Markus Wimplinger

1.2k total citations
75 papers, 895 citations indexed

About

Markus Wimplinger is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Automotive Engineering. According to data from OpenAlex, Markus Wimplinger has authored 75 papers receiving a total of 895 indexed citations (citations by other indexed papers that have themselves been cited), including 66 papers in Electrical and Electronic Engineering, 28 papers in Biomedical Engineering and 17 papers in Automotive Engineering. Recurrent topics in Markus Wimplinger's work include 3D IC and TSV technologies (57 papers), Electronic Packaging and Soldering Technologies (44 papers) and Additive Manufacturing and 3D Printing Technologies (17 papers). Markus Wimplinger is often cited by papers focused on 3D IC and TSV technologies (57 papers), Electronic Packaging and Soldering Technologies (44 papers) and Additive Manufacturing and 3D Printing Technologies (17 papers). Markus Wimplinger collaborates with scholars based in Austria, France and United States. Markus Wimplinger's co-authors include Viorel Drăgoi, Kurt Hingerl, Nasser Razek, Günter Hesser, Frank Dimroth, Paul Beutel, Stefan W. Glunz, David Lackner, Martin Hermle and Jan Benick and has published in prestigious journals such as Journal of Applied Physics, Nature Energy and Japanese Journal of Applied Physics.

In The Last Decade

Markus Wimplinger

69 papers receiving 847 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Markus Wimplinger Austria 11 806 270 129 106 95 75 895
M. J. Wolf Germany 13 540 0.7× 126 0.5× 45 0.3× 82 0.8× 59 0.6× 41 606
Liam G. Connolly United States 11 373 0.5× 152 0.6× 128 1.0× 72 0.7× 133 1.4× 19 532
Thomas Signamarcheix France 14 685 0.8× 164 0.6× 181 1.4× 42 0.4× 136 1.4× 38 741
Min Miao China 12 529 0.7× 104 0.4× 53 0.4× 54 0.5× 170 1.8× 146 702
A. Katsuki Japan 12 569 0.7× 223 0.8× 64 0.5× 55 0.5× 96 1.0× 69 753
T. Hayashi United States 11 259 0.3× 107 0.4× 71 0.6× 91 0.9× 88 0.9× 35 477
Cong Li China 17 834 1.0× 175 0.6× 42 0.3× 80 0.8× 59 0.6× 81 887
Sung-Hwan Hwang United States 11 367 0.5× 107 0.4× 51 0.4× 31 0.3× 81 0.9× 28 498
Serguei Stoukatch Belgium 13 645 0.8× 234 0.9× 76 0.6× 92 0.9× 48 0.5× 54 787
Riet Labie Belgium 18 1.1k 1.4× 165 0.6× 152 1.2× 79 0.7× 85 0.9× 58 1.2k

Countries citing papers authored by Markus Wimplinger

Since Specialization
Citations

This map shows the geographic impact of Markus Wimplinger's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Markus Wimplinger with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Markus Wimplinger more than expected).

Fields of papers citing papers by Markus Wimplinger

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Markus Wimplinger. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Markus Wimplinger. The network helps show where Markus Wimplinger may publish in the future.

Co-authorship network of co-authors of Markus Wimplinger

This figure shows the co-authorship network connecting the top 25 collaborators of Markus Wimplinger. A scholar is included among the top collaborators of Markus Wimplinger based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Markus Wimplinger. Markus Wimplinger is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Fournel, Frank, et al.. (2025). TEOS and thermal oxide low temperature direct wafer bonding dynamics. Japanese Journal of Applied Physics. 64(4). 04SP17–04SP17.
2.
Ghosh, Souvik, Quentin Smets, T. Schram, et al.. (2024). EOT Scaling Via 300mm MX2 Dry Transfer - Steps Toward a Manufacturable Process Development and Device Integration. 1–2. 2 indexed citations
3.
Ma, Kai, Nikolaos Bekiaris, Ching‐Hsiang Hsu, et al.. (2024). 0.5 μm Pitch Wafer-to-wafer Hybrid Bonding at Low Temperatures with SiCN Bond Layer. 331–336. 7 indexed citations
4.
Fournel, Frank, et al.. (2024). TEOS and Thermal Oxide Low Temperature Direct Wafer Bonding Dynamics. 1–1. 1 indexed citations
5.
Fournel, Frank, et al.. (2023). Inline Bondwave Monitoring for Direct Bonding, Process Optimization and Impact on Post-Bond Distortion. ECS Meeting Abstracts. MA2023-02(33). 1587–1587.
6.
Li, Suwen, et al.. (2023). Enabling layer transfer and back-side power delivery network applications by wafer bonding and scanner correction optimizations. SPIRE - Sciences Po Institutional REpository. 76–76. 7 indexed citations
7.
Montméat, Pierre, et al.. (2019). Application of temporary adherence to improve the manufacturing of 3D thin silicon wafers. International Journal of Adhesion and Adhesives. 91. 123–130. 11 indexed citations
8.
Cariou, Romain, Jan Benick, Frank Feldmann, et al.. (2018). Author Correction: III–V-on-silicon solar cells reaching 33% photoconversion efficiency in two-terminal configuration. Nature Energy. 3(6). 529–529. 1 indexed citations
9.
Cariou, Romain, Jan Benick, Frank Feldmann, et al.. (2018). III–V-on-silicon solar cells reaching 33% photoconversion efficiency in two-terminal configuration. Nature Energy. 3(4). 326–333. 261 indexed citations
10.
Vos, Joeri De, Lan Peng, Alain Phommahaxay, et al.. (2016). Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects. 1–5. 10 indexed citations
11.
Teyssèdre, H., et al.. (2016). Critical dimension uniformity characterization of nanoimprinted trenches for high volume manufacturing qualification. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 10032. 100320M–100320M. 3 indexed citations
12.
Uhrmann, Thomas, et al.. (2015). Influencing factors in high precision fusion wafer bonding for monolithic integration. 906–909. 3 indexed citations
13.
Gong, Jie, et al.. (2015). Wafer edge defect study of temporary bonded and thin wafers in TSV process flow. 1707–1712. 6 indexed citations
14.
Uhrmann, Thomas, et al.. (2014). Temporary bonding on the move towards high volume: A status update on cost-of-ownership. 378–382. 2 indexed citations
15.
Fournel, Frank, et al.. (2014). Delamination Root Cause in Temporary Bonding. ECS Transactions. 64(5). 187–195. 1 indexed citations
16.
Uhrmann, Thomas, et al.. (2014). Monolithic IC integration key alignment aspects for high process yield. 1–2. 4 indexed citations
17.
Hingerl, Kurt, et al.. (2013). Mechanisms for room temperature direct wafer bonding. Journal of Applied Physics. 113(9). 140 indexed citations
18.
Rebhan, Bernhard, Günter Hesser, Jiri Duchoslav, et al.. (2013). Low-Temperature Cu-Cu Wafer Bonding. ECS Transactions. 50(7). 139–149. 29 indexed citations
19.
Drăgoi, Viorel, et al.. (2010). Metal Thermocompression Wafer Bonding for 3D Integration and MEMS Applications. ECS Transactions. 33(4). 27–35. 21 indexed citations
20.
Pillalamarri, Sunil K., et al.. (2007). High-Temperature Spin-On Adhesives for Temporary Wafer Bonding. Journal of Microelectronics and Electronic Packaging. 4(3). 105–111. 15 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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