Knut E. Aasmundtveit

2.1k total citations
136 papers, 1.8k citations indexed

About

Knut E. Aasmundtveit is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanical Engineering. According to data from OpenAlex, Knut E. Aasmundtveit has authored 136 papers receiving a total of 1.8k indexed citations (citations by other indexed papers that have themselves been cited), including 95 papers in Electrical and Electronic Engineering, 42 papers in Biomedical Engineering and 37 papers in Mechanical Engineering. Recurrent topics in Knut E. Aasmundtveit's work include Electronic Packaging and Soldering Technologies (69 papers), 3D IC and TSV technologies (44 papers) and Advanced Sensor and Energy Harvesting Materials (19 papers). Knut E. Aasmundtveit is often cited by papers focused on Electronic Packaging and Soldering Technologies (69 papers), 3D IC and TSV technologies (44 papers) and Advanced Sensor and Energy Harvesting Materials (19 papers). Knut E. Aasmundtveit collaborates with scholars based in Norway, United Kingdom and France. Knut E. Aasmundtveit's co-authors include Nils Høivik, E.J. Sämuelsen, Leif A. A. Pettersson, Olle Inganäs, Tomas Johansson, R. Feidenhans’l, Kaiying Wang, Hoang‐Vu Nguyen, Andreas Larsson and Ole Martin Løvvik and has published in prestigious journals such as Applied Physics Letters, Macromolecules and ACS Applied Materials & Interfaces.

In The Last Decade

Knut E. Aasmundtveit

125 papers receiving 1.7k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Knut E. Aasmundtveit Norway 18 1.3k 673 550 388 312 136 1.8k
Young‐Ho Kim South Korea 21 1.3k 1.0× 274 0.4× 230 0.4× 398 1.0× 442 1.4× 158 1.7k
Darran R. Cairns United States 18 981 0.8× 370 0.5× 762 1.4× 150 0.4× 605 1.9× 59 1.6k
Jialuo Han Australia 27 839 0.7× 305 0.5× 961 1.7× 292 0.8× 654 2.1× 37 1.8k
Shuhai Liu China 25 1.5k 1.2× 391 0.6× 1.1k 1.9× 326 0.8× 1.1k 3.5× 60 2.7k
Jay Lewis United States 16 1.1k 0.8× 288 0.4× 503 0.9× 103 0.3× 734 2.4× 56 1.6k
Frank D. Egitto United States 20 731 0.6× 289 0.4× 631 1.1× 96 0.2× 404 1.3× 63 1.5k
Sergio Ferrero Italy 22 937 0.7× 190 0.3× 689 1.3× 136 0.4× 501 1.6× 102 1.7k
Dong‐Jin Yun South Korea 31 2.2k 1.8× 809 1.2× 624 1.1× 129 0.3× 1.3k 4.1× 130 2.9k
Maoxiang Hou China 21 1.1k 0.9× 151 0.2× 649 1.2× 149 0.4× 249 0.8× 63 1.7k
Minghua Li China 17 744 0.6× 488 0.7× 951 1.7× 122 0.3× 438 1.4× 65 1.8k

Countries citing papers authored by Knut E. Aasmundtveit

Since Specialization
Citations

This map shows the geographic impact of Knut E. Aasmundtveit's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Knut E. Aasmundtveit with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Knut E. Aasmundtveit more than expected).

Fields of papers citing papers by Knut E. Aasmundtveit

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Knut E. Aasmundtveit. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Knut E. Aasmundtveit. The network helps show where Knut E. Aasmundtveit may publish in the future.

