Sze Pei Lim
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
- Biomedical Engineering
- Mechanical Engineering
- Mechanics of Materials
- Topics
- Electronic Packaging and Soldering Technologies (19 papers)3D IC and TSV technologies (18 papers)Copper Interconnects and Reliability (4 papers)
- Cited by
- Electrical and Electronic EngineeringElectronic, Optical and Magnetic MaterialsIndustrial and Manufacturing Engineering
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)IMAPSource Proceedings
- Partner nations
- United StatesJapanUnited Kingdom
In The Last Decade
Sze Pei Lim
13 papers receiving 80 citations
Peers
Comparison fields: 5 of 20
- Electrical and Electronic Engineering 94
- Electronic, Optical and Magnetic Materials 17
- Biomedical Engineering 17
- Mechanical Engineering 15
- Mechanics of Materials 8
Countries citing papers authored by Sze Pei Lim
This map shows the geographic impact of Sze Pei Lim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Sze Pei Lim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Sze Pei Lim more than expected).
Fields of papers citing papers by Sze Pei Lim
This network shows the impact of papers produced by Sze Pei Lim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Sze Pei Lim. The network helps show where Sze Pei Lim may publish in the future.
Co-authorship network of co-authors of Sze Pei Lim
This figure shows the co-authorship network connecting the top 25 collaborators of Sze Pei Lim. A scholar is included among the top collaborators of Sze Pei Lim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Sze Pei Lim. Sze Pei Lim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 5 | |
| 2 | 0 | |
| 3 | 3 | |
| 4 | 1 | |
| 5 | 3 | |
| 6 | 0 | |
| 7 | 2 | |
| 8 | 1 | |
| 9 | 1 | |
| 10 | 1 | |
| 11 | 0 | |
| 12 | 1 | |
| 13 | 0 | |
| 14 | 3 | |
| 15 | 40 | |
| 16 | 5 | |
| 17 | 27 | |
| 18 | 1 | |
| 19 | 4 |
About Sze Pei Lim
Sze Pei Lim is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Electronic, Optical and Magnetic Materials, having authored 19 papers that have together received 98 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (18 papers) and Copper Interconnects and Reliability (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (94 citations), Electronic, Optical and Magnetic Materials (17 citations) and Industrial and Manufacturing Engineering (5 citations). Sze Pei Lim has collaborated with scholars based in United States, Japan and United Kingdom. Frequent co-authors include Eric Kuah, Margie Li, Cheng-Ta Ko, John H. Lau, Kai Wu, Rozalia Beica, K. H. Tan, Nelson Fan, Xi Cao and Iris Xu. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) and IMAPSource Proceedings.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.