Huayan Wang
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
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- Electronic Packaging and Soldering Technologies 17
- 3D IC and TSV technologies 14
- Integrated Circuits and Semiconductor Failure Analysis 3
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- Metal Forming Simulation Techniques 2
- Co-authors
- Seungbae Park (17 shared papers)Jiefeng Xu (14 shared papers)Ke Pan (8 shared papers)Jing Wang (4 shared papers)Shuai Shao (2 shared papers)Yuling Niu (2 shared papers)Gamal Refai-Ahmed (7 shared papers)Hongbin Zha (2 shared papers)
- Journals
- Microelectronics Reliability (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)ACS Applied Energy Materials (1 paper)Journal of Energy Storage (1 paper)Journal of Electronic Packaging (1 paper)
- Partner nations
- United StatesChinaTaiwan
In The Last Decade
Huayan Wang
29 papers receiving 361 citations
Peers
Comparison fields: 5 of 51
- Electrical and Electronic Engineering 299
- Industrial and Manufacturing Engineering 35
- Mechanics of Materials 77
- Mechanical Engineering 89
- Hardware and Architecture 13
Countries citing papers authored by Huayan Wang
This map shows the geographic impact of Huayan Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Huayan Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Huayan Wang more than expected).
Fields of papers citing papers by Huayan Wang
This network shows the impact of papers produced by Huayan Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Huayan Wang. The network helps show where Huayan Wang may publish in the future.
Co-authors
The 25 scholars most cited alongside Huayan Wang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 29 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2021 | 64 | |
| 2 | 2018 | 30 | |
| 3 | 2020 | 25 | |
| 4 | 2020 | 24 | |
| 5 | 2020 | 22 | |
| 6 | 2020 | 22 | |
| 7 | 2019 | 20 | |
| 8 | 2020 | 18 | |
| 9 | 2019 | 17 | |
| 10 | 2020 | 14 | |
| 11 | 2020 | 14 | |
| 12 | 2020 | 13 | |
| 13 | 2019 | 13 | |
| 14 | 2007 | 11 | |
| 15 | 2019 | 9 | |
| 16 | 2016 | 9 | |
| 17 | 2019 | 8 | |
| 18 | 2008 | 8 | |
| 19 | 2019 | 7 | |
| 20 | 2023 | 6 |
About Huayan Wang
Huayan Wang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials and Materials Chemistry, having authored 29 papers that have together received 374 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (17 papers), 3D IC and TSV technologies (14 papers), Copper Interconnects and Reliability (5 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers), Advanced Surface Polishing Techniques (3 papers), Metal Forming Simulation Techniques (2 papers), Adhesion, Friction, and Surface Interactions (2 papers) and Quantum Dots Synthesis And Properties (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (299 citations), Industrial and Manufacturing Engineering (35 citations), Mechanics of Materials (77 citations), Mechanical Engineering (89 citations) and Hardware and Architecture (13 citations). Huayan Wang has collaborated with scholars based in United States, China and Taiwan. Frequent co-authors include Seungbae Park, Jiefeng Xu, Ke Pan, Jing Wang, Shuai Shao, Yuling Niu, Gamal Refai-Ahmed, Hongbin Zha, Hong Qin and Dan Oh. Their work appears in journals such as Microelectronics Reliability, IEEE Transactions on Components Packaging and Manufacturing Technology, ACS Applied Energy Materials, Journal of Energy Storage and Journal of Electronic Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.