Tom Ritzdorf

716 total citations
24 papers, 444 citations indexed

About

Tom Ritzdorf is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Tom Ritzdorf has authored 24 papers receiving a total of 444 indexed citations (citations by other indexed papers that have themselves been cited), including 22 papers in Electrical and Electronic Engineering, 13 papers in Electronic, Optical and Magnetic Materials and 5 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Tom Ritzdorf's work include Copper Interconnects and Reliability (13 papers), Electrodeposition and Electroless Coatings (12 papers) and Electronic Packaging and Soldering Technologies (11 papers). Tom Ritzdorf is often cited by papers focused on Copper Interconnects and Reliability (13 papers), Electrodeposition and Electroless Coatings (12 papers) and Electronic Packaging and Soldering Technologies (11 papers). Tom Ritzdorf collaborates with scholars based in United States and Japan. Tom Ritzdorf's co-authors include Rozalia Beica, Kazuyoshi Ueno, Paul R. McHugh, Gregory J. Wilson, G. Ritter, L. J. Graham, David B. Fraser, K. M. Hanson, W. L. Brown and James Turner and has published in prestigious journals such as Journal of Applied Physics, Journal of The Electrochemical Society and IBM Journal of Research and Development.

In The Last Decade

Tom Ritzdorf

21 papers receiving 402 citations

Peers

Countries citing papers authored by Tom Ritzdorf

Since Specialization

Citations

This map shows the geographic impact of Tom Ritzdorf's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Tom Ritzdorf with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Tom Ritzdorf more than expected).

Fields of papers citing papers by Tom Ritzdorf

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Tom Ritzdorf. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Tom Ritzdorf. The network helps show where Tom Ritzdorf may publish in the future.

Co-authorship network of co-authors of Tom Ritzdorf

This figure shows the co-authorship network connecting the top 25 collaborators of Tom Ritzdorf. A scholar is included among the top collaborators of Tom Ritzdorf based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Tom Ritzdorf. Tom Ritzdorf is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Feature Scale Modeling for Through-Silicon-Via Packaging Applications 2009 ·ECS Meeting Abstracts ·Gregory J. Wilson, Paul R. McHugh, Tom Ritzdorf	1
2	Electric Field Effects on the Formation of Isolated Macro Porous Silicon 2008 ·ECS Transactions ·(unknown), (unknown), Tom Ritzdorf, Paul L. Bergstrom	2
3	Through silicon via copper electrodeposition for 3D integration 2008 ·Rozalia Beica, (unknown), Tom Ritzdorf	103
4	Back-End Copper Metallization for Advanced Packaging 2007 ·ECS Transactions ·(unknown), (unknown), Tom Ritzdorf, (unknown)	1
5	Challenges and Opportunities for Electrochemical Processing in Microelectronics 2007 ·ECS Transactions ·Tom Ritzdorf	2
6	Cyanide- and Thiourea-Free Electrochemical Etching of Gold for Microelectronics Applications 2007 ·Journal of The Electrochemical Society ·(unknown), Tom Ritzdorf	24
7	Back-end Copper Metallization for Advanced Packaging : Bump, RDL, and TSV 2006 ·ECS Meeting Abstracts ·(unknown), Tom Ritzdorf, (unknown)	1
8	Superconformal Electrochemical Deposition of Gold for Metallization in Microelectronic Devices 2006 ·Journal of The Electrochemical Society ·(unknown), Tom Ritzdorf	16
9	High Rate Copper Filling Within High Aspect Ratio Through Silicon Vias for 3-D Chip Stacking 2006 ·ECS Meeting Abstracts ·(unknown), (unknown), Tom Ritzdorf	7
10	Design and modeling of equipment used in electrochemical processes for microelectronics 2005 ·IBM Journal of Research and Development ·Tom Ritzdorf, Gregory J. Wilson, Paul R. McHugh, (unknown), K. M. Hanson, (unknown)	11
11	Electrical Waveform Mediated Through-Mask Deposition of Solder Bumps for Wafer Level Packaging 2004 ·Journal of The Electrochemical Society ·(unknown), Tom Ritzdorf	10
12	High rate electrodeposition of near-eutectic PbSn solders 2003 ·(unknown), (unknown), Tom Ritzdorf	1
13	Electrodeposition of ternary near-eutectic SnAgCu solders with an alkaline bath 2003 ·(unknown), Tom Ritzdorf	2
14	Electrodeposition of Near-Eutectic SnAg Solders for Wafer-Level Packaging 2003 ·Journal of The Electrochemical Society ·(unknown), Tom Ritzdorf	29
15	Comparative investigation of plating conditions on self-annealing of electrochemically deposited copper films 2003 ·Tom Ritzdorf, (unknown), (unknown), (unknown)	2
16	Electrochemically Deposited Tin-Silver-Copper Ternary Solder Alloys 2002 ·Journal of The Electrochemical Society ·(unknown), Tom Ritzdorf	26
17	Two- and three-dimensional numerical modeling of copper electroplating for advanced ULSI metallization 2000 ·Solid-State Electronics ·G. Ritter, Paul R. McHugh, Gregory J. Wilson, Tom Ritzdorf	22
18	Seed layer dependence of room-temperature recrystallization in electroplated copper films 1999 ·Journal of Applied Physics ·Kazuyoshi Ueno, Tom Ritzdorf, (unknown)	50
19	Electroplated Damascene Copper: Process Influences on Recrystallization and Texture 1999 ·MRS Proceedings ·M. E. Gross, R. Drese, C. Lingk, W. L. Brown, K. Evans‐Lutterodt, D. Barr, (unknown), Tom Ritzdorf, James Turner, L. J. Graham	7
20	Electroplated Damascene Copper: Process Influences on Recrystallization and Texture 1999 ·MRS Proceedings ·M. E. Gross, R. Drese, C. Lingk, W. L. Brown, K. Evans‐Lutterodt, D. Barr, (unknown), Tom Ritzdorf, James Turner, L. J. Graham	3

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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