David T. Read

2.4k total citations
98 papers, 1.7k citations indexed

About

David T. Read is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering and Mechanical Engineering. According to data from OpenAlex, David T. Read has authored 98 papers receiving a total of 1.7k indexed citations (citations by other indexed papers that have themselves been cited), including 47 papers in Mechanics of Materials, 42 papers in Electrical and Electronic Engineering and 28 papers in Mechanical Engineering. Recurrent topics in David T. Read's work include Metal and Thin Film Mechanics (25 papers), Copper Interconnects and Reliability (20 papers) and Electronic Packaging and Soldering Technologies (17 papers). David T. Read is often cited by papers focused on Metal and Thin Film Mechanics (25 papers), Copper Interconnects and Reliability (20 papers) and Electronic Packaging and Soldering Technologies (17 papers). David T. Read collaborates with scholars based in United States, Egypt and South Korea. David T. Read's co-authors include J. W. Dally, Roy H. Geiss, Robert R. Keller, James W. Dally, Yi‐Wen Cheng, R. P. Reed, J. D. McColskey, Hassel Ledbetter, V. K. Tewary and Robert H. Dodds and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Acta Materialia.

In The Last Decade

David T. Read

96 papers receiving 1.6k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
David T. Read United States 24 795 649 502 455 428 98 1.7k
C. Shearwood United Kingdom 21 178 0.2× 778 1.2× 458 0.9× 828 1.8× 569 1.3× 51 1.9k
H. Fukunaga Japan 29 1.1k 1.3× 469 0.7× 697 1.4× 1.3k 2.8× 320 0.7× 273 3.3k
Fangyuan Sun China 21 238 0.3× 476 0.7× 1.0k 2.0× 491 1.1× 227 0.5× 89 1.7k
C. L. Choy Hong Kong 23 292 0.4× 955 1.5× 1.2k 2.4× 189 0.4× 789 1.8× 67 2.2k
Hyo-Sok Ahn South Korea 20 519 0.7× 193 0.3× 490 1.0× 555 1.2× 154 0.4× 80 1.2k
Qing Ma United States 18 1.6k 2.1× 744 1.1× 1.4k 2.8× 726 1.6× 505 1.2× 40 2.8k
Gang Han China 26 348 0.4× 234 0.4× 1.2k 2.4× 1.3k 2.8× 134 0.3× 115 2.2k
Ken Mingard United Kingdom 24 470 0.6× 208 0.3× 917 1.8× 1.2k 2.5× 205 0.5× 82 1.8k
Zayd C. Leseman United States 18 201 0.3× 467 0.7× 702 1.4× 197 0.4× 621 1.5× 84 1.5k
Takahiro Namazu Japan 21 424 0.5× 1.1k 1.7× 778 1.5× 507 1.1× 978 2.3× 162 2.2k

Countries citing papers authored by David T. Read

Since Specialization
Citations

This map shows the geographic impact of David T. Read's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by David T. Read with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites David T. Read more than expected).

Fields of papers citing papers by David T. Read

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by David T. Read. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by David T. Read. The network helps show where David T. Read may publish in the future.

Co-authorship network of co-authors of David T. Read

This figure shows the co-authorship network connecting the top 25 collaborators of David T. Read. A scholar is included among the top collaborators of David T. Read based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with David T. Read. David T. Read is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Liew, Li‐Anne, et al.. (2021). Microfabricated fiducial markers for digital image correlation-based micromechanical testing of LIGA Ni alloys. Engineering Research Express. 3(2). 25019–25019. 5 indexed citations
2.
Liew, Li‐Anne, David T. Read, May L. Martin, et al.. (2020). Elastic-plastic properties of mesoscale electrodeposited LIGA nickel alloy films: microscopy and mechanics. Journal of Micromechanics and Microengineering. 31(1). 15002–15002. 5 indexed citations
3.
Martin, May L., et al.. (2020). Dominant factors for fracture at the micro-scale in electrodeposited nickel alloys. Sensors and Actuators A Physical. 314. 112239–112239. 5 indexed citations
4.
Gerstle, Walter, Stewart Silling, David T. Read, V. K. Tewary, & Richard B. Lehoucq. (2008). Peridynamic Simulation of Electromigration. Cmc-computers Materials & Continua. 8(2). 75–92. 70 indexed citations
5.
Geiss, Roy H. & David T. Read. (2008). Thermal Cycling of 300 nm Buried Damascene Copper Interconnect Lines by Joule Heating. TechConnect Briefs. 1(2008). 218–221. 1 indexed citations
6.
Allen, Richard A., et al.. (2008). A Standard Method for Measuring Wafer Bond Strength for MEMS Applications. ECS Transactions. 16(8). 449–455. 1 indexed citations
7.
Geiss, Roy H., David T. Read, Alexana Roshko, Kris A. Bertness, & Robert R. Keller. (2005). Applications of EBSD to the Study of Localized Deformation. Microscopy and Microanalysis. 11(S02). 1 indexed citations
8.
Read, David T.. (2004). Atomistic Simulation of Modulus Deficit in Thin Film Copper Electrodeposits. APS March Meeting Abstracts. 2004. 1 indexed citations
9.
Tewary, V. K. & David T. Read. (2004). Integrated Green's Function Molecular Dynamics Method for Multiscale Modeling of Nanostructures: Application to Au Nanoisland in Cu. Computer Modeling in Engineering & Sciences. 6(4). 359–372. 5 indexed citations
10.
Read, David T., Yi‐Wen Cheng, & Roy H. Geiss. (2004). Morphology, microstructure, and mechanical properties of a copper electrodeposit. Microelectronic Engineering. 75(1). 63–70. 82 indexed citations
11.
Read, David T.. (1998). Young's modulus of thin films by speckle interferometry. Measurement Science and Technology. 9(4). 676–685. 47 indexed citations
12.
Read, David T.. (1996). Tension-Tension Fatigue of Copper Thin Films. 175–180. 1 indexed citations
13.
Read, David T. & J. W. Dally. (1996). Theory of electron beam moire. Journal of Research of the National Institute of Standards and Technology. 101(1). 47–47. 46 indexed citations
14.
Read, David T., et al.. (1996). Measurements of fracture strength and Young's modulus of surface-micromachined polysilicon. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 2880. 56–56. 23 indexed citations
15.
Read, David T., et al.. (1987). Failure analysis of an amine-absorber pressure vessel.. Materials performance. 26(8). 18–24. 19 indexed citations
16.
Read, David T., et al.. (1987). Effect of Prior Deformation on the 76-K Fracture Toughness of AISI 304L and AWS 308L Stainless Steels. Journal of Engineering Materials and Technology. 109(2). 151–156. 1 indexed citations
17.
Carpenter, William C. & David T. Read. (1985). Estimation of critical values of the potential energy release rate. International Journal of Fracture. 29(2). R23–R26. 1 indexed citations
18.
Read, David T.. (1978). Metallurgical effects in niobium-titanium alloys. Cryogenics. 18(10). 579–584. 17 indexed citations
19.
Read, David T. & R. P. Reed. (1977). Effects of specimen thickness on fracture toughness of an aluminum alloy. International Journal of Fracture. 13(2). 201–213. 10 indexed citations
20.
Tobler, R. L. & David T. Read. (1976). Fatigue Resistance of a Uniaxial S-Glass/Epoxy Composite at Room and Liquid Helium Temperatures. Journal of Composite Materials. 10(1). 32–43. 10 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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