Albert T. Wu
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
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- Copper Interconnects and Reliability
Papers in
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- Electronic Packaging and Soldering Technologies 65
- 3D IC and TSV technologies 36
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- Intermetallics and Advanced Alloy Properties 17
- Advanced Welding Techniques Analysis 8
- Co-authors
- K. N. Tu (6 shared papers)Kwang‐Lung Lin (5 shared papers)Hsin‐Yi Lee (13 shared papers)Chien‐Neng Liao (1 shared paper)C. R. Kao (5 shared papers)Chun‐Hsien Wang (4 shared papers)Chih Chen (2 shared papers)Hao Chen (5 shared papers)
- Journals
- Journal of Electronic Materials (20 papers)Journal of Alloys and Compounds (7 papers)Applied Physics Letters (6 papers)Applied Surface Science (4 papers)Materials Chemistry and Physics (4 papers)
- Partner nations
- TaiwanUnited StatesItaly
In The Last Decade
Albert T. Wu
87 papers receiving 1.3k citations
Peers
Comparison fields: 5 of 51
- Electrical and Electronic Engineering 1.0k
- Electronic, Optical and Magnetic Materials 284
- Materials Chemistry 545
- Mechanical Engineering 412
- General Materials Science 31
Countries citing papers authored by Albert T. Wu
This map shows the geographic impact of Albert T. Wu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Albert T. Wu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Albert T. Wu more than expected).
Fields of papers citing papers by Albert T. Wu
This network shows the impact of papers produced by Albert T. Wu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Albert T. Wu. The network helps show where Albert T. Wu may publish in the future.
Co-authors
The 25 scholars most cited alongside Albert T. Wu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 92 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2011 | 86 | |
| 2 | 2006 | 68 | |
| 3 | 2011 | 63 | |
| 4 | 2005 | 61 | |
| 5 | 2004 | 51 | |
| 6 | 2020 | 50 | |
| 7 | 2020 | 46 | |
| 8 | 2016 | 38 | |
| 9 | 2017 | 38 | |
| 10 | 2005 | 36 | |
| 11 | 2015 | 35 | |
| 12 | 2018 | 33 | |
| 13 | 2017 | 32 | |
| 14 | 2012 | 31 | |
| 15 | 2021 | 28 | |
| 16 | 2020 | 27 | |
| 17 | 2014 | 26 | |
| 18 | 2012 | 25 | |
| 19 | 2016 | 22 | |
| 20 | 2008 | 22 |
About Albert T. Wu
Albert T. Wu is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Materials Chemistry, Electronic, Optical and Magnetic Materials and Mechanics of Materials, having authored 92 papers that have together received 1.4k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (65 papers), 3D IC and TSV technologies (36 papers), Copper Interconnects and Reliability (20 papers), Intermetallics and Advanced Alloy Properties (17 papers), Advanced Thermoelectric Materials and Devices (14 papers), Advanced Welding Techniques Analysis (8 papers), Thermal properties of materials (8 papers) and Thermal Radiation and Cooling Technologies (7 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.0k citations), Electronic, Optical and Magnetic Materials (284 citations), Materials Chemistry (545 citations), Mechanical Engineering (412 citations) and General Materials Science (31 citations). Albert T. Wu has collaborated with scholars based in Taiwan, United States and Italy. Frequent co-authors include K. N. Tu, Kwang‐Lung Lin, Hsin‐Yi Lee, Chien‐Neng Liao, C. R. Kao, Chun‐Hsien Wang, Chih Chen, Hao Chen, Ching‐Shun Ku and Chien-Lung Liang. Their work appears in journals such as Journal of Electronic Materials, Journal of Alloys and Compounds, Applied Physics Letters, Applied Surface Science and Materials Chemistry and Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.