

Reggiani, Susanna, A. Gnudi, Elena Gnani, et al.. (2018). Characterization of dielectric properties and conductivity in encapsulation materials with high insulating filler contents. IEEE Transactions on Dielectrics and Electrical Insulation. 25(6). 2421–2428. 10 indexed citations

Agonafer, Dereje, et al.. (2017). Solder ball reliability assessment of WLCSP — Power cycling versus thermal cycling. 1361–1368. 3 indexed citations

Lall, Pradeep, et al.. (2016). ANN based RUL assessment for copper-aluminum wirebonds subjected to harsh environments. 1–10. 7 indexed citations

Lall, Pradeep, et al.. (2016). De-bonding simulation of Cu-Al wire bond intermetallic compound layers. 862–870. 3 indexed citations

Lall, Pradeep, et al.. (2014). Prognostication of copper-aluminum wirebond reliability under high temperature storage and temperature-humidity. 11 indexed citations

Chan, Diane, Ganesh Subbarayan, & Luu Nguyen. (2011). Maximum-Entropy Principle for Modeling Damage and Fracture in Solder Joints. Journal of Electronic Materials. 41(2). 398–411. 24 indexed citations

Sudhakar, R., et al.. (2006). Material behavior uncertainty in the design of bonded systems – Part I: Shear displacement and stress prediction. Materials & Design (1980-2015). 28(10). 2706–2711.

10.

Nguyen, Luu, et al.. (2005). Flexural testing of board mounted wafer level packages for handheld devices. 2. 557–561. 1 indexed citations

11.

Zhang, Li, et al.. (2004). Numerical and experimental analysis of large passivation opening for solder joint reliability improvement of micro SMD packages. Microelectronics Reliability. 44(3). 533–541. 20 indexed citations

12.

Nguyen, Luu, et al.. (2004). Thermal characterization of stacked-die packages. 55–63. 30 indexed citations

13.

Pitarresi, James M., et al.. (2003). A parametric solder joint reliability model for wafer level-chip scale package. 1323–1328. 11 indexed citations

14.

Tong, Q.K., et al.. (2002). Recent advances on a wafer-level flip chip packaging process. 101–106. 22 indexed citations

15.

Nguyen, Luu & Hoang Vu Nguyen. (2002). Solder joint shape formation under constrained boundaries in wafer level underfill. 1320–1325. 3 indexed citations

16.

Nguyen, Luu, et al.. (2000). Flip chip underfill flow characteristics and prediction. IEEE Transactions on Components and Packaging Technologies. 23(3). 420–427. 40 indexed citations

17.

Tracy, D. P., et al.. (1997). Plastic Packaging Consortium Plastic Package Thermal Dissipation. 290–294. 2 indexed citations

18.

Nguyen, Luu, et al.. (1993). Die Pad Anchoring Designs for Enhanced Adhesion Integrity in IC Packages. Journal of Electronic Packaging. 115(3). 225–232. 8 indexed citations

19.

Nguyen, Luu, et al.. (1990). New characterization techniques for thin polymer films. Wiley eBooks. 42 indexed citations

20.

Nguyen, Luu & Nam P. Suh. (1986). Processing of polyurethane/polyester interpenetrating polymer networks by reaction injection molding. Part II: Mixing at high reynolds numbers and impingement pressures. Polymer Engineering and Science. 26(12). 799–842. 13 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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