Jong‐Kai Lin

493 total citations
33 papers, 394 citations indexed

About

Jong‐Kai Lin is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Biomedical Engineering. According to data from OpenAlex, Jong‐Kai Lin has authored 33 papers receiving a total of 394 indexed citations (citations by other indexed papers that have themselves been cited), including 33 papers in Electrical and Electronic Engineering, 12 papers in Mechanical Engineering and 5 papers in Biomedical Engineering. Recurrent topics in Jong‐Kai Lin's work include Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (26 papers) and Advanced Welding Techniques Analysis (6 papers). Jong‐Kai Lin is often cited by papers focused on Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (26 papers) and Advanced Welding Techniques Analysis (6 papers). Jong‐Kai Lin collaborates with scholars based in United States, Singapore and Germany. Jong‐Kai Lin's co-authors include D. R. Frear, Jin‐Wook Jang, Fa Xing, Xiaowu Zhang, Li Li, Yifan Guo, Yang Rao, Sean Hayes, Ravi Sharma and Christine Hau-Riege and has published in prestigious journals such as Journal of Applied Physics, Journal of materials research/Pratt's guide to venture capital sources and Microelectronics Reliability.

In The Last Decade

Jong‐Kai Lin

32 papers receiving 373 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Jong‐Kai Lin United States 12 381 187 36 35 33 33 394
Pilin Liu United States 8 332 0.9× 169 0.9× 42 1.2× 34 1.0× 31 0.9× 20 377
Tamás Hurtony Hungary 13 363 1.0× 243 1.3× 35 1.0× 28 0.8× 50 1.5× 43 411
P.L. Tu Hong Kong 10 510 1.3× 358 1.9× 47 1.3× 22 0.6× 66 2.0× 18 537
Don Son Jiang Taiwan 9 298 0.8× 210 1.1× 39 1.1× 30 0.9× 55 1.7× 36 359
Ahmer Syed United States 13 401 1.1× 153 0.8× 47 1.3× 50 1.4× 51 1.5× 36 422
Young-Doo Jeon South Korea 11 345 0.9× 180 1.0× 26 0.7× 26 0.7× 10 0.3× 18 359
G.Y. Li Singapore 8 298 0.8× 261 1.4× 36 1.0× 12 0.3× 71 2.2× 12 352
Kuo-Chuan Liu United States 11 333 0.9× 214 1.1× 19 0.5× 19 0.5× 52 1.6× 24 352
Jie Xue United States 9 284 0.7× 84 0.4× 20 0.6× 20 0.6× 42 1.3× 37 308

Countries citing papers authored by Jong‐Kai Lin

Since Specialization
Citations

This map shows the geographic impact of Jong‐Kai Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jong‐Kai Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jong‐Kai Lin more than expected).

Fields of papers citing papers by Jong‐Kai Lin

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jong‐Kai Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jong‐Kai Lin. The network helps show where Jong‐Kai Lin may publish in the future.

Co-authorship network of co-authors of Jong‐Kai Lin

This figure shows the co-authorship network connecting the top 25 collaborators of Jong‐Kai Lin. A scholar is included among the top collaborators of Jong‐Kai Lin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jong‐Kai Lin. Jong‐Kai Lin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Xing, Fa, Xiaowu Zhang, & Jong‐Kai Lin. (2016). Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis. Microelectronics Reliability. 61. 64–70. 33 indexed citations
2.
3.
4.
Xing, Fa, et al.. (2015). Development of compliant Cu pillar for flip chip package. 1–4. 3 indexed citations
5.
Weerasekera, Roshan, Songbai Zhang, Rahul Dutta, et al.. (2015). Heterogeneous system implementation using through-silicon interposer (TSI) technology. Bristol Research (University of Bristol). 391–394. 2 indexed citations
6.
7.
Hau-Riege, Christine, et al.. (2011). Electromigration studies of lead-free solder balls used for wafer-level packaging. 717–721. 14 indexed citations
8.
Jang, Jin‐Wook, et al.. (2004). Interfacial reaction of eutectic AuSi solder with Si (100) and Si (111) surfaces. Journal of Applied Physics. 95(11). 6077–6081. 19 indexed citations
9.
Jang, Jin‐Wook, et al.. (2004). Tensile fracture behaviors of solid-state-annealed eutectic SnPb and lead-free solder flip chip bumps. Journal of materials research/Pratt's guide to venture capital sources. 19(6). 1826–1834. 9 indexed citations
10.
Lin, Jong‐Kai, Jin‐Wook Jang, Sean Hayes, & D. R. Frear. (2004). Lead-free flip chip interconnect reliability for DCA and FC-PBGA packages. 643. 642–649. 6 indexed citations
11.
12.
Basaran, Cemal, et al.. (2004). Damage mechanics of microelectronics solder joints under high current densities. 32. 988–997. 7 indexed citations
13.
Jang, Jin‐Wook, et al.. (2004). Spalling of Cu3Sn intermetallics in high-lead 95Pb5Sn solder bumps on Cu under bump metallization during solid-state annealing. Journal of Applied Physics. 95(12). 8286–8289. 53 indexed citations
14.
Guo, Yifan, et al.. (2003). Reliability evaluations of chip interconnect in lead-free solder systems. 1275–1280. 6 indexed citations
15.
Lin, Jong‐Kai, et al.. (2002). Squeegee bump technology. 7. 46–53. 2 indexed citations
16.
Li, Li & Jong‐Kai Lin. (2002). Alternate solder bump technologies for flip chip applications. 124–130. 2 indexed citations
17.
Lin, Jong‐Kai, et al.. (2002). Thermal fatigue properties of lead-free solders on Cu and NiP under bump metallurgies. 26?2. 463–470. 18 indexed citations
18.
Lin, Jong‐Kai, et al.. (2000). Design analysis of an electroless plating bath using CFD technique. IEEE Transactions on Electronics Packaging Manufacturing. 23(4). 237–237. 1 indexed citations
19.
Sharma, Ravi, et al.. (1993). A New Method to Evaluate Thin Film Adhesion. The Journal of Adhesion. 40(2-4). 257–265. 3 indexed citations
20.
Lin, Jong‐Kai, et al.. (1993). An Assessment of Au Wire Bump Thermo-Mechanical Integrity in GaAs/Al2O3 Flip Chip Modules. MRS Proceedings. 323. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Pilin Liu Breakdown of academic impact, for papers by Tamás Hurtony Breakdown of academic impact, for papers by P.L. Tu Breakdown of academic impact, for papers by Don Son Jiang Breakdown of academic impact, for papers by Ahmer Syed Breakdown of academic impact, for papers by Young-Doo Jeon Breakdown of academic impact, for papers by G.Y. Li Breakdown of academic impact, for papers by Kuo-Chuan Liu Breakdown of academic impact, for papers by Jie Xue
Rankless by CCL
2026