Albert T. Wu

1.6k total citations
88 papers, 1.3k citations indexed

About

Albert T. Wu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Albert T. Wu has authored 88 papers receiving a total of 1.3k indexed citations (citations by other indexed papers that have themselves been cited), including 78 papers in Electrical and Electronic Engineering, 34 papers in Mechanical Engineering and 28 papers in Materials Chemistry. Recurrent topics in Albert T. Wu's work include Electronic Packaging and Soldering Technologies (62 papers), 3D IC and TSV technologies (36 papers) and Copper Interconnects and Reliability (20 papers). Albert T. Wu is often cited by papers focused on Electronic Packaging and Soldering Technologies (62 papers), 3D IC and TSV technologies (36 papers) and Copper Interconnects and Reliability (20 papers). Albert T. Wu collaborates with scholars based in Taiwan, United States and Italy. Albert T. Wu's co-authors include K. N. Tu, Kwang‐Lung Lin, Hsin‐Yi Lee, Chien‐Neng Liao, C. R. Kao, Chih Chen, Chun‐Hsien Wang, Hao Chen, Nobumichi Tamura and Yi‐Han Liao and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Acta Materialia.

In The Last Decade

Albert T. Wu

86 papers receiving 1.3k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Albert T. Wu Taiwan 22 998 538 408 282 126 88 1.3k
Raza Moshwan Australia 23 975 1.0× 1.5k 2.7× 416 1.0× 157 0.6× 336 2.7× 32 1.9k
Shaoping Chen China 20 372 0.4× 829 1.5× 262 0.6× 136 0.5× 115 0.9× 81 1.1k
Hezhang Li China 21 538 0.5× 1.1k 2.1× 225 0.6× 282 1.0× 198 1.6× 73 1.4k
Chin C. Lee United States 21 975 1.0× 245 0.5× 450 1.1× 113 0.4× 64 0.5× 94 1.3k
N. Peranio Germany 18 400 0.4× 1.4k 2.5× 635 1.6× 221 0.8× 217 1.7× 38 1.7k
Song Zhu United States 17 428 0.4× 1.4k 2.7× 251 0.6× 366 1.3× 449 3.6× 29 1.6k
Christelle Navone France 18 495 0.5× 557 1.0× 208 0.5× 232 0.8× 101 0.8× 37 995
Eun‐Ae Choi South Korea 18 443 0.4× 735 1.4× 375 0.9× 118 0.4× 35 0.3× 63 1.1k
Satoshi Sodeoka Japan 17 303 0.3× 1.5k 2.8× 252 0.6× 585 2.1× 210 1.7× 58 1.7k
Jikun Chen China 18 541 0.5× 1.2k 2.2× 230 0.6× 196 0.7× 353 2.8× 37 1.6k

Countries citing papers authored by Albert T. Wu

Since Specialization
Citations

This map shows the geographic impact of Albert T. Wu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Albert T. Wu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Albert T. Wu more than expected).

Fields of papers citing papers by Albert T. Wu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Albert T. Wu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Albert T. Wu. The network helps show where Albert T. Wu may publish in the future.

