Cheng–En Ho
Impact in
- General Materials Science top 0.2%
- Metallurgical and Alloy Processes
- Mechanical Engineering top 0.5%
- Intermetallics and Advanced Alloy Properties
- Advanced Welding Techniques Analysis
Papers in
-
- Electronic Packaging and Soldering Technologies 82
- 3D IC and TSV technologies 59
- Electrodeposition and Electroless Coatings 23
-
- Intermetallics and Advanced Alloy Properties 28
- Advanced Welding Techniques Analysis 19
- Co-authors
- C. R. Kao (28 shared papers)Y. L. Lin (6 shared papers)Shenghao Yang (2 shared papers)W. T. Chen (4 shared papers)Rung‐Ywan Tsai (1 shared paper)Wei Wu (10 shared papers)Pei-Tzu Lee (21 shared papers)Cheng‐Hsien Yang (11 shared papers)
- Journals
- Journal of Electronic Materials (24 papers)Surface and Coatings Technology (19 papers)Thin Solid Films (11 papers)Journal of Materials Research and Technology (6 papers)Journal of Alloys and Compounds (4 papers)
- Partner nations
- TaiwanUnited StatesChina
In The Last Decade
Cheng–En Ho
113 papers receiving 3.0k citations
Peers
Comparison fields: 5 of 50
- General Materials Science 234
- Mechanical Engineering 2.0k
- Electrical and Electronic Engineering 2.9k
- Electronic, Optical and Magnetic Materials 461
- Aerospace Engineering 218
Countries citing papers authored by Cheng–En Ho
This map shows the geographic impact of Cheng–En Ho's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Cheng–En Ho with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Cheng–En Ho more than expected).
Fields of papers citing papers by Cheng–En Ho
This network shows the impact of papers produced by Cheng–En Ho. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Cheng–En Ho. The network helps show where Cheng–En Ho may publish in the future.
Co-authors
The 25 scholars most cited alongside Cheng–En Ho, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 115 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2002 | 284 | |
| 2 | 2006 | 244 | |
| 3 | 2002 | 184 | |
| 4 | 2006 | 122 | |
| 5 | 2000 | 106 | |
| 6 | 2002 | 98 | |
| 7 | 2005 | 97 | |
| 8 | 2006 | 82 | |
| 9 | 2002 | 75 | |
| 10 | 2009 | 75 | |
| 11 | 1999 | 70 | |
| 12 | 2010 | 61 | |
| 13 | 2002 | 60 | |
| 14 | 2001 | 56 | |
| 15 | 2000 | 54 | |
| 16 | 2001 | 53 | |
| 17 | 2001 | 52 | |
| 18 | 2016 | 43 | |
| 19 | 2016 | 43 | |
| 20 | 2001 | 42 |
About Cheng–En Ho
Cheng–En Ho is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Electronic, Optical and Magnetic Materials, Aerospace Engineering and Atomic and Molecular Physics, and Optics, having authored 115 papers that have together received 3.1k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (82 papers), 3D IC and TSV technologies (59 papers), Copper Interconnects and Reliability (38 papers), Intermetallics and Advanced Alloy Properties (28 papers), Electrodeposition and Electroless Coatings (23 papers), Advanced Welding Techniques Analysis (19 papers), Nanofabrication and Lithography Techniques (9 papers) and Metallurgical and Alloy Processes (9 papers). The work is most often cited by research in General Materials Science (234 citations), Mechanical Engineering (2.0k citations), Electrical and Electronic Engineering (2.9k citations), Electronic, Optical and Magnetic Materials (461 citations) and Aerospace Engineering (218 citations). Cheng–En Ho has collaborated with scholars based in Taiwan, United States and China. Frequent co-authors include C. R. Kao, Y. L. Lin, Shenghao Yang, W. T. Chen, Rung‐Ywan Tsai, Wei Wu, Pei-Tzu Lee, Cheng‐Hsien Yang, Shun‐Chung Yang and Gan Luo. Their work appears in journals such as Journal of Electronic Materials, Surface and Coatings Technology, Thin Solid Films, Journal of Materials Research and Technology and Journal of Alloys and Compounds.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.