Eric Kuah

705 total citations
8 papers, 93 citations indexed

About

Eric Kuah is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Computer Networks and Communications. According to data from OpenAlex, Eric Kuah has authored 8 papers receiving a total of 93 indexed citations (citations by other indexed papers that have themselves been cited), including 6 papers in Electrical and Electronic Engineering, 3 papers in Electronic, Optical and Magnetic Materials and 1 paper in Computer Networks and Communications. Recurrent topics in Eric Kuah's work include Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (6 papers) and Copper Interconnects and Reliability (3 papers). Eric Kuah is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (6 papers) and Copper Interconnects and Reliability (3 papers). Eric Kuah collaborates with scholars based in United States, China and United Kingdom. Eric Kuah's co-authors include Margie Li, John H. Lau, Kai Wu, K. H. Tan, Nelson Fan, Cheng-Ta Ko, Rozalia Beica, Sze Pei Lim, Xi Cao and Iris Xu and has published in prestigious journals such as IEEE Transactions on Components Packaging and Manufacturing Technology and IMAPSource Proceedings.

In The Last Decade

Eric Kuah

8 papers receiving 76 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Eric Kuah United States 4 89 20 15 11 9 8 93
Sze Pei Lim United States 5 94 1.1× 17 0.8× 17 1.1× 8 0.7× 15 1.7× 19 98
Nelson Fan United States 6 138 1.6× 60 3.0× 16 1.1× 12 1.1× 22 2.4× 10 156
Iris Xu China 3 46 0.5× 12 0.6× 6 0.4× 5 0.5× 6 0.7× 3 48
Vijay Rao Kumbhare India 6 88 1.0× 8 0.4× 16 1.1× 3 0.3× 3 0.3× 20 104
R. Principe Switzerland 5 22 0.2× 28 1.4× 6 0.4× 3 0.3× 16 1.8× 13 44
A. Andreini Italy 9 270 3.0× 21 1.1× 7 0.5× 4 0.4× 4 0.4× 38 276
K. Okano Japan 7 155 1.7× 19 0.9× 4 0.3× 5 0.5× 5 0.6× 15 158
Daniel Scevola France 7 129 1.4× 18 0.9× 49 3.3× 5 0.5× 8 0.9× 9 136
L. H. Wu China 6 101 1.1× 11 0.6× 48 3.2× 4 0.4× 31 3.4× 18 118
D. Jaeger United States 5 45 0.5× 13 0.7× 4 0.3× 2 0.2× 7 0.8× 10 70

Countries citing papers authored by Eric Kuah

Since Specialization
Citations

This map shows the geographic impact of Eric Kuah's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Eric Kuah with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Eric Kuah more than expected).

Fields of papers citing papers by Eric Kuah

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Eric Kuah. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Eric Kuah. The network helps show where Eric Kuah may publish in the future.

Co-authorship network of co-authors of Eric Kuah

This figure shows the co-authorship network connecting the top 25 collaborators of Eric Kuah. A scholar is included among the top collaborators of Eric Kuah based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Eric Kuah. Eric Kuah is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

8 of 8 papers shown
1.
Lau, John H., W. Kai, Nelson Fan, et al.. (2018). Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Redistributed Layers. 20. 594–600. 3 indexed citations
2.
Lau, John H., Ming Li, Lei Yang, et al.. (2018). Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging With Large Chips and Multiple Redistributed Layers. IEEE Transactions on Components Packaging and Manufacturing Technology. 8(10). 1729–1737. 40 indexed citations
3.
Li, Ming, John H. Lau, Nelson Fan, et al.. (2017). Characterizations of Fan-out Wafer-Level Packaging. IMAPSource Proceedings. 2017(1). 557–562. 5 indexed citations
4.
Lau, John H., Ming Li, Nelson Fan, et al.. (2017). Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging. 595–602. 27 indexed citations
5.
Zhang, Li, Dong Chen, K. H. Tan, et al.. (2017). Development of chip-first and die-up fan-out wafer level packaging. 1–6. 11 indexed citations
6.
7.
Kuah, Eric, et al.. (2016). Large Format Encapsulation. 4(1). 3 indexed citations
8.
Kuah, Eric, et al.. (2015). Large format encapsulation. 1–5. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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