S. Y. Hou
- Electrical and Electronic Engineering top 10%
- Hardware and Architecture top 10%
- Biomedical Engineering
- Electronic, Optical and Magnetic Materials
- Computer Networks and Communications
- Co-authors
- K. C. TingDouglas YuC. T. WangW.C. ChiouChristine ChiuCheng‐Hsien WuChung-Hao TsaiShin-Puu Jeng
- Topics
- 3D IC and TSV technologies (14 papers)Electronic Packaging and Soldering Technologies (8 papers)Copper Interconnects and Reliability (4 papers)
- Cited by
- Hardware and ArchitectureElectrical and Electronic EngineeringElectronic, Optical and Magnetic Materials
- Journals
- International Journal of Hydrogen EnergyIEEE Transactions on Wireless CommunicationsIEEE Transactions on Electron Devices
- Partner nations
- TaiwanChinaUnited States
In The Last Decade
S. Y. Hou
16 papers receiving 376 citations
Peers
Comparison fields: 5 of 37
- Electrical and Electronic Engineering 343
- Hardware and Architecture 55
- Biomedical Engineering 52
- Electronic, Optical and Magnetic Materials 41
- Computer Networks and Communications 35
Countries citing papers authored by S. Y. Hou
This map shows the geographic impact of S. Y. Hou's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S. Y. Hou with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S. Y. Hou more than expected).
Fields of papers citing papers by S. Y. Hou
This network shows the impact of papers produced by S. Y. Hou. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S. Y. Hou. The network helps show where S. Y. Hou may publish in the future.
Co-authorship network of co-authors of S. Y. Hou
This figure shows the co-authorship network connecting the top 25 collaborators of S. Y. Hou. A scholar is included among the top collaborators of S. Y. Hou based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with S. Y. Hou. S. Y. Hou is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 6 | |
| 3 | 0 | |
| 4 | 0 | |
| 5 | 0 | |
| 6 | 11 | |
| 7 | 34 | |
| 8 | 13 | |
| 9 | 55 | |
| 10 | 18 | |
| 11 | 35 | |
| 12 | 22 | |
| 13 | 139 | |
| 14 | 17 | |
| 15 | 7 | |
| 16 | Manufacturability optimization and design validation studies for FPGA-based, 3D integrated circuits | 3 |
| 17 | High-performance inductors for integrated fan-out wafer level packaging (InFO-WLP) | 6 |
| 18 | 12 | |
| 19 | 15 | |
| 20 | 2 |
About S. Y. Hou
S. Y. Hou is a scholar working on Energy Engineering and Power Technology, Electrical and Electronic Engineering and Electronic, Optical and Magnetic Materials, having authored 20 papers that have together received 395 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (14 papers), Electronic Packaging and Soldering Technologies (8 papers) and Copper Interconnects and Reliability (4 papers). The work is most often cited by research in Hardware and Architecture (55 citations), Electrical and Electronic Engineering (343 citations) and Electronic, Optical and Magnetic Materials (41 citations). S. Y. Hou has collaborated with scholars based in Taiwan, China and United States. Frequent co-authors include K. C. Ting, Douglas Yu, C. T. Wang, W.C. Chiou, Christine Chiu, Cheng‐Hsien Wu, Chung-Hao Tsai, Shin-Puu Jeng, Chin‐Wei Lu and Yuchen Hu. Their work appears in journals such as International Journal of Hydrogen Energy, IEEE Transactions on Wireless Communications and IEEE Transactions on Electron Devices.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.