H. Pape
Impact in
- Mechanics of Materials top 5%
- Mechanical Behavior of Composites
- Fatigue and fracture mechanics
- Numerical methods in engineering
-
- Electronic Packaging and Soldering Technologies
- Silicon Carbide Semiconductor Technologies
- 3D IC and TSV technologies
Papers in
-
- Mechanical Behavior of Composites 24
- Fatigue and fracture mechanics 10
- Numerical methods in engineering 9
- Ultrasonics and Acoustic Wave Propagation 8
-
- Electronic Packaging and Soldering Technologies 39
- 3D IC and TSV technologies 10
- Silicon Carbide Semiconductor Technologies 8
- Integrated Circuits and Semiconductor Failure Analysis 6
- Co-authors
- Dirk SchweitzerBernhard WunderleL.J. ErnstGerd SchlottigK.M.B. JansenJohn BarrettG. KellyC. Lyden
- Journals
- International Journal of Adhesion and Adhesives (2 papers)Microelectronics Reliability (1 paper)Polymer (1 paper)Energy Sources (1 paper)IEEE Transactions on Components and Packaging Technologies (1 paper)
- Partner nations
- GermanyNetherlandsSingapore
In The Last Decade
H. Pape
55 papers receiving 678 citations
Peers
Comparison fields: 5 of 47
- Mechanics of Materials 279
- Electrical and Electronic Engineering 578
- Mechanical Engineering 194
- Condensed Matter Physics 31
- Ceramics and Composites 15
Countries citing papers authored by H. Pape
This map shows the geographic impact of H. Pape's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H. Pape with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H. Pape more than expected).
Fields of papers citing papers by H. Pape
This network shows the impact of papers produced by H. Pape. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H. Pape. The network helps show where H. Pape may publish in the future.
Co-authorship network
The 25 scholars most cited alongside H. Pape, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2013 | 4 | |
| 2 | 2012 | 13 | |
| 3 | 2012 | 11 | |
| 4 | 2012 | 2 | |
| 5 | 2012 | 15 | |
| 6 | Fracture mechanical test methods for interface crack evaluation of electronic packages | 2011 | 4 |
| 7 | 2011 | 4 | |
| 8 | 2010 | 10 | |
| 9 | 2010 | 18 | |
| 10 | 2009 | 11 | |
| 11 | 2009 | 13 | |
| 12 | 2009 | 36 | |
| 13 | 2008 | 20 | |
| 14 | 2008 | 18 | |
| 15 | 2006 | 10 | |
| 16 | Boundary Independent Exact Thermal Model for Electronic Systems | 2001 | 9 |
| 17 | 1996 | 79 | |
| 18 | Die Suqs von Dschidda (Saudi-Arabien) | 1990 | 0 |
| 19 | 1982 | 1 | |
| 20 | Er Riad : Stadtgeographie und Stadtkartographie der Hauptstadt Saudi-Arabiens | 1977 | 2 |
About H. Pape
H. Pape is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering, Mechanical Engineering, Archeology and Ceramics and Composites, having authored 58 papers that have together received 713 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (39 papers), Mechanical Behavior of Composites (24 papers), Fatigue and fracture mechanics (10 papers), 3D IC and TSV technologies (10 papers), Numerical methods in engineering (9 papers), Ultrasonics and Acoustic Wave Propagation (8 papers), Silicon Carbide Semiconductor Technologies (8 papers) and Integrated Circuits and Semiconductor Failure Analysis (6 papers). The work is most often cited by research in Mechanics of Materials (279 citations), Electrical and Electronic Engineering (578 citations), Mechanical Engineering (194 citations), Condensed Matter Physics (31 citations) and Ceramics and Composites (15 citations). H. Pape has collaborated with scholars based in Germany, Netherlands and Singapore. Frequent co-authors include Dirk Schweitzer, Bernhard Wunderle, L.J. Ernst, Gerd Schlottig, K.M.B. Jansen, John Barrett, G. Kelly, C. Lyden, B. Michel and G. Wachutka. Their work appears in journals such as International Journal of Adhesion and Adhesives, Microelectronics Reliability, Polymer, Energy Sources and IEEE Transactions on Components and Packaging Technologies.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.