W.C. Chiou
- Hardware and Architecture top 10%
- VLSI and Analog Circuit Testing 2
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- 3D IC and TSV technologies 14
- Semiconductor materials and devices 9
- Electronic Packaging and Soldering Technologies 8
- Advancements in Photolithography Techniques 3
- Integrated Circuits and Semiconductor Failure Analysis 2
- Advancements in Semiconductor Devices and Circuit Design 2
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- Copper Interconnects and Reliability 6
- Co-authors
- Douglas YuC. T. WangK. C. TingS. Y. HouChristine ChiuDoug C. H. YuCheng‐Hsien WuChung-Hao Tsai
- Journals
- IEEE Transactions on Electron Devices (2 papers)Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms (1 paper)Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE (1 paper)
- Partner nations
- TaiwanUnited StatesChina
In The Last Decade
W.C. Chiou
21 papers receiving 490 citations
Peers
Comparison fields: 5 of 37
- Hardware and Architecture 60
- Electrical and Electronic Engineering 467
- Automotive Engineering 50
- Electronic, Optical and Magnetic Materials 49
- Biomedical Engineering 75
Countries citing papers authored by W.C. Chiou
This map shows the geographic impact of W.C. Chiou's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by W.C. Chiou with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites W.C. Chiou more than expected).
Fields of papers citing papers by W.C. Chiou
This network shows the impact of papers produced by W.C. Chiou. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by W.C. Chiou. The network helps show where W.C. Chiou may publish in the future.
Co-authorship network
The 25 scholars most cited alongside W.C. Chiou, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2021 | 55 | |
| 2 | 2021 | 18 | |
| 3 | 2020 | 8 | |
| 4 | 2020 | 34 | |
| 5 | 2020 | 33 | |
| 6 | 2020 | 50 | |
| 7 | 2019 | 35 | |
| 8 | 2019 | 52 | |
| 9 | 2017 | 139 | |
| 10 | 2014 | 7 | |
| 11 | 2011 | 10 | |
| 12 | TSV process optimization for reduced device impact on 28nm CMOS | 2011 | 24 |
| 13 | 2009 | 34 | |
| 14 | 2008 | 2 | |
| 15 | 2008 | 2 | |
| 16 | 2005 | 0 | |
| 17 | 2004 | 2 | |
| 18 | 2003 | 4 | |
| 19 | 1996 | 2 | |
| 20 | 1987 | 1 |
About W.C. Chiou
W.C. Chiou is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Hardware and Architecture, Surfaces, Coatings and Films and Radiation, having authored 22 papers that have together received 517 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (14 papers), Semiconductor materials and devices (9 papers), Electronic Packaging and Soldering Technologies (8 papers), Copper Interconnects and Reliability (6 papers), Advancements in Photolithography Techniques (3 papers), Integrated Circuits and Semiconductor Failure Analysis (2 papers), VLSI and Analog Circuit Testing (2 papers) and Advancements in Semiconductor Devices and Circuit Design (2 papers). The work is most often cited by research in Hardware and Architecture (60 citations), Electrical and Electronic Engineering (467 citations), Automotive Engineering (50 citations), Electronic, Optical and Magnetic Materials (49 citations) and Biomedical Engineering (75 citations). W.C. Chiou has collaborated with scholars based in Taiwan, United States and China. Frequent co-authors include Douglas Yu, C. T. Wang, K. C. Ting, S. Y. Hou, Christine Chiu, Doug C. H. Yu, Cheng‐Hsien Wu, Chung-Hao Tsai, Chung-Hsien Tsai and Chi‐Hua Tung. Their work appears in journals such as IEEE Transactions on Electron Devices, Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms and Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.