Christoph Flötgen

423 total citations
18 papers, 226 citations indexed

About

Christoph Flötgen is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Biomedical Engineering. According to data from OpenAlex, Christoph Flötgen has authored 18 papers receiving a total of 226 indexed citations (citations by other indexed papers that have themselves been cited), including 18 papers in Electrical and Electronic Engineering, 4 papers in Automotive Engineering and 3 papers in Biomedical Engineering. Recurrent topics in Christoph Flötgen's work include 3D IC and TSV technologies (14 papers), Electronic Packaging and Soldering Technologies (9 papers) and Semiconductor materials and devices (4 papers). Christoph Flötgen is often cited by papers focused on 3D IC and TSV technologies (14 papers), Electronic Packaging and Soldering Technologies (9 papers) and Semiconductor materials and devices (4 papers). Christoph Flötgen collaborates with scholars based in Austria, United States and Germany. Christoph Flötgen's co-authors include Achim von Keudell, Rüdiger Reuter, Nasser Razek, Markus Wimplinger, Viorel Drăgoi, Frank Dimroth, David Lackner, Stefan W. Glunz, Andreas W. Bett and Paul Beutel and has published in prestigious journals such as Applied Physics Letters, Journal of Physics D Applied Physics and IEEE Journal of Photovoltaics.

In The Last Decade

Christoph Flötgen

18 papers receiving 219 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Christoph Flötgen Austria 8 202 38 37 35 33 18 226
Veerle Simons Belgium 11 357 1.8× 25 0.7× 68 1.8× 51 1.5× 26 0.8× 25 413
Nicolas Mauran France 8 208 1.0× 99 2.6× 40 1.1× 45 1.3× 117 3.5× 19 339
А. М. Орлов Russia 7 113 0.6× 63 1.7× 21 0.6× 39 1.1× 14 0.4× 49 156
Michael Belyansky United States 12 191 0.9× 101 2.7× 52 1.4× 30 0.9× 36 1.1× 29 262
Robert A. Atkins United States 12 341 1.7× 21 0.6× 48 1.3× 73 2.1× 23 0.7× 23 422
Quanling Peng China 9 216 1.1× 15 0.4× 163 4.4× 22 0.6× 13 0.4× 36 331
Andrew Greene United States 9 161 0.8× 48 1.3× 55 1.5× 46 1.3× 13 0.4× 33 234
Zhijian Li China 10 202 1.0× 63 1.7× 118 3.2× 73 2.1× 9 0.3× 46 298
B. Elsner Germany 9 131 0.6× 85 2.2× 40 1.1× 109 3.1× 19 0.6× 15 254
R. Kraft United States 7 163 0.8× 62 1.6× 65 1.8× 25 0.7× 27 0.8× 20 212

Countries citing papers authored by Christoph Flötgen

Since Specialization
Citations

This map shows the geographic impact of Christoph Flötgen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Christoph Flötgen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Christoph Flötgen more than expected).

Fields of papers citing papers by Christoph Flötgen

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Christoph Flötgen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Christoph Flötgen. The network helps show where Christoph Flötgen may publish in the future.

Co-authorship network of co-authors of Christoph Flötgen

This figure shows the co-authorship network connecting the top 25 collaborators of Christoph Flötgen. A scholar is included among the top collaborators of Christoph Flötgen based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Christoph Flötgen. Christoph Flötgen is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

18 of 18 papers shown
1.
Duchoslav, Jiri, Alexey Minenkov, Jacek Gąsiorowski, et al.. (2022). A model for spectroscopic ellipsometry analysis of plasma-activated Si surfaces for direct wafer bonding. Applied Physics Letters. 121(8). 10 indexed citations
2.
Liao, Michael E., Kenny Huynh, Tingyu Bai, Christoph Flötgen, & Mark S. Goorsky. (2020). Ion Species Dependence on the Interfacial Properties of Silicon Homojunctions Bonded Using an Ion Bombardment Treatment. ECS Transactions. 98(4). 81–85. 1 indexed citations
3.
Lackner, David, Jonas Schön, Felix Predan, et al.. (2019). Radiation hard four-junction space solar cell based on GaInAsP alloys. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 68. 1–3. 5 indexed citations
4.
Liao, Michael E., et al.. (2018). Characterization of Wafer-Bonded Oxide-Free Silicon with Surfaces Treated with an Ion-Bombardment Procedure. ECS Transactions. 86(5). 55–59. 5 indexed citations
5.
Hinterreiter, Andreas, Bernhard Rebhan, Christoph Flötgen, Viorel Drăgoi, & Kurt Hingerl. (2017). Surface pretreated low-temperature aluminum–aluminum wafer bonding. Microsystem Technologies. 24(1). 773–777. 8 indexed citations
6.
Cariou, Romain, Jan Benick, Paul Beutel, et al.. (2016). Monolithic Two-Terminal III–V//Si Triple-Junction Solar Cells With 30.2% Efficiency Under 1-Sun AM1.5g. IEEE Journal of Photovoltaics. 7(1). 367–373. 92 indexed citations
7.
Flötgen, Christoph, Nasser Razek, Viorel Drăgoi, & Markus Wimplinger. (2016). Conductive Semiconductor Interfaces Fabricated by Room Temperature Covalent Wafer Bonding. ECS Meeting Abstracts. MA2016-02(32). 2071–2071. 1 indexed citations
8.
Flötgen, Christoph, Nasser Razek, Viorel Drăgoi, & Markus Wimplinger. (2016). Conductive Semiconductor Interfaces Fabricated by Room Temperature Covalent Wafer Bonding. ECS Transactions. 75(9). 45–51. 4 indexed citations
9.
Flötgen, Christoph, Nasser Razek, Viorel Drăgoi, & Markus Wimplinger. (2014). Novel Surface Preparation Methods for Covalent and Conductive Bonded Interfaces Fabrication. ECS Transactions. 64(5). 103–110. 9 indexed citations
10.
Flötgen, Christoph, Nasser Razek, Viorel Drăgoi, & Markus Wimplinger. (2014). Novel Surface Preparation Methods for Covalent and Conductive Bonded Interfaces Fabrication. ECS Meeting Abstracts. MA2014-02(34). 1752–1752. 1 indexed citations
11.
Flötgen, Christoph, et al.. (2013). Cu-Sn transient liquid phase wafer bonding for MEMS applications. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 8763. 87630A–87630A. 8 indexed citations
12.
Drăgoi, Viorel, et al.. (2013). Wafer bonding for vacuum encapsulated MEMS. 17–20. 1 indexed citations
13.
Flötgen, Christoph, et al.. (2013). Wafer bonding using Cu–Sn intermetallic bonding layers. Microsystem Technologies. 20(4-5). 653–662. 17 indexed citations
14.
Drăgoi, Viorel, et al.. (2012). Wafer bonding for CMOS integration and packaging. 14. 166–170. 2 indexed citations
15.
Drăgoi, Viorel, et al.. (2012). Metal wafer bonding for 3D interconnects and advanced packaging. 7. 114–120. 2 indexed citations
16.
Drăgoi, Viorel, et al.. (2011). CMOS-compatible aligned fusion wafer bonding. 14. 141–144. 2 indexed citations
17.
Reuter, Rüdiger, et al.. (2010). Calibration of a miniaturized retarding field analyzer for low-temperature plasmas: geometrical transparency and collisional effects. Journal of Physics D Applied Physics. 43(5). 55203–55203. 47 indexed citations
18.
Benedikt, Jan, et al.. (2008). Etching ofBacillus atrophaeusby oxygen atoms, molecules and argon ions. Journal of Physics Conference Series. 133. 12012–12012. 11 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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