C. H. Yu

420 total citations
18 papers, 299 citations indexed

About

C. H. Yu is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Automotive Engineering. According to data from OpenAlex, C. H. Yu has authored 18 papers receiving a total of 299 indexed citations (citations by other indexed papers that have themselves been cited), including 18 papers in Electrical and Electronic Engineering, 5 papers in Electronic, Optical and Magnetic Materials and 3 papers in Automotive Engineering. Recurrent topics in C. H. Yu's work include 3D IC and TSV technologies (14 papers), Electronic Packaging and Soldering Technologies (11 papers) and Copper Interconnects and Reliability (5 papers). C. H. Yu is often cited by papers focused on 3D IC and TSV technologies (14 papers), Electronic Packaging and Soldering Technologies (11 papers) and Copper Interconnects and Reliability (5 papers). C. H. Yu collaborates with scholars based in Taiwan, United States and Belgium. C. H. Yu's co-authors include M.S. Liang, S.Y. Wu, Fu‐Hsiang Ko, H. Lo, J.-C. Lin, Doug C. H. Yu, A. S. Oates, Chi‐Hua Tung, W.C. Chiou and Wenjing Wu and has published in prestigious journals such as Science and Technology of Welding & Joining and IMAPSource Proceedings.

In The Last Decade

C. H. Yu

18 papers receiving 288 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
C. H. Yu Taiwan 11 212 75 48 33 29 18 299
Boogyo Sim South Korea 10 306 1.4× 17 0.2× 38 0.8× 51 1.5× 13 0.4× 53 352
Scott McCann United States 12 206 1.0× 8 0.1× 37 0.8× 48 1.5× 24 0.8× 26 306
Luigi Capodieci United States 12 473 2.2× 116 1.5× 124 2.6× 31 0.9× 9 0.3× 58 513
Tomohiro Nakai Japan 7 54 0.3× 89 1.2× 50 1.0× 29 0.9× 1 0.0× 20 225
Wenfeng Ma China 11 366 1.7× 28 0.4× 48 1.0× 9 0.3× 17 0.6× 29 437
Jonathan W. Wittwer United States 11 152 0.7× 77 1.0× 73 1.5× 95 2.9× 19 369
Mihai Iordache Romania 10 290 1.4× 6 0.1× 54 1.1× 47 1.4× 19 0.7× 101 323
C.-P Hung Taiwan 9 321 1.5× 9 0.1× 47 1.0× 39 1.2× 24 0.8× 51 375
Debendra Mallik United States 7 339 1.6× 10 0.1× 57 1.2× 45 1.4× 24 0.8× 11 392
B.E. Stine United States 12 474 2.2× 54 0.7× 161 3.4× 68 2.1× 41 1.4× 23 567

Countries citing papers authored by C. H. Yu

Since Specialization
Citations

This map shows the geographic impact of C. H. Yu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. H. Yu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. H. Yu more than expected).

Fields of papers citing papers by C. H. Yu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C. H. Yu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. H. Yu. The network helps show where C. H. Yu may publish in the future.

Co-authorship network of co-authors of C. H. Yu

This figure shows the co-authorship network connecting the top 25 collaborators of C. H. Yu. A scholar is included among the top collaborators of C. H. Yu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C. H. Yu. C. H. Yu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

18 of 18 papers shown
1.
Yu, C. H., et al.. (2021). Advanced System Integration for High Performance Computing with Liquid Cooling. 105–111. 11 indexed citations
2.
3.
Lai, Wei‐Chih, Harry Chuang, Chung-Hao Tsai, et al.. (2013). 300mm size ultra-thin glass interposer technology and high-Q embedded helical inductor (EHI) for mobile application. 13.4.1–13.4.4. 23 indexed citations
4.
Ramachandran, V., Dongwook Kim, Sam Gu, et al.. (2013). A Wide I/O Memory-on-Logic Product Prototype Enabled by Through-Silicon Stacking Technology. IMAPSource Proceedings. 2013(1). 442–446. 1 indexed citations
5.
6.
Chiu, Christine, et al.. (2012). Flip chip power cycling system development and lead free bump power cycling reliability. 771–775. 1 indexed citations
7.
Lii, Mirng-Ji, Kenneth June Rebibis, Anne Jourdain, et al.. (2012). 3D stacking using Cu-Cu direct bonding. 9 indexed citations
8.
Yu, C. H., Chi‐Hua Tung, Catherine Chiu, et al.. (2011). Comparison of the electromigration behaviors between micro-bumps and C4 solder bumps. 33. 706–710. 15 indexed citations
9.
10.
11.
Tu, Hongen, et al.. (2008). Production Worthy 3D Interconnect Technology. 37–39. 2 indexed citations
12.
Chang, Chip-Hong, et al.. (2008). Integration of high-k/metal gate stacks for CMOS application. 148–149. 1 indexed citations
13.
Chiou, W.C. & C. H. Yu. (2008). Production Worthy 3D Interconnect Technology. 371–374. 2 indexed citations
14.
Lin, J.-C., A. S. Oates, & C. H. Yu. (2007). Time Dependent Vccmin Degradation of SRAM Fabricated with High-k Gate Dielectrics. 629. 439–444. 28 indexed citations
15.
Yu, C. H., et al.. (2007). Factors influencing current density distribution and current crowding in flip chip solder joints. Science and Technology of Welding & Joining. 12(5). 423–430. 3 indexed citations
16.
Yu, C. H.. (2006). The 3rd dimension-More Life for Moore's Law. 1–6. 27 indexed citations
17.
Wu, S.Y., et al.. (2005). Virtual metrology: a solution for wafer to wafer advanced process control. 155–157. 84 indexed citations
18.
Lin, Chang-Hsien, Hong‐Ming Hsu, T. R. Shih, et al.. (2001). A full Cu damascene metallization process for sub-0.18 /spl mu/m RF CMOS SoC high Q inductor and MIM capacitor application at 2.4 GHz and 5.3 GHz. 113–115. 16 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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