Ming Li
- Bioengineering top 1%
- Analytical Chemistry and Sensors 19
-
- Copper Interconnects and Reliability 37
-
- Electronic Packaging and Soldering Technologies 92
- 3D IC and TSV technologies 67
- Electrodeposition and Electroless Coatings 33
- Gas Sensing Nanomaterials and Sensors 27
- Advancements in Battery Materials 20
- Polymers and Plastics top 2%
-
- Advanced Welding Techniques Analysis 26
Ming Li
270 papers receiving 4.9k citations
Peers
Comparison fields: 5 of 126
- Bioengineering 382
- Electronic, Optical and Magnetic Materials 1.1k
- Electrical and Electronic Engineering 3.1k
- Renewable Energy, Sustainability and the Environment 743
- Polymers and Plastics 567
Countries citing papers authored by Ming Li
This map shows the geographic impact of Ming Li's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ming Li with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ming Li more than expected).
Fields of papers citing papers by Ming Li
This network shows the impact of papers produced by Ming Li. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ming Li. The network helps show where Ming Li may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Ming Li, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 1 | |
| 2 | 2024 | 6 | |
| 3 | 2024 | 10 | |
| 4 | 2024 | 4 | |
| 5 | 2024 | 2 | |
| 6 | 2024 | 22 | |
| 7 | 2024 | 0 | |
| 8 | 2024 | 1 | |
| 9 | 2024 | 10 | |
| 10 | 2024 | 1 | |
| 11 | 2024 | 9 | |
| 12 | 2024 | 2 | |
| 13 | 2023 | 58 | |
| 14 | 2023 | 41 | |
| 15 | 2023 | 0 | |
| 16 | 2023 | 10 | |
| 17 | 2021 | 13 | |
| 18 | 2021 | 33 | |
| 19 | 2016 | 82 | |
| 20 | 2016 | 357 |
About Ming Li
Ming Li is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Bioengineering, Polymers and Plastics and Materials Chemistry, having authored 298 papers that have together received 5.0k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (92 papers), 3D IC and TSV technologies (67 papers), Copper Interconnects and Reliability (37 papers), Electrodeposition and Electroless Coatings (33 papers), Gas Sensing Nanomaterials and Sensors (27 papers), Advanced Welding Techniques Analysis (26 papers), Advancements in Battery Materials (20 papers) and Analytical Chemistry and Sensors (19 papers). The work is most often cited by research in Bioengineering (382 citations), Electronic, Optical and Magnetic Materials (1.1k citations), Electrical and Electronic Engineering (3.1k citations), Renewable Energy, Sustainability and the Environment (743 citations) and Polymers and Plastics (567 citations). Ming Li has collaborated with scholars based in China, United States and Japan. Frequent co-authors include Yanjie Su, Zhi Yang, Anmin Hu, Yafei Zhang, Jing Hu, Tao Hang, Yunhui Huang, Nantao Hu, Dali Mao and Huiling Yang. Their work appears in journals such as Journal of Materials Science Materials in Electronics, Materials Letters, Applied Surface Science, Materials Characterization and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.