Co-authorship network of co-authors of Albert T. Wu

This figure shows the co-authorship network connecting the top 25 collaborators of Albert T. Wu. A scholar is included among the top collaborators of Albert T. Wu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Albert T. Wu. Albert T. Wu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Li, Kelvin, et al.. (2025). Sintering of Cu nanoparticles for optimized particle size and enhanced interconnect performance. Journal of the Taiwan Institute of Chemical Engineers. 173. 106185–106185. 1 indexed citations
2.
Hsu, Ya-Hui, Shencheng Pan, Yi‐Cheng Su, et al.. (2025). Temperature dependence on ripening and spalling of interfacial (Cu,Ni)6Sn5 compound at SnAgCu(Ni)/Ni(P) interface. Intermetallics. 186. 108965–108965.
3.
Tatsumi, Hiroaki, et al.. (2025). Interfacial reaction and IMC growth kinetics at the Bi2Te3/Ag interface during isothermal aging. Intermetallics. 179. 108686–108686. 2 indexed citations
4.
Wu, Albert T., et al.. (2024). Cu Nanoparticle Sintering by Electrical Current. 107–108. 1 indexed citations
5.
Cheng, Kai‐Wen, et al.. (2024). Preventing degradation of thermoelectric property after aging for Bi2Te3 thin film module. Materials Chemistry and Physics. 318. 129208–129208. 2 indexed citations
6.
Lin, Yan‐Gu, et al.. (2024). Enhancement of Cu-to-Cu bonding property by residual stress in Cu substrate. Materials Characterization. 214. 114107–114107. 2 indexed citations
7.
Lin, Jing-Chie, et al.. (2023). The effect of microstructure for Ni-based surface finishing thin film on corrosion behavior. Surface and Coatings Technology. 456. 129252–129252. 1 indexed citations
8.
Wu, Albert T., et al.. (2023). Electrical current enhanced sintering without Joule heating for Cu nanoparticles at room temperature. Materialia. 30. 101821–101821. 3 indexed citations
9.
Wu, Albert T., et al.. (2023). Hybrid SnBi/SAC Low-Temperature Solder Bump.
10.
Wang, Chun‐Hsien, et al.. (2020). Joint properties enhancement for PbTe thermoelectric materials by addition of diffusion barrier. Materials Chemistry and Physics. 246. 122848–122848. 24 indexed citations
11.
Zhang, Zheng, Chuantong Chen, Albert T. Wu, & Katsuaki Suganuma. (2019). Improvement of high-temperature thermal aging reliability of Ag–Au joints by modifying Ni/Au surface finish. Journal of Materials Science Materials in Electronics. 30(22). 20292–20301. 17 indexed citations
12.
Hsu, Hui-Chu, et al.. (2015). Evolution of the Intermetallic Compounds in Ni/Sn-2.5Ag/Ni Microbumps for Three-Dimensional Integrated Circuits. Journal of Electronic Materials. 44(10). 3888–3895. 16 indexed citations
13.
Liao, Yi‐Han, Chien-Lung Liang, Kwang‐Lung Lin, & Albert T. Wu. (2015). High dislocation density of tin induced by electric current. AIP Advances. 5(12). 31 indexed citations
14.
Wu, Albert T., et al.. (2012). Electrorecrystallization of Metal Alloy. Journal of Alloys and Compounds. 549. 190–194. 17 indexed citations
15.
Wu, Albert T., et al.. (2011). Nucleation and propagation of voids in microbumps for 3 dimensional integrated circuits. Applied Physics Letters. 99(25). 12 indexed citations
16.
Wu, Albert T., Chin-Li Kao, Meng-Kai Shih, et al.. (2009). In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays. Journal of Electronic Materials. 38(11). 2308–2313. 9 indexed citations
17.
Wu, Albert T., et al.. (2007). Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads. Journal of Electronic Materials. 36(7). 753–759. 21 indexed citations
18.
Wu, Albert T., J. R. Lloyd, Nobumichi Tamura, & K. N. Tu. (2005). Microstructure evolution of tin under electromigration studied by synchrotron X-Ray \nmicro-diffraction. eScholarship (California Digital Library). 1 indexed citations
19.
Suh, Jong-ook, et al.. (2005). Mechanism and Prevention of Spontaneous Tin Whisker Growth. MATERIALS TRANSACTIONS. 46(11). 2300–2308. 35 indexed citations
20.
Wu, Albert T., Nobumichi Tamura, J. R. Lloyd, C. R. Kao, & K. N. Tu. (2005). Synchrotron X-ray Micro-diffraction Analysis on Microstructure Evolution in Sn under Electromigration. MRS Proceedings. 863. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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