C.-Y. Li

627 total citations
44 papers, 487 citations indexed

About

C.-Y. Li is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Mechanical Engineering. According to data from OpenAlex, C.-Y. Li has authored 44 papers receiving a total of 487 indexed citations (citations by other indexed papers that have themselves been cited), including 32 papers in Electrical and Electronic Engineering, 17 papers in Electronic, Optical and Magnetic Materials and 14 papers in Mechanical Engineering. Recurrent topics in C.-Y. Li's work include Electronic Packaging and Soldering Technologies (26 papers), Copper Interconnects and Reliability (17 papers) and 3D IC and TSV technologies (13 papers). C.-Y. Li is often cited by papers focused on Electronic Packaging and Soldering Technologies (26 papers), Copper Interconnects and Reliability (17 papers) and 3D IC and TSV technologies (13 papers). C.-Y. Li collaborates with scholars based in United States, Australia and Germany. C.-Y. Li's co-authors include M. A. Korhonen, P. Bo rgesen, Peter Børgesen, Tia‐Marje Korhonen, Sukwon Hong, Peng Su, Timothy D. Sullivan, D. D. Brown, J. W. Mayer and Sven Rzepka and has published in prestigious journals such as Applied Physics Letters, Scripta Materialia and Thin Solid Films.

In The Last Decade

C.-Y. Li

43 papers receiving 459 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
C.-Y. Li United States	14	401	198	187	98	64	44	487
P. A. Totta United States	11	660 1.6×	164 0.8×	319 1.7×	78 0.8×	74 1.2×	22	761
H. Berg United States	12	381 1.0×	40 0.2×	140 0.7×	114 1.2×	79 1.2×	28	500
D. P. Tracy United States	8	287 0.7×	353 1.8×	41 0.2×	230 2.3×	115 1.8×	14	436
C. Y. Liu United States	7	355 0.9×	178 0.9×	151 0.8×	27 0.3×	27 0.4×	10	398
Ramnath Venkatraman United States	6	183 0.5×	243 1.2×	102 0.5×	336 3.4×	185 2.9×	12	470
Jing‐Cheng Lin Taiwan	10	308 0.8×	171 0.9×	34 0.2×	177 1.8×	102 1.6×	17	402
G. Matijasevic United States	10	465 1.2×	28 0.1×	198 1.1×	77 0.8×	51 0.8×	27	539
M. J. Bozack United States	8	335 0.8×	76 0.4×	61 0.3×	34 0.3×	152 2.4×	15	431
K. N. Tu United States	9	813 2.0×	301 1.5×	398 2.1×	47 0.5×	67 1.0×	12	848
S.-M. Kuo United States	12	459 1.1×	135 0.7×	360 1.9×	103 1.1×	209 3.3×	16	756

Countries citing papers authored by C.-Y. Li

Since Specialization

Citations

This map shows the geographic impact of C.-Y. Li's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C.-Y. Li with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C.-Y. Li more than expected).

Fields of papers citing papers by C.-Y. Li

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C.-Y. Li. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C.-Y. Li. The network helps show where C.-Y. Li may publish in the future.

Co-authorship network of co-authors of C.-Y. Li

This figure shows the co-authorship network connecting the top 25 collaborators of C.-Y. Li. A scholar is included among the top collaborators of C.-Y. Li based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C.-Y. Li. C.-Y. Li is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Li, C.-Y., et al.. (2025). An Extended VIKOR-Based Marine Equipment Reliability Assessment Method with Picture Fuzzy Information. Journal of Marine Science and Engineering. 13(8). 1525–1525.

