Cheng–En Ho

3.6k total citations
115 papers, 3.1k citations indexed

About

Cheng–En Ho is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Cheng–En Ho has authored 115 papers receiving a total of 3.1k indexed citations (citations by other indexed papers that have themselves been cited), including 97 papers in Electrical and Electronic Engineering, 45 papers in Mechanical Engineering and 38 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Cheng–En Ho's work include Electronic Packaging and Soldering Technologies (82 papers), 3D IC and TSV technologies (59 papers) and Copper Interconnects and Reliability (38 papers). Cheng–En Ho is often cited by papers focused on Electronic Packaging and Soldering Technologies (82 papers), 3D IC and TSV technologies (59 papers) and Copper Interconnects and Reliability (38 papers). Cheng–En Ho collaborates with scholars based in Taiwan, United States and China. Cheng–En Ho's co-authors include C. R. Kao, Y. L. Lin, Shenghao Yang, W. T. Chen, Rung‐Ywan Tsai, Wei Wu, Pei-Tzu Lee, Cheng‐Hsien Yang, Shun‐Chung Yang and Gan Luo and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Chemistry of Materials.

In The Last Decade

Cheng–En Ho

112 papers receiving 3.0k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Cheng–En Ho Taiwan	29	2.9k	1.9k	457	233	229	115	3.1k
Ping Wu China	22	987 0.3×	865 0.4×	233 0.5×	67 0.3×	612 2.7×	79	1.6k
Kil-Won Moon United States	14	868 0.3×	851 0.4×	124 0.3×	108 0.5×	224 1.0×	32	1.3k
Yee‐Wen Yen Taiwan	22	984 0.3×	825 0.4×	133 0.3×	132 0.6×	246 1.1×	106	1.3k
S. K. Kang United States	23	1.5k 0.5×	821 0.4×	111 0.2×	102 0.4×	181 0.8×	57	1.6k
Luhua Xu Singapore	19	953 0.3×	601 0.3×	191 0.4×	36 0.2×	349 1.5×	44	1.3k
Fernando José Gomes Landgraf Brazil	29	432 0.1×	1.6k 0.8×	2.0k 4.4×	85 0.4×	563 2.5×	137	2.4k
J. Pstruś Poland	25	1.1k 0.4×	1.2k 0.6×	78 0.2×	429 1.8×	442 1.9×	81	1.7k
Jieshi Chen China	26	583 0.2×	1.2k 0.6×	115 0.3×	55 0.2×	623 2.7×	104	1.8k
Paul Lauro United States	19	1.2k 0.4×	490 0.3×	169 0.4×	39 0.2×	184 0.8×	36	1.4k
Maureen Williams United States	21	584 0.2×	1.6k 0.8×	135 0.3×	45 0.2×	448 2.0×	52	2.0k

Countries citing papers authored by Cheng–En Ho

Since Specialization

Citations

This map shows the geographic impact of Cheng–En Ho's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Cheng–En Ho with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Cheng–En Ho more than expected).

Fields of papers citing papers by Cheng–En Ho

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Cheng–En Ho. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Cheng–En Ho. The network helps show where Cheng–En Ho may publish in the future.

Co-authorship network of co-authors of Cheng–En Ho

This figure shows the co-authorship network connecting the top 25 collaborators of Cheng–En Ho. A scholar is included among the top collaborators of Cheng–En Ho based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Cheng–En Ho. Cheng–En Ho is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Yang, Z. C., et al.. (2025). Pinhole formation and its mitigation for Cu electrodeposition on the Ajinomoto build-up film (ABF) with different surface roughnesses. Journal of Materials Research and Technology. 36. 193–202. 1 indexed citations

Wu, Yiping, et al.. (2025). Ex-situ observation of microstructure evolution and electrical resistance transition in micro joints under electron current stressing. Surface and Coatings Technology. 505. 132124–132124.

Lee, Pei-Tzu, et al.. (2025). In-situ synchrotron X-ray study on microstructure and stress evolutions of electroplated copper upon self-annealing. Journal of the Taiwan Institute of Chemical Engineers. 174. 106194–106194.