Co-authorship network of co-authors of Knut E. Aasmundtveit

This figure shows the co-authorship network connecting the top 25 collaborators of Knut E. Aasmundtveit. A scholar is included among the top collaborators of Knut E. Aasmundtveit based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Knut E. Aasmundtveit. Knut E. Aasmundtveit is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Aasmundtveit, Knut E., et al.. (2024). Compliant Interconnects Based on Single Micrometer-sized Metal-Coated Polymer Spheres. ACS Applied Materials & Interfaces. 16(44). 60958–60966. 1 indexed citations
2.
Aasmundtveit, Knut E., et al.. (2024). Enabling Low Pressure, Low Temperature, and Particle Control for Anisotropic Conductive Adhesives. Advanced Materials Technologies. 9(15). 3 indexed citations
3.
Aasmundtveit, Knut E., et al.. (2024). Solid–Liquid Diffusion Stresses Leading to Voiding. Metallurgical and Materials Transactions A. 56(1). 219–227.
4.
Nguyen, Hoang‐Vu, et al.. (2023). Ag–(In–Bi) solid-state bonding. Journal of Materials Science Materials in Electronics. 34(16). 1 indexed citations
5.
6.
Rebhan, Bernhard, Vesa Vuorinen, Mervi Paulasto‐Kröckel, et al.. (2023). Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration. ECS Transactions. 112(3). 247–263. 1 indexed citations
7.
Nguyen, Hoang‐Vu, et al.. (2022). Ag-(In-Bi) Solid–Liquid Interdiffusion Bonding. Journal of Electronic Materials. 52(2). 1284–1294. 5 indexed citations
8.
Akram, Muhammad Nadeem, et al.. (2021). Design of Silicon Cap for Hermetic Packaging of Microbolometer Focal Plane Arrays. IEEE Transactions on Components Packaging and Manufacturing Technology. 12(3). 429–436. 4 indexed citations
9.
Aasmundtveit, Knut E., et al.. (2018). Phase Determination in SLID Bonding. 1–6. 4 indexed citations
10.
Kristiansen, Helge, et al.. (2016). Investigation of contacts between metal and transparent conductive oxides. 1–4. 3 indexed citations
11.
Aasmundtveit, Knut E., Thi‐Thuy Luu, Kaiying Wang, & Nils Høivik. (2015). Void formation in Cu-Sn Solid-Liquid Interdiffusion (SLID) bonding. European Microelectronics and Packaging Conference. 6 indexed citations
12.
Nguyen, Hoang‐Vu, et al.. (2015). Assembly of transducer array using anisotropic conductive film for medical imaging applications. European Microelectronics and Packaging Conference. 5 indexed citations
13.
Aasmundtveit, Knut E., et al.. (2013). Solid-Liquid Interdiffusion (SLID) bonding — Intermetallic bonding for high temperature applications. European Microelectronics and Packaging Conference. 1–6. 2 indexed citations
14.
Aasmundtveit, Knut E., et al.. (2013). Development of a conductometric biocompatible sensor for detecting ischemia. European Microelectronics and Packaging Conference. 1–4. 1 indexed citations
15.
Kristiansen, Helge, et al.. (2009). Investigation of compliant interconnect for ball grid array (BGA). European Microelectronics and Packaging Conference. 1–6. 5 indexed citations
16.
Aasmundtveit, Knut E., et al.. (2008). Micro ribbon cable bonding for an implantable device. 50. 265–270. 4 indexed citations
17.
Aasmundtveit, Knut E., et al.. (2007). Assembly and packaging of a three-axis micro accelerometer used for detection of heart infarction. Biomedical Microdevices. 9(6). 951–957. 28 indexed citations
18.
Aasmundtveit, Knut E., et al.. (2000). Structural studies of polyalkylthiophenes with alternating sidechain positioning. Synthetic Metals. 113(1-2). 7–18. 15 indexed citations
19.
Aasmundtveit, Knut E., et al.. (1999). EXAFS studies of iodine-doped poly(octylthiophene). Synthetic Metals. 101(1-3). 363–364. 10 indexed citations
20.
Corish, J., et al.. (1999). Lattice simulations of thermochromic distortions in poly(alkylthiophene)s. Synthetic Metals. 101(1-3). 318–319. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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