Ning-Cheng Lee
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 5%
- Aerospace Engineering
- Mechanics of Materials
- General Materials Science top 5%
- Co-authors
- Weiping LiuJohn H. LauYing-Ta ChiuJenn‐Ming SongYi‐Shao LaiJun-Yen UanSihai ChenHong‐Sik Hwang
- Topics
- Electronic Packaging and Soldering Technologies (63 papers)3D IC and TSV technologies (43 papers)Aluminum Alloys Composites Properties (16 papers)
- Partner nations
- TaiwanUnited StatesUnited Kingdom
In The Last Decade
Ning-Cheng Lee
65 papers receiving 529 citations
Peers
Comparison fields: 5 of 39
- Electrical and Electronic Engineering 548
- Mechanical Engineering 348
- Aerospace Engineering 59
- Mechanics of Materials 48
- General Materials Science 33
Countries citing papers authored by Ning-Cheng Lee
This map shows the geographic impact of Ning-Cheng Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ning-Cheng Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ning-Cheng Lee more than expected).
Fields of papers citing papers by Ning-Cheng Lee
This network shows the impact of papers produced by Ning-Cheng Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ning-Cheng Lee. The network helps show where Ning-Cheng Lee may publish in the future.
Co-authorship network of co-authors of Ning-Cheng Lee
This figure shows the co-authorship network connecting the top 25 collaborators of Ning-Cheng Lee. A scholar is included among the top collaborators of Ning-Cheng Lee based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ning-Cheng Lee. Ning-Cheng Lee is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 8 | |
| 2 | 1 | |
| 3 | 3 | |
| 4 | 2 | |
| 5 | 1 | |
| 6 | 0 | |
| 7 | 3 | |
| 8 | Pressureless Sintering of Nano-Ag Paste with Low Porosity for High Power Die Attach | 2 |
| 9 | 2 | |
| 10 | 2 | |
| 11 | 1 | |
| 12 | 4 | |
| 13 | 4 | |
| 14 | 0 | |
| 15 | 10 | |
| 16 | 5 | |
| 17 | 1 | |
| 18 | 1 | |
| 19 | 7 | |
| 20 | Electronics Manufacturing | 7 |
About Ning-Cheng Lee
Ning-Cheng Lee is a scholar working on General Materials Science, Mechanical Engineering and Electrical and Electronic Engineering, having authored 76 papers that have together received 576 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (63 papers), 3D IC and TSV technologies (43 papers) and Aluminum Alloys Composites Properties (16 papers). The work is most often cited by research in General Materials Science (33 citations), Electrical and Electronic Engineering (548 citations) and Mechanical Engineering (348 citations). Ning-Cheng Lee has collaborated with scholars based in Taiwan, United States and United Kingdom. Frequent co-authors include Weiping Liu, John H. Lau, Ying-Ta Chiu, Jenn‐Ming Song, Yi‐Shao Lai, Jun-Yen Uan, Sihai Chen, Hong‐Sik Hwang, Jinjin Zhao and Min Ding. Their work appears in journals such as Review of Scientific Instruments, JOM and Journal of Electronic Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.