Charles Arvin

449 total citations
22 papers, 330 citations indexed

About

Charles Arvin is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Materials Chemistry. According to data from OpenAlex, Charles Arvin has authored 22 papers receiving a total of 330 indexed citations (citations by other indexed papers that have themselves been cited), including 11 papers in Mechanical Engineering, 10 papers in Electrical and Electronic Engineering and 4 papers in Materials Chemistry. Recurrent topics in Charles Arvin's work include Electronic Packaging and Soldering Technologies (9 papers), Heat Transfer and Optimization (7 papers) and Heat Transfer Mechanisms (7 papers). Charles Arvin is often cited by papers focused on Electronic Packaging and Soldering Technologies (9 papers), Heat Transfer and Optimization (7 papers) and Heat Transfer Mechanisms (7 papers). Charles Arvin collaborates with scholars based in United States, Japan and Canada. Charles Arvin's co-authors include I.S. Jawahir, Yusuf Kaynak, Tian Xia, Scott N. Schiffres, Srikanth Rangarajan, Bahgat Sammakia, Kamal Sikka, Cong Hiep Hoang, Yaser Hadad and Boyang Huang and has published in prestigious journals such as Acta Materialia, International Journal of Heat and Mass Transfer and Applied Thermal Engineering.

In The Last Decade

Charles Arvin

20 papers receiving 315 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Charles Arvin United States 8 292 136 99 59 30 22 330
Soroush Masoudi Iran 9 355 1.2× 185 1.4× 160 1.6× 38 0.6× 21 0.7× 10 382
Akash Subhash Awale India 12 312 1.1× 153 1.1× 133 1.3× 53 0.9× 12 0.4× 24 337
Zhenglong Fang Japan 11 413 1.4× 162 1.2× 162 1.6× 41 0.7× 28 0.9× 27 436
Mike Zinecker Germany 6 252 0.9× 265 1.9× 194 2.0× 46 0.8× 28 0.9× 13 338
Weidong Tang China 9 220 0.8× 160 1.2× 147 1.5× 52 0.9× 28 0.9× 28 303
Neeti Arora India 8 373 1.3× 140 1.0× 273 2.8× 56 0.9× 44 1.5× 14 455
Ildikó Maňková Slovakia 11 278 1.0× 112 0.8× 134 1.4× 50 0.8× 27 0.9× 45 314
Niladri Mandal India 6 260 0.9× 230 1.7× 189 1.9× 19 0.3× 51 1.7× 9 323
Yahya Işık Türkiye 8 344 1.2× 181 1.3× 159 1.6× 114 1.9× 16 0.5× 19 390
Yunguang Zhou China 15 421 1.4× 203 1.5× 307 3.1× 66 1.1× 19 0.6× 46 471

Countries citing papers authored by Charles Arvin

Since Specialization
Citations

This map shows the geographic impact of Charles Arvin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Charles Arvin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Charles Arvin more than expected).

Fields of papers citing papers by Charles Arvin

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Charles Arvin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Charles Arvin. The network helps show where Charles Arvin may publish in the future.

Co-authorship network of co-authors of Charles Arvin

This figure shows the co-authorship network connecting the top 25 collaborators of Charles Arvin. A scholar is included among the top collaborators of Charles Arvin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Charles Arvin. Charles Arvin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Li, Shidong, Christine L. Taylor, & Charles Arvin. (2024). Creep Parameters for Solder Interconnects by Nanoindentation Inverse-FEA Method. 486–490. 1 indexed citations
2.
Chen, Xiaobo, Fatemeh Hejripour, In‐Tae Bae, et al.. (2022). Selective laser melting of metal structures onto graphite substrates via a low melting point interlayer alloy. Applied Materials Today. 26. 101334–101334. 6 indexed citations
3.
Hoang, Cong Hiep, Srikanth Rangarajan, Charles Arvin, et al.. (2022). Design and Thermal Analysis of a 3-D Printed Impingement Pin Fin Cold Plate for Heterogeneous Integration Application. IEEE Transactions on Components Packaging and Manufacturing Technology. 12(7). 1091–1099. 7 indexed citations
4.
Arvin, Charles, et al.. (2022). Low temperature interconnects in 1st level packaging and its challenges. 7–8. 3 indexed citations
5.
Lim, Sze Pei, et al.. (2022). Low Temperature Material for 1st Level Interconnect in Semiconductor Packaging. 378–386. 1 indexed citations
6.
Lim, Sze Pei, et al.. (2021). Low temperature 1st level interconnect in Packaging and its Challenges. 49–50. 1 indexed citations
7.
Hoang, Cong Hiep, Srikanth Rangarajan, Yaser Hadad, et al.. (2021). Impact of fin geometry and surface roughness on performance of an impingement two-phase cooling heat sink. Applied Thermal Engineering. 198. 117453–117453. 23 indexed citations
8.
Hadad, Yaser, Srikanth Rangarajan, Cong Hiep Hoang, et al.. (2021). Multi-objective optimization of a chip-attached micro pin fin liquid cooling system. Applied Thermal Engineering. 195. 117187–117187. 50 indexed citations
9.
Hoang, Cong Hiep, Srikanth Rangarajan, Charles Arvin, et al.. (2021). Effects of Different Coolants on the Cooling Performance of an Impingement Microchannel Cold Plate. 43–49. 1 indexed citations
10.
Hoang, Cong Hiep, Srikanth Rangarajan, Mohammad Tradat, et al.. (2021). Two-phase Impingement Cooling using a Trapezoidal Groove Microchannel Heat Sink and Dielectric Coolant HFE 7000. 237–245. 1 indexed citations
11.
Hadad, Yaser, Srikanth Rangarajan, Cong Hiep Hoang, et al.. (2020). Direct Micro-Pin Jet Impingement Cooling for High Heat Flux Applications. 1–9. 12 indexed citations
12.
Huang, Boyang, Yusuf Kaynak, Charles Arvin, & I.S. Jawahir. (2015). Improved surface integrity from cryogenic machining of Al 7050-T7451 alloy with ultrafine-grained structure. Advances in Materials and Processing Technologies. 1(3-4). 361–374. 8 indexed citations
13.
Xia, Tian, Yusuf Kaynak, Charles Arvin, & I.S. Jawahir. (2015). Cryogenic cooling-induced process performance and surface integrity in drilling CFRP composite material. The International Journal of Advanced Manufacturing Technology. 82(1-4). 605–616. 137 indexed citations
14.
Huang, Boyang, et al.. (2014). Enhancing the Surface Integrity of Ti-6Al-4V Alloy through Cryogenic Burnishing. Procedia CIRP. 13. 243–248. 32 indexed citations
15.
Arvin, Charles, et al.. (2014). Optimization of Lead Free Plating for Flip Chip Applications. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2014(DPC). 1553–1602.
16.
Lu, Minhua, et al.. (2014). Effect of Ag and Cu content in Sn based Pb-free solder on electromigration. 40. 1940–1943. 1 indexed citations
17.
18.
Arvin, Charles, et al.. (2012). Solder Void Formation in Lead Free Solder. ECS Meeting Abstracts. MA2012-01(27). 1033–1033. 1 indexed citations
19.
Arvin, Charles, et al.. (2009). Capacitors on organic modules: a new THB failure mode and method of detection. 1263–1270. 1 indexed citations
20.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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Rankless by CCL
2026