M. Klingler
Impact in
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- Silicon Carbide Semiconductor Technologies
- Electronic Packaging and Soldering Technologies
- Electromagnetic Compatibility and Noise Suppression
- Semiconductor materials and devices
- 3D IC and TSV technologies
- Electrostatic Discharge in Electronics
Papers in
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- Electronic Packaging and Soldering Technologies 11
- Electromagnetic Compatibility and Noise Suppression 7
- Silicon Carbide Semiconductor Technologies 5
- Electromagnetic Compatibility and Measurements 4
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- Aluminum Alloys Composites Properties 10
- Metal Forming Simulation Techniques 3
- Co-authors
- Daniel Coutellier (3 shared papers)Hakim Naceur (2 shared papers)W. Weppner (7 shared papers)Bernhard Wunderle (6 shared papers)Won‐Shik Chu (4 shared papers)Jürgen Wilde (4 shared papers)Maxence Bigerelle (1 shared paper)V. V. Kveder (2 shared papers)
In The Last Decade
M. Klingler
33 papers receiving 420 citations
Peers
Comparison fields: 5 of 40
- Electrical and Electronic Engineering 345
- Ceramics and Composites 30
- Mechanical Engineering 107
- Automotive Engineering 25
- Materials Chemistry 79
Countries citing papers authored by M. Klingler
This map shows the geographic impact of M. Klingler's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Klingler with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Klingler more than expected).
Fields of papers citing papers by M. Klingler
This network shows the impact of papers produced by M. Klingler. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Klingler. The network helps show where M. Klingler may publish in the future.
Co-authors
The 23 scholars most cited alongside M. Klingler, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 36 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2016 | 168 | |
| 2 | 2016 | 32 | |
| 3 | 2018 | 31 | |
| 4 | 2000 | 30 | |
| 5 | 1994 | 24 | |
| 6 | 1997 | 24 | |
| 7 | 2015 | 14 | |
| 8 | 2020 | 13 | |
| 9 | 2018 | 12 | |
| 10 | 2015 | 10 | |
| 11 | Testing of automotive electronic components regarding influence of electromagnetic field strength levels radiated by lightning discharges-application to a multiplexing communication system | 1991 | 9 |
| 12 | 1999 | 8 | |
| 13 | 2020 | 7 | |
| 14 | 2018 | 6 | |
| 15 | 1995 | 5 | |
| 16 | 1995 | 5 | |
| 17 | 2019 | 4 | |
| 18 | 2005 | 4 | |
| 19 | 1997 | 3 | |
| 20 | 2002 | 3 |
About M. Klingler
M. Klingler is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Materials Chemistry, Mechanics of Materials and Atomic and Molecular Physics, and Optics, having authored 36 papers that have together received 438 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (11 papers), Aluminum Alloys Composites Properties (10 papers), Electromagnetic Compatibility and Noise Suppression (7 papers), Silicon Carbide Semiconductor Technologies (5 papers), Aluminum Alloy Microstructure Properties (4 papers), Advanced ceramic materials synthesis (4 papers), Electromagnetic Compatibility and Measurements (4 papers) and Metal Forming Simulation Techniques (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (345 citations), Ceramics and Composites (30 citations), Mechanical Engineering (107 citations), Automotive Engineering (25 citations) and Materials Chemistry (79 citations). M. Klingler has collaborated with scholars based in Germany, France and Taiwan. Frequent co-authors include Daniel Coutellier, Hakim Naceur, W. Weppner, Bernhard Wunderle, Won‐Shik Chu, Jürgen Wilde, Maxence Bigerelle, V. V. Kveder, С. И. Бредихин and S. Scharner. Their work appears in journals such as Ionics, SIAM Journal on Scientific Computing, Microelectronics Reliability, IEEE Transactions on Device and Materials Reliability and Engineering Fracture Mechanics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.