Chang, Yu‐Hsun, et al.. (2025). Pronounced effect of surface coating on the antenna characteristics at mmWave frequency band. Surface and Coatings Technology. 497. 131801–131801. 2 indexed citations

Chang, Yu‐Hsun, et al.. (2025). Enhancing the high-frequency signal performance through surface morphological modification of Cu interconnects. Measurement. 250. 117071–117071. 3 indexed citations

Chang, Yu-Hsun, et al.. (2024). Through glass via (TGV) copper metallization and its microstructure modification. Journal of Materials Research and Technology. 31. 1008–1016. 11 indexed citations

Huang, Ziyu, Yu‐De Chu, Cheng–En Ho, Yu-An Shen, & Chih‐Ming Chen. (2024). Interfacial reaction and thermomigration of copper/indium joints. Journal of Materials Research and Technology. 34. 2051–2059. 4 indexed citations

Tsai, Kun-Lin, Chih‐Ming Chen, & Cheng–En Ho. (2024). Synergistic effects of additives on impurity residues in high-speed copper electrodeposition and voiding propensity in solder joints. Journal of the Taiwan Institute of Chemical Engineers. 156. 105391–105391. 11 indexed citations

Lee, Pei-Tzu, et al.. (2023). Electromigration-induced remarkable intermetallic compound (IMC) formation in micro joints and its prevention. Journal of Materials Research and Technology. 24. 3889–3900. 4 indexed citations

10.

Lee, Cheng‐Yu, et al.. (2023). High-frequency signal transmission in a coplanar waveguide structure with different surface finishes. Thin Solid Films. 784. 140079–140079. 3 indexed citations

11.

Yang, Cheng‐Hsien, Yu‐Wei Lee, Cheng‐Yu Lee, Pei-Tzu Lee, & Cheng–En Ho. (2020). Self-Annealing Behavior of Electroplated Cu with Different Brightener Concentrations. Journal of The Electrochemical Society. 167(8). 82514–82514. 27 indexed citations

12.

Yang, Cheng‐Hsien, Yu‐Wei Lee, Cheng‐Yu Lee, Chih‐Hao Chang, & Cheng–En Ho. (2019). Self-Annealing Behavior of Electroplated Cu in Blind-Hole Structures. Journal of The Electrochemical Society. 166(13). D683–D688. 7 indexed citations

13.

Yang, Cheng‐Hsien, et al.. (2019). Nanoindentation Study of Single-Crystalline and (101)-Oriented Nanotwinned Cu. ECS Journal of Solid State Science and Technology. 8(6). P363–P369. 3 indexed citations

14.

Lee, Pei-Tzu, et al.. (2018). High-Speed Cu Electrodeposition and Reliability of Cu Pillar Bumps in High-Temperature Storage. Journal of The Electrochemical Society. 165(13). D647–D653. 14 indexed citations

15.

Ho, Cheng–En, et al.. (2012). Gold- and Palladium-Induced Embrittlement Phenomenon in Microbumps with Au/Pd(P)/Ni(P) Metallization Pads. Journal of Electronic Materials. 41(12). 3266–3275. 15 indexed citations

16.

Ho, Cheng–En, et al.. (2008). Effect of strain on whisker growth in matte tin. Soldering and Surface Mount Technology. 20(1). 4–7. 4 indexed citations

17.

Ho, Cheng–En, Ching‐Chang Chieng, Ming‐Hung Chen, & Fan‐Gang Tseng. (2008). Micro-Stamp Systems for Batch-Filling, Parallel-Spotting, and Continuously Printing of Multiple Biosample Fluids. JALA Journal of the Association for Laboratory Automation. 13(4). 187–197. 4 indexed citations

18.

Ho, Cheng–En, et al.. (2004). An Chip-based Instant Protein Micro Array Formation and Detection System. TechConnect Briefs. 1(2004). 39–42. 1 indexed citations

19.

Ho, Cheng–En, et al.. (2003). Chemical Reaction in Solder Joints of Microelectronic Packages. Journal of The Chinese Institute of Chemical Engineers. 34(4). 387–391. 7 indexed citations

20.

Lin, Shih‐Chang, Cheng–En Ho, Fan‐Gang Tseng, et al.. (2003). A novel protein micro stamper with back-filling reservoir for simultaneous immobilization of large protein arrays. 27. 299–302. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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