Soon-Bok Lee
Impact in
- Metals and Alloys top 5%
- Hydrogen embrittlement and corrosion behaviors in metals
- Mechanics of Materials top 1%
- Fatigue and fracture mechanics
Papers in
-
- Fatigue and fracture mechanics 21
- Adhesion, Friction, and Surface Interactions 9
-
- High Temperature Alloys and Creep 18
- Advanced Welding Techniques Analysis 8
- Microstructure and Mechanical Properties of Steels 8
- Aluminum Alloys Composites Properties 7
- Co-authors
- Gi‐Dong SimSeong‐Gu HongSoon Hyung HongJoost J. VlassakKyung‐Wook PaikSeong-Gu HongSejeong WonIl‐Ho Kim
- Journals
- Materials Science and Engineering A (10 papers)IEEE Transactions on Components and Packaging Technologies (5 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (4 papers)Journal of Electronic Packaging (4 papers)Microelectronics Reliability (3 papers)
- Partner nations
- South KoreaUnited StatesAustralia
In The Last Decade
Soon-Bok Lee
103 papers receiving 1.8k citations
Peers
Comparison fields: 5 of 73
- Metals and Alloys 140
- Mechanics of Materials 913
- Mechanical Engineering 959
- Electrical and Electronic Engineering 625
- Statistics, Probability and Uncertainty 76
Countries citing papers authored by Soon-Bok Lee
This map shows the geographic impact of Soon-Bok Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Soon-Bok Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Soon-Bok Lee more than expected).
Fields of papers citing papers by Soon-Bok Lee
This network shows the impact of papers produced by Soon-Bok Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Soon-Bok Lee. The network helps show where Soon-Bok Lee may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Soon-Bok Lee, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2023 | 1 | |
| 2 | 2022 | 0 | |
| 3 | 2015 | 16 | |
| 4 | 2015 | 4 | |
| 5 | 2013 | 59 | |
| 6 | 2012 | 12 | |
| 7 | 2011 | 17 | |
| 8 | Experimental analysis on the mechanism of moisture induced interface weakening in ACF package | 2009 | 1 |
| 9 | The Influence of Teacher-Child Relation and teacher's creative role on Interactive Peer Play | 2009 | 1 |
| 10 | 2009 | 21 | |
| 11 | A Study on Self-Concept, Social Competence and School Life Satisfaction of Gifted Elementary Children | 2008 | 0 |
| 12 | 2008 | 2 | |
| 13 | Reliability Studies on Cu/SnAg Double-Bump Flip Chip Assemblies for Fine Pitch Applications | 2008 | 1 |
| 14 | 2008 | 18 | |
| 15 | Extract of Cedrela sinensis Leaves Protects Neuronal Cell Damage Induced by Hydrogen Peroxide in Cultured Rat Neurons | 2007 | 2 |
| 16 | 2007 | 21 | |
| 17 | 2006 | 4 | |
| 18 | 2005 | 149 | |
| 19 | 1996 | 272 | |
| 20 | Development of a structural fatigue testing machine and its application | 1984 | 1 |
About Soon-Bok Lee
Soon-Bok Lee is a scholar working on Mechanics of Materials, Mechanical Engineering, Electrical and Electronic Engineering, Metals and Alloys and Civil and Structural Engineering, having authored 113 papers that have together received 1.9k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (50 papers), 3D IC and TSV technologies (33 papers), Fatigue and fracture mechanics (21 papers), High Temperature Alloys and Creep (18 papers), Adhesion, Friction, and Surface Interactions (9 papers), Advanced Welding Techniques Analysis (8 papers), Microstructure and Mechanical Properties of Steels (8 papers) and Aluminum Alloys Composites Properties (7 papers). The work is most often cited by research in Metals and Alloys (140 citations), Mechanics of Materials (913 citations), Mechanical Engineering (959 citations), Electrical and Electronic Engineering (625 citations) and Statistics, Probability and Uncertainty (76 citations). Soon-Bok Lee has collaborated with scholars based in South Korea, United States and Australia. Frequent co-authors include Gi‐Dong Sim, Seong‐Gu Hong, Soon Hyung Hong, Joost J. Vlassak, Kyung‐Wook Paik, Seong-Gu Hong, Sejeong Won, Il‐Ho Kim, Yun Hwangbo and Tae-Sang Park. Their work appears in journals such as Materials Science and Engineering A, IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of Electronic Packaging and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.