H. Pape

904 total citations
58 papers, 713 citations indexed

About

H. Pape is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, H. Pape has authored 58 papers receiving a total of 713 indexed citations (citations by other indexed papers that have themselves been cited), including 44 papers in Electrical and Electronic Engineering, 30 papers in Mechanics of Materials and 15 papers in Mechanical Engineering. Recurrent topics in H. Pape's work include Electronic Packaging and Soldering Technologies (39 papers), Mechanical Behavior of Composites (24 papers) and Fatigue and fracture mechanics (10 papers). H. Pape is often cited by papers focused on Electronic Packaging and Soldering Technologies (39 papers), Mechanical Behavior of Composites (24 papers) and Fatigue and fracture mechanics (10 papers). H. Pape collaborates with scholars based in Germany, Netherlands and Singapore. H. Pape's co-authors include Dirk Schweitzer, Bernhard Wunderle, L.J. Ernst, Gerd Schlottig, K.M.B. Jansen, John Barrett, G. Kelly, C. Lyden, B. Michel and G. Wachutka and has published in prestigious journals such as Polymer, International Journal of Adhesion and Adhesives and Microelectronics Reliability.

In The Last Decade

H. Pape

55 papers receiving 678 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
H. Pape Germany 15 578 279 194 83 48 58 713
Yves Ousten France 11 179 0.3× 67 0.2× 48 0.2× 50 0.6× 54 1.1× 45 286
A. Nishimura Japan 16 540 0.9× 278 1.0× 109 0.6× 47 0.6× 78 1.6× 52 610
Paresh Limaye Belgium 13 480 0.8× 64 0.2× 177 0.9× 40 0.5× 44 0.9× 30 523
George G. Harman United States 9 526 0.9× 117 0.4× 200 1.0× 99 1.2× 67 1.4× 23 642
Erping Deng China 18 671 1.2× 31 0.1× 202 1.0× 71 0.9× 19 0.4× 59 746
Young Yun Woo South Korea 17 833 1.4× 93 0.3× 214 1.1× 52 0.6× 24 0.5× 59 1.1k
L.W. Schaper United States 15 563 1.0× 58 0.2× 62 0.3× 110 1.3× 117 2.4× 64 669
T. Kunio Japan 17 556 1.0× 123 0.4× 121 0.6× 173 2.1× 95 2.0× 72 772

Countries citing papers authored by H. Pape

Since Specialization
Citations

This map shows the geographic impact of H. Pape's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H. Pape with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H. Pape more than expected).

Fields of papers citing papers by H. Pape

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by H. Pape. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H. Pape. The network helps show where H. Pape may publish in the future.

Co-authorship network of co-authors of H. Pape

This figure shows the co-authorship network connecting the top 25 collaborators of H. Pape. A scholar is included among the top collaborators of H. Pape based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with H. Pape. H. Pape is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Pape, H., et al.. (2013). Determination of interface fracture parameters: Energy Release Rate and Mode Mixity using FEA. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 15. 1–9. 4 indexed citations
2.
Wunderle, Bernhard, et al.. (2012). Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 176–186. 13 indexed citations
3.
Wunderle, Bernhard, et al.. (2012). Advanced mixed-mode bending test: A rapid, inexpensive and accurate method for fracture-mechanical interface characterisation. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 631. 1/11–11/11. 11 indexed citations
4.
Jansen, K.M.B., et al.. (2012). Mechanical characterization of epoxy moulding compound in pressurized steam. International Journal of Adhesion and Adhesives. 40. 103–107. 2 indexed citations
5.
6.
Michel, B., et al.. (2011). Fracture mechanical test methods for interface crack evaluation of electronic packages. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 2(2011). 155–158. 4 indexed citations
7.
8.
Schlottig, Gerd, et al.. (2010). Interfacial strength of Silicon-to-Molding Compound changes with thermal residual stress. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 34. 1–5. 10 indexed citations
9.
Schlottig, Gerd, et al.. (2010). Interface fracture mechanics evaluation by correlation of experiment and simulation. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 1–5. 18 indexed citations
10.
Schlottig, Gerd, H. Pape, Bernhard Wunderle, et al.. (2009). Establishing mixed mode fracture properties of EMC-Copper (-oxide) interfaces at various temperatures. TU/e Research Portal. 1138–1143. 11 indexed citations
11.
Pape, H., et al.. (2009). Establishing fracture properties of EMC-Copper interfaces in the visco-elastic temperature region. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 29. 239–245. 13 indexed citations
12.
Schweitzer, Dirk, et al.. (2009). How to evaluate transient dual interface measurements of the Rth-JC of power semiconductor packages. 172–179. 36 indexed citations
13.
Paulasto‐Kröckel, Mervi, et al.. (2008). Thermal impact of randomly distributed solder voids on Rth-JC of MOSFETs. 237–244. 20 indexed citations
14.
Ernst, L.J., et al.. (2008). Interface Characterization and Failure Modeling for Semiconductor Packages. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 808–815. 18 indexed citations
15.
Pape, H., et al.. (2006). Improving the Solder Joint Reliability of VQFN Packages. 2. 760–767. 10 indexed citations
16.
Gerstenmaier, York Christian, H. Pape, & G. Wachutka. (2001). Boundary Independent Exact Thermal Model for Electronic Systems. TechConnect Briefs. 1(2001). 84–87. 9 indexed citations
17.
Kelly, G., et al.. (1996). Importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFPs. IEEE Transactions on Components Packaging and Manufacturing Technology Part B. 19(2). 296–300. 79 indexed citations
18.
Pape, H.. (1990). Die Suqs von Dschidda (Saudi-Arabien). 36(1). 379–396.
19.
Pape, H., et al.. (1982). Socioeconomic Aspects of a Value Analysis of Wind Energy—Illustrated for the Netherlands. Energy Sources. 6(3). 245–259. 1 indexed citations
20.
Pape, H.. (1977). Er Riad : Stadtgeographie und Stadtkartographie der Hauptstadt Saudi-Arabiens. F. Schöningh eBooks. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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