Feng-Wei Kuo
Impact in
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- Radio Frequency Integrated Circuit Design
- Advancements in PLL and VCO Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Electronic Packaging and Soldering Technologies
- Semiconductor Lasers and Optical Devices
- Microwave Engineering and Waveguides
Papers in
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- Radio Frequency Integrated Circuit Design 14
- Advancements in PLL and VCO Technologies 11
- Electromagnetic Compatibility and Noise Suppression 6
- Advanced Electrical Measurement Techniques 5
- 3D IC and TSV technologies 4
- Electronic Packaging and Soldering Technologies 4
- Photonic and Optical Devices 4
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- Physics of Superconductivity and Magnetism 4
- Co-authors
- Robert Bogdan Staszewski (13 shared papers)Masoud Babaie (9 shared papers)Chewn-Pu Jou (14 shared papers)Lan-Chou Cho (10 shared papers)Fu-Lung Hsueh (7 shared papers)Mina Shahmohammadi (2 shared papers)Teerachot Siriburanon (2 shared papers)Iman Madadi (2 shared papers)
- Journals
- IEEE Journal of Solid-State Circuits (5 papers)IEEE Transactions on Magnetics (3 papers)IEEE Transactions on Automatic Control (1 paper)IEEE Transactions on Microwave Theory and Techniques (1 paper)IEEE photonics journal (1 paper)
- Partner nations
- TaiwanIrelandNetherlands
In The Last Decade
Feng-Wei Kuo
27 papers receiving 502 citations
Peers
Comparison fields: 5 of 32
- Electrical and Electronic Engineering 496
- Condensed Matter Physics 40
- Hardware and Architecture 21
- Biomedical Engineering 137
- Computer Networks and Communications 39
Countries citing papers authored by Feng-Wei Kuo
This map shows the geographic impact of Feng-Wei Kuo's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Feng-Wei Kuo with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Feng-Wei Kuo more than expected).
Fields of papers citing papers by Feng-Wei Kuo
This network shows the impact of papers produced by Feng-Wei Kuo. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Feng-Wei Kuo. The network helps show where Feng-Wei Kuo may publish in the future.
Co-authors
The 25 scholars most cited alongside Feng-Wei Kuo, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 27 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2017 | 101 | |
| 2 | 2012 | 101 | |
| 3 | 2016 | 78 | |
| 4 | 2018 | 48 | |
| 5 | 2014 | 28 | |
| 6 | 2016 | 20 | |
| 7 | 2021 | 18 | |
| 8 | 2017 | 17 | |
| 9 | 2018 | 14 | |
| 10 | 1989 | 13 | |
| 11 | 2017 | 12 | |
| 12 | 1988 | 9 | |
| 13 | 2015 | 9 | |
| 14 | 1991 | 8 | |
| 15 | 2023 | 6 | |
| 16 | High-performance inductors for integrated fan-out wafer level packaging (InFO-WLP) | 2013 | 6 |
| 17 | 1991 | 6 | |
| 18 | 2019 | 6 | |
| 19 | 2006 | 5 | |
| 20 | 2012 | 5 |
About Feng-Wei Kuo
Feng-Wei Kuo is a scholar working on Electrical and Electronic Engineering, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Mechanical Engineering and Biomedical Engineering, having authored 27 papers that have together received 534 indexed citations. Recurring topics across this work include Radio Frequency Integrated Circuit Design (14 papers), Advancements in PLL and VCO Technologies (11 papers), Electromagnetic Compatibility and Noise Suppression (6 papers), Advanced Electrical Measurement Techniques (5 papers), Physics of Superconductivity and Magnetism (4 papers), 3D IC and TSV technologies (4 papers), Electronic Packaging and Soldering Technologies (4 papers) and Photonic and Optical Devices (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (496 citations), Condensed Matter Physics (40 citations), Hardware and Architecture (21 citations), Biomedical Engineering (137 citations) and Computer Networks and Communications (39 citations). Feng-Wei Kuo has collaborated with scholars based in Taiwan, Ireland and Netherlands. Frequent co-authors include Robert Bogdan Staszewski, Masoud Babaie, Chewn-Pu Jou, Lan-Chou Cho, Fu-Lung Hsueh, Mina Shahmohammadi, Teerachot Siriburanon, Iman Madadi, Massoud Tohidian and Chen Ron. Their work appears in journals such as IEEE Journal of Solid-State Circuits, IEEE Transactions on Magnetics, IEEE Transactions on Automatic Control, IEEE Transactions on Microwave Theory and Techniques and IEEE photonics journal.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.