Paul Lindner

603 total citations
61 papers, 432 citations indexed

About

Paul Lindner is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Automotive Engineering. According to data from OpenAlex, Paul Lindner has authored 61 papers receiving a total of 432 indexed citations (citations by other indexed papers that have themselves been cited), including 53 papers in Electrical and Electronic Engineering, 25 papers in Biomedical Engineering and 10 papers in Automotive Engineering. Recurrent topics in Paul Lindner's work include 3D IC and TSV technologies (43 papers), Electronic Packaging and Soldering Technologies (32 papers) and Nanofabrication and Lithography Techniques (14 papers). Paul Lindner is often cited by papers focused on 3D IC and TSV technologies (43 papers), Electronic Packaging and Soldering Technologies (32 papers) and Nanofabrication and Lithography Techniques (14 papers). Paul Lindner collaborates with scholars based in Austria, United States and Germany. Paul Lindner's co-authors include Viorel Drăgoi, Markus Wimplinger, T. Glinsner, H. Hoffmann, J. Kalus, Thomas Uhrmann, V. K. Jindal, Bernard Cabane, T. Matthias and Shari Farrens and has published in prestigious journals such as The Journal of Physical Chemistry, Physical Chemistry Chemical Physics and Journal of Applied Crystallography.

In The Last Decade

Paul Lindner

59 papers receiving 410 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Paul Lindner Austria	11	269	133	90	54	44	61	432
Chun-Ming Hsu United States	14	751 2.8×	314 2.4×	77 0.9×	131 2.4×	7 0.2×	32	1.0k
Lingling Shui Netherlands	12	302 1.1×	435 3.3×	52 0.6×	80 1.5×	7 0.2×	18	686
Sze Yi Mak Hong Kong	12	133 0.5×	305 2.3×	28 0.3×	103 1.9×	9 0.2×	21	409
Catherine Allain France	11	102 0.4×	102 0.8×	28 0.3×	64 1.2×	6 0.1×	18	352
M. Parthasarathy United States	5	45 0.2×	362 2.7×	33 0.4×	108 2.0×	8 0.2×	5	741
Kamakshi Jagannathan United States	10	76 0.3×	100 0.8×	12 0.1×	164 3.0×	55 1.3×	19	362
Dustin D. Gerrard United States	11	260 1.0×	187 1.4×	40 0.4×	98 1.8×	5 0.1×	22	422
B. Guerrier France	14	192 0.7×	112 0.8×	20 0.2×	73 1.4×	2 0.0×	22	395
S. Thijs Belgium	16	994 3.7×	108 0.8×	19 0.2×	54 1.0×	8 0.2×	100	1.0k
Rodolphe Heyd France	9	97 0.4×	122 0.9×	34 0.4×	305 5.6×	3 0.1×	27	453

Countries citing papers authored by Paul Lindner

Since Specialization

Citations

This map shows the geographic impact of Paul Lindner's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Paul Lindner with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Paul Lindner more than expected).

Fields of papers citing papers by Paul Lindner

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Paul Lindner. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Paul Lindner. The network helps show where Paul Lindner may publish in the future.

Co-authorship network of co-authors of Paul Lindner

This figure shows the co-authorship network connecting the top 25 collaborators of Paul Lindner. A scholar is included among the top collaborators of Paul Lindner based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Paul Lindner. Paul Lindner is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

1.

Rebhan, Bernhard, et al.. (2018). (Invited) High Accuracy Aligned Wafer Bonding for Wafer-Level Integration. ECS Meeting Abstracts. MA2018-02(29). 962–962. 1 indexed citations

2.

Uhrmann, Thomas, et al.. (2015). Influencing factors in high precision fusion wafer bonding for monolithic integration. 906–909. 3 indexed citations

3.

Gong, Jie, et al.. (2015). Wafer edge defect study of temporary bonded and thin wafers in TSV process flow. 1707–1712. 6 indexed citations

4.

Uhrmann, Thomas, et al.. (2014). Temporary bonding on the move towards high volume: A status update on cost-of-ownership. 378–382. 2 indexed citations

5.

Uhrmann, Thomas, et al.. (2014). Monolithic IC integration key alignment aspects for high process yield. 1–2. 4 indexed citations

6.

Uhrmann, Thomas, et al.. (2014). Fusion bonding for next- generation 3D-ICs. 1 indexed citations

7.

Uhrmann, Thomas, et al.. (2012). Wafer Bonding for Backside Illuminated Image Sensors. ECS Transactions. 44(1). 1269–1274. 1 indexed citations

8.

Lindner, Paul, T. Glinsner, Thomas Uhrmann, et al.. (2012). Key enabling processes for more-than-moore technologies. 1–2. 2 indexed citations

9.

Wimplinger, Markus, et al.. (2011). Thin wafer processing - yield enhancement through integrated metrology. 113–116. 3 indexed citations

10.

Drăgoi, Viorel, et al.. (2011). Low temperature packaging of BioMEMS and Lab-on-chip devices. 562–566. 1 indexed citations

11.

Glinsner, T., Ulrich Plachetka, T. Matthias, Markus Wimplinger, & Paul Lindner. (2007). Soft UV-based nanoimprint lithography for large-area imprinting applications. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 6517. 651718–651718. 9 indexed citations

12.

Lindner, Paul. (2007). The Optical Rotating Power of Organic Substances and Its Practical Applications. 2 indexed citations

13.

Drăgoi, Viorel, Paul Lindner, Marin Alexe, et al.. (2006). III/V Wafer Bonding Technology for Wafer-Level Fabrication of GaInAsP/InP Microring Resonators. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 687. 129–132. 1 indexed citations

14.

Drăgoi, Viorel, et al.. (2005). Low temperature wafer bonding for microsystems applications. 1. 199–202. 2 indexed citations

15.

Farrens, Shari, et al.. (2003). Beginning-to-end wafer bonding for advanced optical systems. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 5177. 31–31. 2 indexed citations

16.

Lindner, Paul, et al.. (2003). One micron precision optically aligned method for hot-embossing and nanoimprinting. 2. 931–935. 4 indexed citations

17.

Lindner, Paul, et al.. (2003). Advances in lithography technologies for wafer-level packaging. 5116. 126–129. 1 indexed citations

18.

Drăgoi, Viorel, et al.. (2002). New challenges for 300mm Si technology: 3D interconnects at wafer scale by aligned wafer bonding. Materials Science in Semiconductor Processing. 5(4-5). 425–428. 8 indexed citations

19.

Drăgoi, Viorel, et al.. (2001). Si/GaAs heterostructures fabricated by direct wafer bonding. MRS Proceedings. 681. 4 indexed citations

20.

Glinsner, T., et al.. (2001). Reversible and Permanent Wafer Bonding for GaAs Processing. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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