X. F. Ang

433 total citations
18 papers, 341 citations indexed

About

X. F. Ang is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, X. F. Ang has authored 18 papers receiving a total of 341 indexed citations (citations by other indexed papers that have themselves been cited), including 17 papers in Electrical and Electronic Engineering, 6 papers in Electronic, Optical and Magnetic Materials and 4 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in X. F. Ang's work include 3D IC and TSV technologies (13 papers), Electronic Packaging and Soldering Technologies (12 papers) and Molecular Junctions and Nanostructures (8 papers). X. F. Ang is often cited by papers focused on 3D IC and TSV technologies (13 papers), Electronic Packaging and Soldering Technologies (12 papers) and Molecular Junctions and Nanostructures (8 papers). X. F. Ang collaborates with scholars based in Singapore and United States. X. F. Ang's co-authors include Jun Wei, D. F. Lim, Chuan Seng Tan, Zhong Chen, Christian Wong, Fa Xing, Wahyuaji Narottama Putra, Shan Gao, K. L. Pey and Kam W. Leong and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Thin Solid Films.

In The Last Decade

X. F. Ang

18 papers receiving 332 citations

Peers

Countries citing papers authored by X. F. Ang

Since Specialization

Citations

This map shows the geographic impact of X. F. Ang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by X. F. Ang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites X. F. Ang more than expected).

Fields of papers citing papers by X. F. Ang

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by X. F. Ang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by X. F. Ang. The network helps show where X. F. Ang may publish in the future.

Co-authorship network of co-authors of X. F. Ang

This figure shows the co-authorship network connecting the top 25 collaborators of X. F. Ang. A scholar is included among the top collaborators of X. F. Ang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with X. F. Ang. X. F. Ang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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18 of 18 papers shown

#	Work	Indexed citations
1	Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication 2012 ·Journal of Electronic Materials ·(unknown), Wahyuaji Narottama Putra, (unknown), Shan Gao, Woocheol Kwon, Fa Xing, X. F. Ang, Jun Wei, Riko I Made, Chee Lip Gan, K. L. Pey	134
2	Low temperature CuCu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement 2011 ·Microelectronics Reliability ·Chuan Seng Tan, D. F. Lim, X. F. Ang, Jun Wei, Kam W. Leong	62
3	<I>In-Situ</I> Monitoring of the Thermal Desorption of Alkanethiols with Surface Plasmon Resonance Spectroscopy (SPRS) 2010 ·Journal of Nanoscience and Nanotechnology ·Jia Li, X. F. Ang, Kyu Han Lee, Filippo Romanato, (unknown)	4
4	Void Density Reduction at the Cu–Cu Bonding Interface by Means of Prebonding Surface Passivation with Self-Assembled Monolayer 2010 ·Electrochemical and Solid-State Letters ·D. F. Lim, X. F. Ang, Jun Wei, C. M. Ng, Chuan Seng Tan	10
5	Application of self assembly monolayer (SAM) in lowering the process temperature during Cu-Cu diffusion bonding of 3D IC 2009 ·D. F. Lim, Shiv Govind Singh, X. F. Ang, Jun Wei, (unknown), Chuan Seng Tan	10
6	Advanced high density interconnect materials and techniques 2009 ·Jun Wei, Mui Ling Sharon Nai, X. F. Ang, (unknown)	6
7	Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation 2009 ·D. F. Lim, Shiv Govind Singh, X. F. Ang, Jun Wei, C. M. Ng, Chuan Seng Tan	16
8	Low Temperature Copper-Copper Thermocompression Bonding 2008 ·X. F. Ang, A. T. Lin, Jun Wei, Zhong Chen, Chee Chung Wong	16
9	Stability of Self-Assembled Monolayers on Gold for MEMS/NEMS Applications 2008 ·X. F. Ang, A. T. Lin, J. Li, Jun Wei, Zhong Chen, Chee Chung Wong	2
10	Effect of chain length on low temperature gold-gold bonding by self-assembled monolayers 2008 ·Applied Physics Letters ·X. F. Ang, Zhong Chen, Christian Wong, Jun Wei	15
11	Ordered macroporous gold thin film with encaptured polymer spheres 2008 ·Applied Physics A ·Qingfeng Yan, X. F. Ang, Christian Wong, Yet‐Ming Chiang	1
12	A thermal and passivation study of self-assembled monolayers on thin gold films 2007 ·Thin Solid Films ·X. F. Ang, (unknown), Jun Wei, (unknown), Christian Wong	6
13	Self-assembled monolayers for reduced temperature direct metal thermocompression bonding 2007 ·Applied Physics Letters ·X. F. Ang, (unknown), (unknown), Zhong Chen, Chee Chung Wong, Jun Wei	15
14	Critical temperatures in thermocompression gold stud bonding 2007 ·Journal of Applied Physics ·(unknown), X. F. Ang, Zhong Chen, Christian Wong, Jun Wei	17
15	Direct Metal to Metal Bonding for Microsystems Interconnections and Integration 2006 ·X. F. Ang, (unknown), (unknown), Jun Wei, (unknown), Christian Wong	4
16	Pressure dependence in peripheral bonding in gold-gold thermocompression 2006 ·X. F. Ang, (unknown), Jun Wei, (unknown), Christian Wong	1
17	Enhancing direct metal bonding with self-assembled monolayers 2005 ·Thin Solid Films ·(unknown), X. F. Ang, Jun Wei, Zhong Chen, Christian Wong	4
18	Temperature and pressure dependence in thermocompression gold stud bonding 2005 ·Thin Solid Films ·X. F. Ang, (unknown), Jun Wei, Zhong Chen, Christian Wong	18

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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