Shin-Puu Jeng

1.5k total citations
58 papers, 1.0k citations indexed

About

Shin-Puu Jeng is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, Shin-Puu Jeng has authored 58 papers receiving a total of 1.0k indexed citations (citations by other indexed papers that have themselves been cited), including 47 papers in Electrical and Electronic Engineering, 16 papers in Electronic, Optical and Magnetic Materials and 14 papers in Materials Chemistry. Recurrent topics in Shin-Puu Jeng's work include 3D IC and TSV technologies (29 papers), Electronic Packaging and Soldering Technologies (25 papers) and Semiconductor materials and devices (18 papers). Shin-Puu Jeng is often cited by papers focused on 3D IC and TSV technologies (29 papers), Electronic Packaging and Soldering Technologies (25 papers) and Semiconductor materials and devices (18 papers). Shin-Puu Jeng collaborates with scholars based in Taiwan and United States. Shin-Puu Jeng's co-authors include Victor E. Henrich, Zhaoming Zhang, Paul H. Holloway, Christopher Batich, Robert Havemann, R. Canteri, Robert J. Lad, Tianxing Ma, Gary W. Rubloff and Mi-Chang Chang and has published in prestigious journals such as Physical review. B, Condensed matter, Applied Physics Letters and Journal of Applied Physics.

In The Last Decade

Shin-Puu Jeng

58 papers receiving 959 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Shin-Puu Jeng Taiwan 17 649 418 161 102 101 58 1.0k
Jan Mistrı́k Czechia 17 497 0.8× 442 1.1× 183 1.1× 117 1.1× 179 1.8× 64 903
Q. Fang China 21 1.1k 1.7× 631 1.5× 144 0.9× 44 0.4× 71 0.7× 76 1.4k
H.S. Reehal United Kingdom 14 549 0.8× 526 1.3× 109 0.7× 49 0.5× 255 2.5× 54 868
A. Hadjadj France 19 549 0.8× 555 1.3× 50 0.3× 69 0.7× 112 1.1× 64 875
D. L. Mafra United States 14 316 0.5× 674 1.6× 192 1.2× 159 1.6× 243 2.4× 22 993
Mao‐Kuo Wei Taiwan 18 696 1.1× 231 0.6× 67 0.4× 157 1.5× 206 2.0× 49 967
E. Bunte Germany 16 636 1.0× 516 1.2× 95 0.6× 44 0.4× 133 1.3× 44 776
S. Fernández Spain 18 578 0.9× 660 1.6× 214 1.3× 31 0.3× 151 1.5× 85 969
Yong‐Duck Chung South Korea 22 1.3k 2.0× 1.0k 2.4× 106 0.7× 66 0.6× 101 1.0× 122 1.6k
H. Schmidt Germany 18 1.1k 1.7× 536 1.3× 138 0.9× 43 0.4× 206 2.0× 44 1.4k

Countries citing papers authored by Shin-Puu Jeng

Since Specialization
Citations

This map shows the geographic impact of Shin-Puu Jeng's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Shin-Puu Jeng with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Shin-Puu Jeng more than expected).

Fields of papers citing papers by Shin-Puu Jeng

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Shin-Puu Jeng. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Shin-Puu Jeng. The network helps show where Shin-Puu Jeng may publish in the future.

Co-authorship network of co-authors of Shin-Puu Jeng

This figure shows the co-authorship network connecting the top 25 collaborators of Shin-Puu Jeng. A scholar is included among the top collaborators of Shin-Puu Jeng based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Shin-Puu Jeng. Shin-Puu Jeng is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Hu, Yimin, et al.. (2025). Package Warpage Reduction for Large CoWoS-R Packages. 116–121. 1 indexed citations
2.
Wang, Chuei-Tang, et al.. (2023). Signal and Power Integrity Performance of CoWoS-R in Chiplet Integration Applications. 296–301. 5 indexed citations
3.
Chen, Hsien‐Wei, et al.. (2022). Organic Interposer CoWoS-R+ (plus) Technology. 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). 1–6. 20 indexed citations
4.
Lin, Chia‐Hua, et al.. (2021). Reliability Performance of Advanced Organic Interposer (CoWoS®-R) Packages. 723–728. 19 indexed citations
5.
Chuang, Po-Yao, et al.. (2020). Hybrid Fan-out Package for Vertical Heterogeneous Integration. 333–338. 8 indexed citations
6.
Lin, Weili, et al.. (2019). Ultra-Thin Package Board Level Drop Impact Modeling and Validation. 1550–1555. 3 indexed citations
7.
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9.
Wang, Jinhua, et al.. (2018). 3D Heterogeneous Integration with Multiple Stacking Fan-Out Package. 337–342. 20 indexed citations
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11.
Jeng, Shin-Puu. (2014). CoWoS™ technologies. 1–1. 1 indexed citations
12.
Ibbotson, D. E., Arif Rahman, Kaushik Chanda, et al.. (2013). Manufacturability optimization and design validation studies for FPGA-based, 3D integrated circuits. Symposium on VLSI Technology. 3 indexed citations
13.
14.
Jeng, Shin-Puu, J.H. Chang, Yirong Lin, et al.. (2011). Orthotropic stress field induced by TSV and its impact on device performance. 11. 1–3. 10 indexed citations
15.
Chiu, Catherine, Ta‐Chuan Yeh, S. Y. Hou, et al.. (2011). Electromigration study of micro bumps at Si/Si interface in 3DIC package for 28nm technology and beyond. 346–350. 15 indexed citations
16.
Hou, S. Y., Cho-Chiang Shih, C.H. Hsieh, et al.. (2010). Lead-free flip chip solution for 40 nm extreme low-k interconnect system. 9. 1–3. 2 indexed citations
17.
Eissa, Mona A., et al.. (1997). Parylene Copolymers. MRS Proceedings. 476. 3 indexed citations
18.
Hong, Q. Z., et al.. (1995). Texture-induced asymmetric reactions in TiN/Al–Cu/TiN. Journal of Applied Physics. 78(12). 7419–7421. 6 indexed citations
19.
Zhang, Zhaoming, Shin-Puu Jeng, & Victor E. Henrich. (1991). Cation-ligand hybridization for stoichiometric and reducedTiO2(110) surfaces determined by resonant photoemission. Physical review. B, Condensed matter. 43(14). 12004–12011. 220 indexed citations
20.
Jeng, Shin-Puu & Paul H. Holloway. (1990). Preferential sputtering of Ni/Cr(110). Surface Science. 227(3). 273–277. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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