Liam Madden

2.0k total citations · 1 hit paper
23 papers, 1.0k citations indexed

About

Liam Madden is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Artificial Intelligence. According to data from OpenAlex, Liam Madden has authored 23 papers receiving a total of 1.0k indexed citations (citations by other indexed papers that have themselves been cited), including 19 papers in Electrical and Electronic Engineering, 6 papers in Biomedical Engineering and 3 papers in Artificial Intelligence. Recurrent topics in Liam Madden's work include 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (6 papers) and Analog and Mixed-Signal Circuit Design (6 papers). Liam Madden is often cited by papers focused on 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (6 papers) and Analog and Mixed-Signal Circuit Design (6 papers). Liam Madden collaborates with scholars based in United States, Taiwan and Canada. Liam Madden's co-authors include S.S. Wong, B. Kleveland, Richard T. Witek, Andrew J. Black, J. Montanaro, S. Santhanam, J. Eno, M. Pearce, Stephen C. Thierauf and Elizabeth Cooper and has published in prestigious journals such as IEEE Transactions on Automatic Control, IEEE Journal of Solid-State Circuits and IEEE Electron Device Letters.

In The Last Decade

Liam Madden

21 papers receiving 926 citations

Hit Papers

A 160-MHz, 32-b, 0.5-W CMOS RISC microprocessor 1996 2026 2006 2016 1996 100 200 300 400
What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

  1. A 160-MHz, 32-b, 0.5-W CMOS RISC microprocessor
    1996 465 citations J. Montanaro, Richard T. Witek et al. IEEE Journal of Solid-State Circuits profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Liam Madden United States 13 824 408 244 179 28 23 1.0k
E. Alon United States 16 1.1k 1.3× 327 0.8× 139 0.6× 272 1.5× 37 1.3× 28 1.2k
Frank O’Mahony United States 25 1.5k 1.8× 256 0.6× 145 0.6× 321 1.8× 29 1.0× 50 1.6k
Muhammad Khellah United States 24 1.7k 2.1× 715 1.8× 316 1.3× 283 1.6× 16 0.6× 90 1.9k
Resve Saleh Canada 11 629 0.8× 283 0.7× 104 0.4× 137 0.8× 23 0.8× 36 732
Taejoong Song South Korea 15 659 0.8× 113 0.3× 116 0.5× 101 0.6× 35 1.3× 50 752
A. Wang United States 9 1.1k 1.3× 175 0.4× 138 0.6× 432 2.4× 19 0.7× 9 1.2k
D.S. Wills United States 17 434 0.5× 310 0.8× 288 1.2× 42 0.2× 30 1.1× 91 719
Tim Tuan United States 15 874 1.1× 532 1.3× 271 1.1× 111 0.6× 16 0.6× 20 1.0k
Ioannis Savidis United States 15 815 1.0× 336 0.8× 149 0.6× 58 0.3× 62 2.2× 92 930
Vasilis F. Pavlidis United Kingdom 14 838 1.0× 284 0.7× 464 1.9× 47 0.3× 37 1.3× 89 980

Countries citing papers authored by Liam Madden

Since Specialization
Citations

This map shows the geographic impact of Liam Madden's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Liam Madden with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Liam Madden more than expected).

Fields of papers citing papers by Liam Madden

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Liam Madden. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Liam Madden. The network helps show where Liam Madden may publish in the future.

Co-authorship network of co-authors of Liam Madden

This figure shows the co-authorship network connecting the top 25 collaborators of Liam Madden. A scholar is included among the top collaborators of Liam Madden based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Liam Madden. Liam Madden is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Madden, Liam & Christos Thrampoulidis. (2024). Memory Capacity of Two Layer Neural Networks with Smooth Activations. SIAM Journal on Mathematics of Data Science. 6(3). 679–702.
2.
Madden, Liam, et al.. (2024). A Stochastic Operator Framework for Optimization and Learning With Sub-Weibull Errors. IEEE Transactions on Automatic Control. 69(12). 8722–8737. 1 indexed citations
3.
Madden, Liam, et al.. (2022). Sketching the Best Approximate Quantum Compiling Problem. HAL (Le Centre pour la Communication Scientifique Directe). 492–502. 2 indexed citations
4.
5.
Kwon, Woon‐Seong, et al.. (2014). Cost Effective and High Performance 28nm FPGA with New Disruptive Silicon-Less Interconnect Technology (SLIT). IMAPSource Proceedings. 2014(1). 599–605. 17 indexed citations
6.
McGrath, John, et al.. (2014). A Heterogeneous 3D-IC Consisting of Two 28 nm FPGA Die and 32 Reconfigurable High-Performance Data Converters. IEEE Journal of Solid-State Circuits. 50(1). 258–269. 59 indexed citations
7.
Kwon, Woon‐Seong, et al.. (2013). Enabling a Manufacturable 3D Technologies and Ecosystem using 28nm FPGA with Stack Silicon Interconnect Technology. IMAPSource Proceedings. 2013(1). 217–222. 15 indexed citations
8.
9.
Banijamali, Bahareh, Cheng‐Chieh Hsieh, Suresh Ramalingam, et al.. (2013). Reliability evaluation of a CoWoS-enabled 3D IC package. 35–40. 40 indexed citations
10.
Madden, Liam. (2012). 3-D stacking tutorial introduction. 1–11.
11.
Madden, Liam, et al.. (2012). Advancing high performance heterogeneous integration through die stacking. 18–24. 18 indexed citations
12.
Banijamali, Bahareh, Liam Madden, Suresh Ramalingam, & Ephrem Wu. (2012). Quality and Reliability of 3D High-Performance Heterogeneous Integration through Die Stacking. IMAPSource Proceedings. 2012(1). 249–253. 1 indexed citations
13.
Kleveland, B., et al.. (2003). Monolithic CMOS distributed amplifier and oscillator. 70–71. 56 indexed citations
14.
Kleveland, B., Xiaoning Qi, Liam Madden, R.W. Dutton, & S.S. Wong. (2003). Line inductance extraction and modeling in a real chip with power grid. 901–904. 3 indexed citations
15.
Montanaro, J., Richard T. Witek, Andrew J. Black, et al.. (2002). A 160 MHz 32 b 0.5 W CMOS RISC microprocessor. 214–215,. 64 indexed citations
16.
Kleveland, B., Xiaoning Qi, Liam Madden, et al.. (2002). High-frequency characterization of on-chip digital interconnects. IEEE Journal of Solid-State Circuits. 37(6). 716–725. 48 indexed citations
17.
Kleveland, B., C.H. Diaz, D. Vook, et al.. (2002). Correction to "exploiting CMOS reverse interconnect scaling in multigigahertz amplifier and oscillator design". IEEE Journal of Solid-State Circuits. 37(2). 255–255. 1 indexed citations
18.
Kleveland, B., C.H. Diaz, D. Vook, et al.. (2001). Exploiting CMOS reverse interconnect scaling in multigigahertz amplifier and oscillator design. IEEE Journal of Solid-State Circuits. 36(10). 1480–1488. 82 indexed citations
19.
Kleveland, B., et al.. (2000). Distributed ESD protection for high-speed integrated circuits. IEEE Electron Device Letters. 21(8). 390–392. 55 indexed citations
20.
Montanaro, J., Richard T. Witek, Andrew J. Black, et al.. (1997). A 160-MHz, 32-b, 0.5-W CMOS RISC microprocessor. 9(1). 49–62. 57 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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