Charles Arvin
Impact in
- Mechanical Engineering top 10%
- Advanced machining processes and optimization
- Heat Transfer and Optimization
- Heat Transfer Mechanisms
- Heat Transfer and Boiling Studies
Papers in
-
- Heat Transfer Mechanisms 7
- Heat Transfer and Optimization 7
- Heat Transfer and Boiling Studies 4
-
- Electronic Packaging and Soldering Technologies 9
- 3D IC and TSV technologies 7
- Semiconductor materials and devices 2
- Co-authors
- I.S. Jawahir (3 shared papers)Yusuf Kaynak (2 shared papers)Tian Xia (1 shared paper)Scott N. Schiffres (9 shared papers)Srikanth Rangarajan (8 shared papers)Bahgat Sammakia (8 shared papers)Cong Hiep Hoang (7 shared papers)Kamal Sikka (6 shared papers)
- Journals
- Applied Thermal Engineering (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)International Journal of Heat and Mass Transfer (1 paper)Applied Materials Today (1 paper)The International Journal of Advanced Manufacturing Technology (1 paper)
- Partner nations
- United StatesCanadaJapan
In The Last Decade
Charles Arvin
20 papers receiving 315 citations
Peers
Comparison fields: 5 of 32
- Mechanical Engineering 292
- Ecological Modeling 20
- Electrical and Electronic Engineering 136
- Biomedical Engineering 99
- Computational Mechanics 30
Countries citing papers authored by Charles Arvin
This map shows the geographic impact of Charles Arvin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Charles Arvin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Charles Arvin more than expected).
Fields of papers citing papers by Charles Arvin
This network shows the impact of papers produced by Charles Arvin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Charles Arvin. The network helps show where Charles Arvin may publish in the future.
Co-authors
The 25 scholars most cited alongside Charles Arvin, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 22 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2015 | 137 | |
| 2 | 2021 | 50 | |
| 3 | 2014 | 32 | |
| 4 | 2022 | 26 | |
| 5 | 2021 | 23 | |
| 6 | 2022 | 15 | |
| 7 | 2020 | 12 | |
| 8 | 2015 | 8 | |
| 9 | 2022 | 7 | |
| 10 | 2022 | 6 | |
| 11 | 2013 | 3 | |
| 12 | 2022 | 3 | |
| 13 | 2012 | 1 | |
| 14 | 2022 | 1 | |
| 15 | 2024 | 1 | |
| 16 | 2009 | 1 | |
| 17 | 2021 | 1 | |
| 18 | Effects of Different Coolants on the Cooling Performance of an Impingement Microchannel Cold Plate | 2021 | 1 |
| 19 | 2014 | 1 | |
| 20 | 2021 | 1 |
About Charles Arvin
Charles Arvin is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering, Materials Chemistry, Mechanics of Materials and Aerospace Engineering, having authored 22 papers that have together received 330 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (9 papers), Heat Transfer Mechanisms (7 papers), 3D IC and TSV technologies (7 papers), Heat Transfer and Optimization (7 papers), Heat Transfer and Boiling Studies (4 papers), Metal and Thin Film Mechanics (2 papers), Semiconductor materials and devices (2 papers) and Additive Manufacturing and 3D Printing Technologies (2 papers). The work is most often cited by research in Mechanical Engineering (292 citations), Ecological Modeling (20 citations), Electrical and Electronic Engineering (136 citations), Biomedical Engineering (99 citations) and Computational Mechanics (30 citations). Charles Arvin has collaborated with scholars based in United States, Canada and Japan. Frequent co-authors include I.S. Jawahir, Yusuf Kaynak, Tian Xia, Scott N. Schiffres, Srikanth Rangarajan, Bahgat Sammakia, Cong Hiep Hoang, Kamal Sikka, Yaser Hadad and Boyang Huang. Their work appears in journals such as Applied Thermal Engineering, IEEE Transactions on Components Packaging and Manufacturing Technology, International Journal of Heat and Mass Transfer, Applied Materials Today and The International Journal of Advanced Manufacturing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.