P. Bo rgesen
- Electrical and Electronic Engineering top 5%
- Electronic, Optical and Magnetic Materials top 5%
- Mechanics of Materials top 5%
- Materials Chemistry
- Computational Mechanics top 10%
- Topics
- Ion-surface interactions and analysis (8 papers)Copper Interconnects and Reliability (7 papers)Electronic Packaging and Soldering Technologies (5 papers)
- Cited by
- Electronic, Optical and Magnetic MaterialsElectrical and Electronic EngineeringMechanics of Materials
- Partner nations
- United StatesDenmarkGermany
In The Last Decade
P. Bo rgesen
18 papers receiving 960 citations
Hit Papers
Peers
Comparison fields: 5 of 36
- Electrical and Electronic Engineering 819
- Electronic, Optical and Magnetic Materials 765
- Mechanics of Materials 228
- Materials Chemistry 161
- Computational Mechanics 127
Countries citing papers authored by P. Bo rgesen
This map shows the geographic impact of P. Bo rgesen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by P. Bo rgesen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites P. Bo rgesen more than expected).
Fields of papers citing papers by P. Bo rgesen
This network shows the impact of papers produced by P. Bo rgesen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by P. Bo rgesen. The network helps show where P. Bo rgesen may publish in the future.
Co-authorship network of co-authors of P. Bo rgesen
This figure shows the co-authorship network connecting the top 25 collaborators of P. Bo rgesen. A scholar is included among the top collaborators of P. Bo rgesen based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with P. Bo rgesen. P. Bo rgesen is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | Stress evolution due to electromigration in confined metal linesbreakdown → | 583 |
| 2 | 90 | |
| 3 | 55 | |
| 4 | 13 | |
| 5 | 5 | |
| 6 | 46 | |
| 7 | 5 | |
| 8 | 3 | |
| 9 | 4 | |
| 10 | 40 | |
| 11 | 53 | |
| 12 | 6 | |
| 13 | 11 | |
| 14 | 4 | |
| 15 | 6 | |
| 16 | 36 | |
| 17 | 12 | |
| 18 | 35 |
About P. Bo rgesen
P. Bo rgesen is a scholar working on Radiation, Computational Mechanics and Electronic, Optical and Magnetic Materials, having authored 18 papers that have together received 1.0k indexed citations. Recurring topics across this work include Ion-surface interactions and analysis (8 papers), Copper Interconnects and Reliability (7 papers) and Electronic Packaging and Soldering Technologies (5 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (765 citations), Electrical and Electronic Engineering (819 citations) and Mechanics of Materials (228 citations). P. Bo rgesen has collaborated with scholars based in United States, Denmark and Germany. Frequent co-authors include M. A. Korhonen, K. N. Tu, Che‐Yu Li, C.-Y. Li, D. A. Lilienfeld, D. D. Brown, H. H. Johnson, W. Möller, Timothy D. Sullivan and W. R. LaFontaine. Their work appears in journals such as Physical review. B, Condensed matter, Applied Physics Letters and Journal of Applied Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.