Jong‐Kai Lin
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- General Materials Science top 10%
Papers in
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- Electronic Packaging and Soldering Technologies 29
- 3D IC and TSV technologies 26
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- Advanced Welding Techniques Analysis 6
- Aluminum Alloys Composites Properties 4
- Intermetallics and Advanced Alloy Properties 2
- Co-authors
- D. R. Frear (9 shared papers)Jin‐Wook Jang (9 shared papers)Fa Xing (6 shared papers)Xiaowu Zhang (5 shared papers)Li Li (3 shared papers)Yifan Guo (3 shared papers)Yang Rao (1 shared paper)Sean Hayes (2 shared papers)
- Journals
- IEEE Transactions on Electronics Packaging Manufacturing (3 papers)Journal of Applied Physics (2 papers)IEEE Design and Test (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)Journal of materials research/Pratt's guide to venture capital sources (1 paper)
- Partner nations
- United StatesSingaporeGermany
In The Last Decade
Jong‐Kai Lin
32 papers receiving 373 citations
Peers
Comparison fields: 5 of 25
- Electrical and Electronic Engineering 381
- General Materials Science 19
- Mechanical Engineering 187
- Electronic, Optical and Magnetic Materials 35
- Mechanics of Materials 36
Countries citing papers authored by Jong‐Kai Lin
This map shows the geographic impact of Jong‐Kai Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jong‐Kai Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jong‐Kai Lin more than expected).
Fields of papers citing papers by Jong‐Kai Lin
This network shows the impact of papers produced by Jong‐Kai Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jong‐Kai Lin. The network helps show where Jong‐Kai Lin may publish in the future.
Co-authors
The 25 scholars most cited alongside Jong‐Kai Lin, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 33 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 53 | |
| 2 | 2002 | 45 | |
| 3 | 2002 | 36 | |
| 4 | 2016 | 33 | |
| 5 | 2007 | 25 | |
| 6 | 2015 | 20 | |
| 7 | 2004 | 19 | |
| 8 | 2002 | 18 | |
| 9 | 2002 | 18 | |
| 10 | 2011 | 14 | |
| 11 | 2014 | 12 | |
| 12 | 2016 | 11 | |
| 13 | 2002 | 10 | |
| 14 | 2015 | 10 | |
| 15 | 2004 | 9 | |
| 16 | 2015 | 7 | |
| 17 | 2004 | 7 | |
| 18 | 2003 | 6 | |
| 19 | 2004 | 6 | |
| 20 | 2016 | 4 |
About Jong‐Kai Lin
Jong‐Kai Lin is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Biomedical Engineering, Mechanics of Materials and Electronic, Optical and Magnetic Materials, having authored 33 papers that have together received 394 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (26 papers), Advanced Welding Techniques Analysis (6 papers), Nanofabrication and Lithography Techniques (4 papers), Aluminum Alloys Composites Properties (4 papers), Copper Interconnects and Reliability (3 papers), Intermetallics and Advanced Alloy Properties (2 papers) and VLSI and Analog Circuit Testing (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (381 citations), General Materials Science (19 citations), Mechanical Engineering (187 citations), Electronic, Optical and Magnetic Materials (35 citations) and Mechanics of Materials (36 citations). Jong‐Kai Lin has collaborated with scholars based in United States, Singapore and Germany. Frequent co-authors include D. R. Frear, Jin‐Wook Jang, Fa Xing, Xiaowu Zhang, Li Li, Yifan Guo, Yang Rao, Sean Hayes, Ravi Sharma and R. Subrahmanyan. Their work appears in journals such as IEEE Transactions on Electronics Packaging Manufacturing, Journal of Applied Physics, IEEE Design and Test, IEEE Transactions on Components Packaging and Manufacturing Technology and Journal of materials research/Pratt's guide to venture capital sources.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.