Henry Yang
- Electrical and Electronic Engineering
- Biomedical Engineering
- Electronic, Optical and Magnetic Materials
- Automotive Engineering
- Cellular and Molecular Neuroscience
- Topics
- 3D IC and TSV technologies (4 papers)Electronic Packaging and Soldering Technologies (3 papers)Advanced Surface Polishing Techniques (2 papers)
- Journals
- Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and PhenomenaJournal of Micro/Nanolithography MEMS and MOEMS2022 International Electron Devices Meeting (IEDM)
- Partner nations
- TaiwanUnited StatesIndia
In The Last Decade
Henry Yang
6 papers receiving 16 citations
Peers
Comparison fields: 5 of 13
- Electrical and Electronic Engineering 20
- Biomedical Engineering 9
- Electronic, Optical and Magnetic Materials 3
- Automotive Engineering 2
- Cellular and Molecular Neuroscience 2
Countries citing papers authored by Henry Yang
This map shows the geographic impact of Henry Yang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Henry Yang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Henry Yang more than expected).
Fields of papers citing papers by Henry Yang
This network shows the impact of papers produced by Henry Yang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Henry Yang. The network helps show where Henry Yang may publish in the future.
Co-authorship network of co-authors of Henry Yang
This figure shows the co-authorship network connecting the top 25 collaborators of Henry Yang. A scholar is included among the top collaborators of Henry Yang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Henry Yang. Henry Yang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 3 | |
| 2 | 1 | |
| 3 | 9 | |
| 4 | 5 | |
| 5 | 1 | |
| 6 | 2 | |
| 7 | 2 |
About Henry Yang
Henry Yang is a scholar working on Surfaces, Coatings and Films, Computational Mechanics and Electrical and Electronic Engineering, having authored 7 papers that have together received 23 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (4 papers), Electronic Packaging and Soldering Technologies (3 papers) and Advanced Surface Polishing Techniques (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (20 citations), Biomedical Engineering (9 citations) and Automotive Engineering (2 citations). Henry Yang has collaborated with scholars based in Taiwan, United States and India. Frequent co-authors include Paul Lee, Cheng-Ta Ko, John H. Lau, Eric Kuah, Yongdong Liu, Dong Chen, Yuhua Chen, Ra-Min Tain, Hongying Wang and Kyung Lee. Their work appears in journals such as Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena, Journal of Micro/Nanolithography MEMS and MOEMS and 2022 International Electron Devices Meeting (IEDM).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.