Woon‐Seong Kwon

594 total citations
30 papers, 487 citations indexed

About

Woon‐Seong Kwon is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Biomedical Engineering. According to data from OpenAlex, Woon‐Seong Kwon has authored 30 papers receiving a total of 487 indexed citations (citations by other indexed papers that have themselves been cited), including 30 papers in Electrical and Electronic Engineering, 8 papers in Mechanics of Materials and 6 papers in Biomedical Engineering. Recurrent topics in Woon‐Seong Kwon's work include Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (26 papers) and Adhesion, Friction, and Surface Interactions (7 papers). Woon‐Seong Kwon is often cited by papers focused on Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (26 papers) and Adhesion, Friction, and Surface Interactions (7 papers). Woon‐Seong Kwon collaborates with scholars based in South Korea, United States and Singapore. Woon‐Seong Kwon's co-authors include Kyung‐Wook Paik, Soon-Bok Lee, Jin-Sang Hwang, Myung-Jin Yim, Kyung-Wook Paik, Myung Jin Yim, Ji-Hwan Hwang, Myung‐Jin Kim, Kyung W. Paik and J.K. Wolf and has published in prestigious journals such as Journal of Applied Polymer Science, Materials Science and Engineering B and International Journal of Adhesion and Adhesives.

In The Last Decade

Woon‐Seong Kwon

30 papers receiving 461 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Woon‐Seong Kwon South Korea 15 450 102 88 72 40 30 487
Myung-Jin Yim South Korea 10 524 1.2× 138 1.4× 124 1.4× 114 1.6× 23 0.6× 25 557
Srikrishna Sitaraman United States 13 516 1.1× 50 0.5× 76 0.9× 57 0.8× 11 0.3× 56 567
Ser Choong Chong Singapore 12 446 1.0× 35 0.3× 99 1.1× 58 0.8× 60 1.5× 96 488
H. Frémont France 12 365 0.8× 73 0.7× 62 0.7× 129 1.8× 30 0.8× 68 424
Poi-Siong Teo Singapore 11 298 0.7× 73 0.7× 52 0.6× 136 1.9× 14 0.3× 18 372
David Ho Singapore 12 583 1.3× 34 0.3× 113 1.3× 70 1.0× 32 0.8× 47 632
Su‐Tsai Lu Taiwan 11 322 0.7× 48 0.5× 51 0.6× 103 1.4× 67 1.7× 32 369
Si Chen China 12 337 0.7× 34 0.3× 89 1.0× 117 1.6× 28 0.7× 83 415
Chai Tai Chong Singapore 10 422 0.9× 43 0.4× 78 0.9× 46 0.6× 46 1.1× 50 463
Jiantao Zhang China 11 268 0.6× 27 0.3× 58 0.7× 62 0.9× 33 0.8× 47 361

Countries citing papers authored by Woon‐Seong Kwon

Since Specialization
Citations

This map shows the geographic impact of Woon‐Seong Kwon's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Woon‐Seong Kwon with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Woon‐Seong Kwon more than expected).

Fields of papers citing papers by Woon‐Seong Kwon

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Woon‐Seong Kwon. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Woon‐Seong Kwon. The network helps show where Woon‐Seong Kwon may publish in the future.

Co-authorship network of co-authors of Woon‐Seong Kwon

This figure shows the co-authorship network connecting the top 25 collaborators of Woon‐Seong Kwon. A scholar is included among the top collaborators of Woon‐Seong Kwon based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Woon‐Seong Kwon. Woon‐Seong Kwon is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Kwon, Woon‐Seong, et al.. (2013). Enabling a Manufacturable 3D Technologies and Ecosystem using 28nm FPGA with Stack Silicon Interconnect Technology. IMAPSource Proceedings. 2013(1). 217–222. 15 indexed citations
2.
Kwon, Woon‐Seong, et al.. (2011). Chip warpage model for reliability prediction of delamination failures. Microelectronics Reliability. 52(4). 718–724. 19 indexed citations
3.
Hwang, Ji-Hwan, et al.. (2010). Fine pitch chip interconnection technology for 3D integration. 1399–1403. 46 indexed citations
4.
Yim, Myung Jin, et al.. (2005). Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications. IEEE Transactions on Components and Packaging Technologies. 28(4). 789–796. 26 indexed citations
5.
6.
Paik, Kyung‐Wook & Woon‐Seong Kwon. (2005). Effect of compressive stresses in anisotropic conductive films (ACFs) on contact resistance of flip chip joint. 23. 141–147. 6 indexed citations
7.
8.
Yim, Myung Jin, Woon‐Seong Kwon, & Kyung W. Paik. (2005). Effect of filler content on the dielectric properties of anisotropic conductive adhesives materials for high-frequency flip–chip interconnection. Materials Science and Engineering B. 126(1). 59–65. 16 indexed citations
9.
Kwon, Woon‐Seong & Kyung‐Wook Paik. (2004). Contraction stress build‐up of anisotropic conductive films (ACFs) for flip‐chip interconnection: Effect of thermal and mechanical properties of ACFs. Journal of Applied Polymer Science. 93(6). 2634–2641. 13 indexed citations
10.
11.
Yim, Myung-Jin, Jin-Sang Hwang, Jingu Kim, et al.. (2004). Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications. 159–164. 2 indexed citations
12.
13.
Kim, Myung‐Jin, et al.. (2003). High reliable non-conductive adhesives for flip chip CSP applications. 1385–1389. 33 indexed citations
14.
Kwon, Woon‐Seong & Kyung‐Wook Paik. (2003). Fundamental understanding of ACF conduction establishment with emphasis on the thermal and mechanical analysis. International Journal of Adhesion and Adhesives. 24(2). 135–142. 45 indexed citations
15.
Kwon, Woon‐Seong & Kyung‐Wook Paik. (2003). STUDY ON THERMAL CYCLING RELIABILITY AND DELAMINATION OF ACF FLIP CHIP ON BOARDS WITH EMPHASIS ON THE THERMAL DEFORMATION. 2 indexed citations
16.
Kwon, Woon‐Seong & Kyung-Wook Paik. (2003). High current induced failure of ACAs flip chip joint. 39. 1130–1134. 11 indexed citations
17.
Yim, Myung-Jin, et al.. (2003). Highly reliable non-conductive adhesives for flip chip CSP applications. IEEE Transactions on Electronics Packaging Manufacturing. 26(2). 150–155. 30 indexed citations
18.
Kwon, Woon‐Seong, et al.. (2003). Analytical approach to evaluate shear stress in flip chip interconnection using NCA/ACF. 204–209. 11 indexed citations
19.
Kwon, Woon‐Seong, et al.. (2002). High- reliability nonconductive adhesives for flip chip interconnections. 22. 34–38. 6 indexed citations
20.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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