Margie Li

554 total citations
7 papers, 131 citations indexed

About

Margie Li is a scholar working on Electrical and Electronic Engineering, Molecular Biology and Spectroscopy. According to data from OpenAlex, Margie Li has authored 7 papers receiving a total of 131 indexed citations (citations by other indexed papers that have themselves been cited), including 5 papers in Electrical and Electronic Engineering, 2 papers in Molecular Biology and 2 papers in Spectroscopy. Recurrent topics in Margie Li's work include Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (5 papers) and Copper Interconnects and Reliability (2 papers). Margie Li is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (5 papers) and Copper Interconnects and Reliability (2 papers). Margie Li collaborates with scholars based in United States, China and United Kingdom. Margie Li's co-authors include Eric Kuah, Bruce A. Sullenger, John H. Lau, Jonathan W. Kotula, Jeffrey J. Kovacs, K. H. Tan, Jin‐Peng Sun, Nelson Fan, Mark Fereshteh and Cheng-Ta Ko and has published in prestigious journals such as PLoS ONE, Protein Science and IEEE Transactions on Components Packaging and Manufacturing Technology.

In The Last Decade

Margie Li

6 papers receiving 116 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Margie Li United States	5	79	48	21	13	10	7	131
Yuan Hu United States	6	19 0.2×	12 0.3×	23 1.1×	19 1.5×	8 0.8×	10	75
David A. Ramsey United States	6	58 0.7×	46 1.0×	43 2.0×	4 0.3×	3 0.3×	13	161
Jingjie Niu South Korea	6	236 3.0×	38 0.8×	38 1.8×	24 1.8×	29 2.9×	12	336
Daniel N. Roxby Singapore	5	29 0.4×	27 0.6×	19 0.9×	8 0.6×	7 0.7×	9	81
Yue Hao China	7	107 1.4×	7 0.1×	9 0.4×	19 1.5×	18 1.8×	30	153
Mingyuan Sun China	6	75 0.9×	46 1.0×	40 1.9×	12 0.9×	11 1.1×	16	146
Matthew Piccini United States	8	24 0.3×	54 1.1×	105 5.0×	3 0.2×	5 0.5×	11	197
L. Fournier Canada	6	15 0.2×	26 0.5×	16 0.8×	5 0.4×	2 0.2×	10	120
Pengcheng Tan China	6	75 0.9×	68 1.4×	12 0.6×	3 0.2×	3 0.3×	8	170

Countries citing papers authored by Margie Li

Since Specialization

Citations

This map shows the geographic impact of Margie Li's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Margie Li with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Margie Li more than expected).

Fields of papers citing papers by Margie Li

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Margie Li. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Margie Li. The network helps show where Margie Li may publish in the future.

Co-authorship network of co-authors of Margie Li

This figure shows the co-authorship network connecting the top 25 collaborators of Margie Li. A scholar is included among the top collaborators of Margie Li based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Margie Li. Margie Li is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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7 of 7 papers shown

1.

Lau, John H., W. Kai, Nelson Fan, et al.. (2018). Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Redistributed Layers. 20. 594–600. 3 indexed citations

2.

Lau, John H., Ming Li, Lei Yang, et al.. (2018). Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging With Large Chips and Multiple Redistributed Layers. IEEE Transactions on Components Packaging and Manufacturing Technology. 8(10). 1729–1737. 40 indexed citations

3.

Chan, Catherine, et al.. (2017). Challenges of Large Format Packaging and Some of Its Assembly Solutions. IMAPSource Proceedings. 2017(1). 747–753. 1 indexed citations

4.

Lau, John H., Ming Li, Nelson Fan, et al.. (2017). Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging. 595–602. 27 indexed citations

5.

Zhang, Li, Dong Chen, K. H. Tan, et al.. (2017). Development of chip-first and die-up fan-out wafer level packaging. 1–6. 11 indexed citations

6.

Kotula, Jonathan W., Jin‐Peng Sun, Margie Li, et al.. (2014). Targeted Disruption of β-Arrestin 2-Mediated Signaling Pathways by Aptamer Chimeras Leads to Inhibition of Leukemic Cell Growth. PLoS ONE. 9(4). e93441–e93441. 42 indexed citations

7.

Jensen, Davin R., Christopher Woytovich, Margie Li, et al.. (2010). Rapid, robotic, small‐scale protein production for NMR screening and structure determination. Protein Science. 19(3). 570–578. 7 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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