Su, Peng, Tia‐Marje Korhonen, M. A. Korhonen, & C.-Y. Li. (2002). Intermetallic phase formation and growth kinetics at the interface between molten solder and Ni-containing under bump metallization. 1712–1718. 5 indexed citations

Korhonen, Tia‐Marje, Peng Su, Sukwon Hong, M. A. Korhonen, & C.-Y. Li. (2000). Reactions of lead-free solders with CuNi metallizations. Journal of Electronic Materials. 29(10). 1194–1199. 57 indexed citations

Rzepka, Sven, M. A. Korhonen, E. Meusel, & C.-Y. Li. (1998). The Effect of Underfill and Underfill Delamination on the Thermal Stress in Flip-Chip Solder Joints. Journal of Electronic Packaging. 120(4). 342–348. 40 indexed citations

Korhonen, Tia‐Marje, et al.. (1997). Under Bump Metallization Development For High Sn Solders. MRS Proceedings. 505. 3 indexed citations

Korhonen, M. A., Tao Liu, D. D. Brown, & C.-Y. Li. (1995). Stress-Voiding and Electromigration in Multilevel Interconnects. MRS Proceedings. 391. 15 indexed citations

Conway, H. D., Peter Børgesen, & C.-Y. Li. (1994). Elastic Analysis of Flip-Chip Solder Joints Undergoing Thermal Excursions. Journal of Electronic Packaging. 116(2). 110–115. 1 indexed citations

Brown, D. D., M. A. Korhonen, Peter Børgesen, & C.-Y. Li. (1994). Predicting and Comparing Electromigration Failure for Different Test Structures. MRS Proceedings. 338. 5 indexed citations

Børgesen, Peter, M. A. Korhonen, D. D. Brown, & C.-Y. Li. (1993). Microstructure Based Modelling of Stress Migration and Electromigration Induced Failure Distributions. MRS Proceedings. 308. 1 indexed citations

10.

Brown, D. D., M. A. Korhonen, Peter Børgesen, & C.-Y. Li. (1993). Analysis of Thermal Stress Induced Void Growth During Thermal Cycling. MRS Proceedings. 308. 1 indexed citations

11.

Børgesen, Peter, et al.. (1993). Shape of a nonaxisymmetric liquid solder drop constrained by parallel plates. IEEE Transactions on Components Hybrids and Manufacturing Technology. 16(5). 523–526. 15 indexed citations

12.

Børgesen, Peter, et al.. (1993). Material and Reliability Considerations for Anisotropically Conductive Adhesive Based Interconnects. MRS Proceedings. 323. 4 indexed citations

13.

Børgesen, Peter, C.-Y. Li, & H. D. Conway. (1993). Mechanical design considerations for area array solder joints. IEEE Transactions on Components Hybrids and Manufacturing Technology. 16(3). 272–283. 13 indexed citations

14.

Børgesen, Peter, et al.. (1993). Microstructure Based Modelling of Stress Migration and Electromigration Induced Failure Distributions. MRS Proceedings. 309. 6 indexed citations

15.

Børgesen, Peter, M. A. Korhonen, & C.-Y. Li. (1992). Prediction and Prevention of Stress Migration and Electromigration Damage in Passivated Lines. MRS Proceedings. 265(1). 27–32. 2 indexed citations

16.

Børgesen, Peter, M. A. Korhonen, D. D. Brown, & C.-Y. Li. (1992). Stress-induced voiding and electromigration. AIP conference proceedings. 263. 219–235. 12 indexed citations

17.

Børgesen, Peter, et al.. (1991). The Effect of Line Geometry on Void Growth in Thin, Narrow Aluminum Lines. MRS Proceedings. 226. 4 indexed citations

18.

Børgesen, Peter, M. A. Korhonen, Timothy D. Sullivan, D. D. Brown, & C.-Y. Li. (1991). Electromigration Damage by Current Induced Coalescence of Thermal Stress Voids. MRS Proceedings. 239. 9 indexed citations

19.

Li, C.-Y., et al.. (1987). Void formation in thin Al films. Applied Physics Letters. 51(6). 424–426. 17 indexed citations

20.

Li, C.-Y., et al.. (1987). Interfacial reaction-induced morphological instabilities in thin Al/Pt and Al/Pd films. Journal of materials research/Pratt's guide to venture capital sources. 2(5). 557–567. 18 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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