C. S. Hsiao

410 total citations
51 papers, 316 citations indexed

About

C. S. Hsiao is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Hardware and Architecture. According to data from OpenAlex, C. S. Hsiao has authored 51 papers receiving a total of 316 indexed citations (citations by other indexed papers that have themselves been cited), including 48 papers in Electrical and Electronic Engineering, 9 papers in Mechanical Engineering and 4 papers in Hardware and Architecture. Recurrent topics in C. S. Hsiao's work include 3D IC and TSV technologies (46 papers), Electronic Packaging and Soldering Technologies (42 papers) and Electromagnetic Compatibility and Noise Suppression (10 papers). C. S. Hsiao is often cited by papers focused on 3D IC and TSV technologies (46 papers), Electronic Packaging and Soldering Technologies (42 papers) and Electromagnetic Compatibility and Noise Suppression (10 papers). C. S. Hsiao collaborates with scholars based in Taiwan. C. S. Hsiao's co-authors include Eason Chen, Yu-Po Wang, Don Son Jiang, James W. Chan, Yu Wang, Yusheng Wang, John H. Lau, B. Wallace, Yin-Tien Wang and Yu‐Wei Lin and has published in prestigious journals such as Sensors and Electronics.

In The Last Decade

C. S. Hsiao

49 papers receiving 288 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
C. S. Hsiao Taiwan 11 288 65 26 26 24 51 316
Jie Xue United States 9 284 1.0× 84 1.3× 20 0.8× 24 0.9× 24 1.0× 37 308
Chih-Pin Hung Taiwan 11 268 0.9× 44 0.7× 14 0.5× 25 1.0× 22 0.9× 50 291
Xavier Baraton Singapore 12 371 1.3× 95 1.5× 95 3.7× 18 0.7× 14 0.6× 24 396
E Perfecto United States 10 222 0.8× 60 0.9× 18 0.7× 20 0.8× 19 0.8× 48 257
Vempati Srinivasa Rao Singapore 10 288 1.0× 59 0.9× 15 0.6× 30 1.2× 10 0.4× 42 330
Jiefeng Xu United States 14 328 1.1× 117 1.8× 81 3.1× 36 1.4× 27 1.1× 24 382
Karsten Meier Germany 9 297 1.0× 132 2.0× 83 3.2× 33 1.3× 34 1.4× 96 328
Sayuri Kohara Japan 9 279 1.0× 53 0.8× 9 0.3× 64 2.5× 17 0.7× 52 310
Ahmer Syed United States 13 401 1.4× 153 2.4× 47 1.8× 15 0.6× 13 0.5× 36 422
Curtis Zwenger United States 9 282 1.0× 33 0.5× 17 0.7× 35 1.3× 8 0.3× 9 293

Countries citing papers authored by C. S. Hsiao

Since Specialization
Citations

This map shows the geographic impact of C. S. Hsiao's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. S. Hsiao with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. S. Hsiao more than expected).

Fields of papers citing papers by C. S. Hsiao

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C. S. Hsiao. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. S. Hsiao. The network helps show where C. S. Hsiao may publish in the future.

Co-authorship network of co-authors of C. S. Hsiao

This figure shows the co-authorship network connecting the top 25 collaborators of C. S. Hsiao. A scholar is included among the top collaborators of C. S. Hsiao based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C. S. Hsiao. C. S. Hsiao is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
2.
Hsiao, C. S., et al.. (2016). Advanced nano-Ag thermal interface material for high thermal flip chip BGA. 5 indexed citations
3.
Hsiao, C. S., et al.. (2013). A lead-frame pre-mold coreless substrate development. 1336–1340. 3 indexed citations
4.
Jiang, Don Son, et al.. (2013). Stress simulation and design optimal study for Cu pillar bump structure. 598–601. 14 indexed citations
5.
Chiang, J., et al.. (2011). Development of VCI (Vertical Circuit Interconnection) technology for stacked die package. 137–139. 1 indexed citations
6.
Chen, Eason, et al.. (2008). WLCSP parameter study for ball reliability analysis. 49–52. 10 indexed citations
7.
Hsiao, C. S., et al.. (2007). Molded underfill technology for low-k flip chip packages. 335–337. 3 indexed citations
8.
Hsiao, C. S., et al.. (2007). Advantage and challenge of coreless flip-chip BGA. 346–349. 7 indexed citations
9.
Hsiao, C. S., et al.. (2007). High Performance Molding FCBGA Packaging Development. 1–4. 4 indexed citations
10.
Hsiao, C. S., et al.. (2007). Thermal Degradation and Mass Transport of Underfill Material. 719–723. 1 indexed citations
11.
Hsiao, C. S., et al.. (2007). High Performance Coreless Flip-Chip BGA Packaging Technology. 1765–1768. 4 indexed citations
12.
Wang, Yusheng, et al.. (2006). Underfill Assessments and Validations for Low-k FCBGA. 1–4. 10 indexed citations
13.
Hsiao, C. S., et al.. (2006). Wire bond, flip-chip, and chip-scale-package solution to high silicon integration. 1386–1391. 2 indexed citations
14.
15.
Wang, Yu-Po, et al.. (2006). Board Level Drop Test and Simulation of CSP for Handheld Application. 1–4. 4 indexed citations
16.
Wang, Yu-Po, et al.. (2005). Effect of Solder Composition and Substrate Surface Finish on Board Level Drop Test Reliability. 1109–1113. 5 indexed citations
17.
Hsiao, C. S., et al.. (2005). The study of OSP as reliable surface finish of BGA substrate. 149–153. 20 indexed citations
18.
Chan, James W., et al.. (2004). Cost-performance wafer thinning technology. 1463–1467. 18 indexed citations
19.
Hsiao, C. S., et al.. (2003). Evaluation of Surface Finish on Build Up Substrate. 839–843. 2 indexed citations
20.
Wang, Yu-Po, et al.. (2002). The advent of 3-D package age. 102–107. 10 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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