Tae-Gyeong Chung
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- Electronic Packaging and Soldering Technologies 6
- 3D IC and TSV technologies 5
- Advancements in Semiconductor Devices and Circuit Design 1
- Silicon Carbide Semiconductor Technologies 1
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- Adhesion, Friction, and Surface Interactions 1
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- Heat Transfer and Optimization 1
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- Synthesis and properties of polymers 2
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- Advanced Surface Polishing Techniques 1
- Journals
- Journal of Adhesion Science and Technology (1 paper)MRS Proceedings (1 paper)
- Partner nations
- South Korea
In The Last Decade
Tae-Gyeong Chung
7 papers receiving 71 citations
Peers
Comparison fields: 5 of 17
- Electrical and Electronic Engineering 57
- Mechanics of Materials 21
- Computational Mechanics 16
- General Materials Science 2
- Mechanical Engineering 21
Countries citing papers authored by Tae-Gyeong Chung
This map shows the geographic impact of Tae-Gyeong Chung's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tae-Gyeong Chung with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tae-Gyeong Chung more than expected).
Fields of papers citing papers by Tae-Gyeong Chung
This network shows the impact of papers produced by Tae-Gyeong Chung. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tae-Gyeong Chung. The network helps show where Tae-Gyeong Chung may publish in the future.
Co-authorship network
The 12 scholars most cited alongside Tae-Gyeong Chung, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2007 | 2 | |
| 2 | 2007 | 32 | |
| 3 | 2006 | 4 | |
| 4 | 2006 | 7 | |
| 5 | 2003 | 1 | |
| 6 | 2002 | 13 | |
| 7 | 1994 | 17 | |
| 8 | 1993 | 1 |
About Tae-Gyeong Chung
Tae-Gyeong Chung is a scholar working on Polymers and Plastics, Mechanics of Materials and Electrical and Electronic Engineering, having authored 8 papers that have together received 77 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (5 papers), Synthesis and properties of polymers (2 papers), Advancements in Semiconductor Devices and Circuit Design (1 paper), Adhesion, Friction, and Surface Interactions (1 paper), Silicon Carbide Semiconductor Technologies (1 paper), Advanced Surface Polishing Techniques (1 paper) and Heat Transfer and Optimization (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (57 citations), Mechanics of Materials (21 citations) and Computational Mechanics (16 citations). Tae-Gyeong Chung has collaborated with scholars based in South Korea. Frequent co-authors include Young‐Ho Kim, Jin Yu, Qiang Chen, Jianhua Li, Hyeon Jun Hwang, Seyong Oh, Bo Seong Kim, Heejin Lee, Sungho Mun and Sehoon Oh. Their work appears in journals such as Journal of Adhesion Science and Technology and MRS Proceedings.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.